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PDF RClamp1851ZA Data sheet ( Hoja de datos )

Número de pieza RClamp1851ZA
Descripción 18V ESD Protection
Fabricantes Semtech 
Logotipo Semtech Logotipo



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No Preview Available ! RClamp1851ZA Hoja de datos, Descripción, Manual

PROTECTION PRODUCTS - RailClamp®
Description
RClamp® TVS diodes are designed to protect sensitive
electronics from damage or latch-up due to ESD. They
are designed to replace multilayer varistors (MLVs) in
portable applications such as cell phones, notebook
computers, and other portable electronics. This device
offers desirable characteristics for board level protection
including fast response time, low operating and clamp-
ing voltage, and no device degradation.
RClamp®1851ZA is specifically designed for protection of
Near Field Communications (NFC) interfaces. It features
extremely good ESD protection characteristics includ-
ing a low typical dynamic resistance of 0.16 Ohms, low
peak ESD clamping voltage, and high ESD withstand
voltage (+/-17kV contact per IEC 61000-4-2). Low typi-
cal capacitance (0.35pF at VR=0V) means that harmon-
ic distortion the the RF signal is minimized. This device
is bidirectional and has a working voltage of 18V for use
on NFC resonator circuits without signal clipping.
RClamp1851ZA
Ultra Small RClamp®
1-Line, 18V ESD Protection
Features
‹‹ High ESD withstand Voltage: +/-17kV (Contact) and
+/- 20kV (Air) per IEC 61000-4-2
‹‹ Ultra-small package
‹‹ Protects one high speed data line
‹‹ Low ESD clamping voltage
‹‹ Working voltage: 18V
‹‹ Low capacitance: 0.35pF typical
‹‹ Low leakage current
‹‹ Extremely low dynamic resistance: 0.16 Ohms (Typ)
‹‹ Solid-state silicon-avalanche technology
Mechanical Characteristics
‹‹ SLP0603P2X3F package
‹‹ Pb-Free, Halogen Free, RoHS/WEEE Compliant
‹‹ Nominal Dimensions: 0.6 x 0.3 x 0.25 mm
‹‹ Lead Finish: NiAu
‹‹ Marking: Marking code
‹‹ Packaging: Tape and Reel
RClamp1851ZA is in a 2-pin SLP0603P2X3F package
measuring 0.6 x 0.3 mm with a nominal height of only
0.25mm. Leads are finished with NiAu. The small pack-
age gives the designer the flexibility to protect single
lines in applications where arrays are not practical. The
combination of small size and high ESD surge capability
makes them ideal for use in portable applications such
as cellular phones, digital cameras, and tablet PC’s.
Applications
‹‹ Near Field Communication (NFC) lines
‹‹ RF signal lines
‹‹ Cellular Handsets
‹‹ Tablets
‹‹ FM Antenna
Package Dimensions
0.220
0.600
0.300
Schematic & Pin Configuration
1
0.355 BSC
0.160
0.250
4/15/2015
Nominal Dimensions in mm
2
SLP0603P2X3F (Bottom View)
1 www.semtech.com

1 page




RClamp1851ZA pdf
PROTECTION PRODUCTS
Applications Information
Assembly Guidelines
The small size of this device means that some care must
be taken during the mounting process to insure reliable
solder joint. The table below provides Semtech’s recom-
mended assembly guidelines for mounting this device.
The figure at the right details Semtech’s recommended
aperture based on the below recommendations. Note
that these are only recommendations and should serve
only as a starting point for design since there are many
factors that affect the assembly process. The exact
manufacturing parameters will require some experimen-
tation to get the desired solder application.
Assembly Parameter
Solder Stencil Design
Aperture shape
Solder Stencil Thickness
Solder Paste Type
Solder Reflow Profile
PCB Solder Pad Design
PCB Pad Finish
Recommendation
Laser cut, Electro-polished
Rectangular with rounded
corners
0.100 mm (0.004")
Type 4 size sphere or smaller
Per JEDEC J-STD-020
Non-Solder mask defined
OSP OR NiAu
RClamp1851ZA
Stencil Aperture
Mounting Pad
Package
0.272
0.175
0.250
0.298
0.270
Recommended Mounting Pattern
2015 Semtech Corporation.
5
www.semtech.com

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