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PDF RClamp2451ZA Data sheet ( Hoja de datos )

Número de pieza RClamp2451ZA
Descripción 24V ESD Protection
Fabricantes Semtech 
Logotipo Semtech Logotipo



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No Preview Available ! RClamp2451ZA Hoja de datos, Descripción, Manual

PROTECTION PRODUCTS - RailClamp®
Description
RailClamp® TVS diodes are ultra low capacitance devices
designed to protect sensitive electronics from damage
or latch-up due to ESD, EFT, and EOS. They are designed
for use on high speed ports in applications such as cell
phones, notebook computers, and other portable elec-
tronics. These devices offer desirable characteristics for
board level protection including fast response time, low
operating and clamping voltage, and no device degrada-
tion.
RClamp®2451ZA is specifically designed for protection
of Near Field Communications (NFC) interfaces. It fea-
tures extremely good ESD protection characteristics in-
cluding a low typical dynamic resistance of 0.16 Ohms
(typical), low peak ESD clamping voltage, and high ESD
withstand voltage (+/-14kV contact per IEC 61000-4-2).
Low typical capacitance (0.35pF at VR=0V) means that
RClamp2451ZA will not create harmonic distortion in the
RF signal. This device is bidirectional and has a working
voltage of 24V for use on NFC resonator circuits without
signal clipping.
RClamp2451ZA is in a 2-pin SLP0603P2X3F package
measuring 0.6 x 0.3 mm with a nominal height of
0.25mm. Leads are finished with lead-free NiAu. The
combination of working voltage, low dynamic resis-
tance, and low capacitance makes this device ideal for
use on NFC antenna ciruits, RF signal lines, and FM
antennas in portable devices.
RClamp2451ZA
Ultra Small RailClamp®
1-Line, 24V ESD Protection
Features
High ESD withstand Voltage: +/-14kV (Contact) and
+/- 18kV (Air) per IEC 61000-4-2
Able to withstand over 1000 ESD strikes per
IEC 61000-4-2 Level 4
Ultra-small 0201 package
Protects one high speed data line
Working voltage: +/- 24V
Low capacitance: 0.35pF typical
Low dynamic resistance: 0.16 Ohms (Typ)
Low ESD clamping voltage
Solid-state silicon-avalanche technology
Mechanical Characteristics
SLP0603P2X3F Package
Pb-Free, Halogen Free, RoHS/WEEE Compliant
Nominal Dimensions: 0.6 x 0.3 x 0.25 mm
Lead Finish: NiAu
Marking: Marking Code
Packaging: Tape and Reel
Applications
Near Field Communication (NFC) lines
RF signal lines
FM Antenna
Nominal Dimensions
0.600
0.220
0.300
0.355 BSC
0.160
0.250
Nominal Dimensions (in mm)
Revision 10/23/2014
Schematic
1
2
SLP0603P2X3F (Bottom View)
1 www.semtech.com

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RClamp2451ZA pdf
PROTECTION PRODUCTS
Applications Information
Assembly Guidelines
The small size of this device means that some care
must be taken during the mounting process to insure
reliable solder joints. The figure at the right details
Semtech’s recommended aperture based on the
assembly guidelines detailed in the table below. Note
that these are only recommendations and should
serve only as a starting point for design since there
are many factors that affect the assembly process.
Exact manufacturing parameters will require some
experimentation to get the desired solder application.
Assembly Parameter
Solder Stencil Design
Aperture shape
Solder Stencil Thickness
Solder Paste Type
Solder Reflow Profile
PCB Solder Pad Design
PCB Pad Finish
Recommendation
Laser cut, Electro-polished
Rectangular with rounded
corners
0.100 mm (0.004")
Type 4 size sphere or smaller
Per JEDEC J-STD-020
Non-Solder mask defined
OSP OR NiAu
RClamp2451ZA
0.273
0.205
0.220
0.320
Land Pad
Stencil opening
Component
Recommended Mounting Pattern
© 2014 Semtech Corporation
5
www.semtech.com

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