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PDF ECN30204 Data sheet ( Hoja de datos )
| Número de pieza | ECN30204 | |
| Descripción | 3-Phase BLDC Motor Driver IC | |
| Fabricantes | Hitachi | |
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<ECN30204 Product Specification>
3-Phase BLDC Motor Driver IC
ECN30204
P1/16
The ECN30204 is a fully integrated BLDC motor driver IC that facilitates a rapid design
process and low part count solution. The IC integrates a commutation-logic, a PWM
signal generator, IGBTs, FWDs(Free Wheeling Diodes), a charge pump, protection
circuits, etc.
The IC can drive a BLDC motor with a high voltage DC power supply (up to 450VDC)
directly rectified from AC power line (up to 230VAC) for downsizing a system and
reducing power consumption.
Description
· Integrated, Single-Chip 3-Phase BLDC Motor Driver IC.
· Integrated Charge Pump – Constant TOP Arm bias independent of motor speed.
· Integrated 3-Phase Brushless (Electronic) commutation via external Hall ICs.
· Integrated 3-Phase 6-IGBT Motor Bridge with on chip Free-Wheeling diodes.
· Pinout and Board Layout are compatible with the existing Hitachi ECN3022.
· Maximum Ratings 500VDC/1.5A.
· Latch-Up free monolithic IC built with a high voltage Dielectrically Isolated (DI) process.
· Available in 3 package types with built-in heat sink (Tab).
Functions and Features
· Vs Operating Voltage Range from 15VDC up to 450VDC.
· Simple Variable Speed Control via a single (VSP) analog input.
· PWM duty cycle generator provides the 0% to 100% speed control range.
· Tachometer – Generates the (RPM/60) (P/2) 3 Hz speed signal (FG).
· BOTTOM Arms switch at up to 20kHz via an on-chip OSC/PWM.
· On-Chip 7.5VDC regulator (CB) with the guaranteed external Min load (25mA).
· Over-Current protection is set by an external Sense Resistor (RS).
· Under-Voltage protection for TOP and BOTTOM IGBT Arms.
· All output IGBT Shut-OFF function.
PDE-30204-1
Ref. No. IC-SP-05040 R0
Free Datasheet http://www.datasheet-pdf.com/
1 page  
<ECN30204 Product Specification>
ECN30204
P5/16
Figure 2. Equivalent circuit around HU,HV,HW terminals
Figure 3. Equivalent circuit around VSP terminal
Figure 4. Equivalent circuit around FG, DM terminals
Figure 5. Equivalent circuit around RS terminal
PDE-30204-1
Ref. No. IC-SP-05040 R0
Free Datasheet http://www.datasheet-pdf.com/
5 Page 
<ECN30204 Product Specification>
ECN30204
P11/16
7. Inspection
Hundred percent inspection shall be conducted on electric characteristics.
8. Cautions
8.1 Tightening torque at 0.39 to 0.78 N-m should be applied for device to attach to heat sink.
8.2 Tab should not be soldered.
8.3 Customers are advised to follow the below cautions to protect semiconductor from electrical static
discharge (ESD).
a) IC needs to be dealt with caution to protect from damage by ESD. Material of container or any device
to carry semiconductor devices should be free from ESD, which may be caused by vibration while
transportation. To use electric-conductive container or aluminum sheet is recommended as an
effective countermeasure.
b) What touches semiconductor devices such as work platform, machine and measuring and test
equipment should be grounded.
c) Workers should be grounded connecting with high impedance around 100k to 1M while dealing
with semiconductor to avoid damaging IC by electric static discharge.
d) Friction with other materials such as a high polymer should not be caused.
e) Attention is needed so that electric potential will be kept on the same level by short circuit terminals
when PC board with mounted IC is carried and that vibration or friction might not occur.
f) Air conditioning is needed so that humidity should not drop.
8.4 Applying molding or resin coating is recommended for below mentioned pin-to-pin insulation;
1-2, 2-4, 6-7, 8-9, 9-10, 20-21, 21-22, 22-23
8.5 Protective function against short circuit (ex. load short, line-to-ground short or top/bottom arm short) is
not built in this IC. External protection needs to prevent IC breakdown.
8.6 Refer to “Precautions for Use of High-Voltage Monolithic ICs” for the other precautions and instructions
on how to deal with products.
8.7 Regardless of changes in external conditions during use, “absolute maximum ratings” should never be
exceeded in designing electronic circuits that employ products. In a case absolute maximum ratings are
exceeded, products may be damaged or destroyed. In no event shall Hitachi be liable for any failure in
products or any secondary damage resulting from use at a value exceeding the absolute maximum
ratings.
8.8 Products may experience failures due to accident or unexpected surge voltages. Accordingly, adopt safe
design features, such as redundancy or prevention of erroneous action, to avoid extensive damage in
the event of a failure.
8.9 Products are not designed, manufactured, or warranted to be suitable for use where extremely high
reliability is required (such as use in nuclear power control, aerospace and aviation, traffic equipment,
life-support-related medical equipment, fuel control equipment and various kinds of safety equipment).
Inclusion of products in such application shall be fully at the risk of customers.
Hitachi, Ltd. assumes no liability for applications assistance, customer product design, or performance.
In such cases it is advised customers to ensure circuit and/or product safety by using semiconductor
devices that assures high reliability or by means of user’s fail-safe precautions or other arrangement. (If
a semiconductor device fails, there may be cases in which the semiconductor device, wiring or wiring
pattern will emit smoke or cause a fire or in which the semiconductor device will burst.)
PDE-30204-1
Ref. No. IC-SP-05040 R0
Free Datasheet http://www.datasheet-pdf.com/
11 Page | ||
| Páginas | Total 17 Páginas | |
| PDF Descargar | [ Datasheet ECN30204.PDF ] | |
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