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PDF RB521S-40C2 Data sheet ( Hoja de datos )
| Número de pieza | RB521S-40C2 | |
| Descripción | Small Signal Schottky diode | |
| Fabricantes | CYStech Electronics | |
| Logotipo |  |
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CYStech Electronics Corp.
Small Signal Schottky diode
RB521S-40C2
Spec. No. : C302C2
Issued Date : 2003.12.05
Revised Date : 2010.12.10
Page No. : 1/5
Description
Planar silicon Schottky barrier diode encapsulated in a SOD-523 plastic SMD package.
Features
•Extremely small surface mounting type.(SC-79/SOD523)
•IO=200mA guaranteed despite the size.
•Low VF.(VF=0.4V typ. at 200mA)
Applications
Low current rectification and high speed switching
Symbol
Outline
Absolute Maximum Ratings
• Maximum Temperatures
Storage Temperature Tstg..................................................................................................... -45~+125°C
Junction Temperature Tj .............................................................................................................. +125°C
• Maximum Voltages and Currents (Ta=25°C)
DC Reverse Voltage VR ...................................................................................................................... 40 V
Mean Rectifying Current IF ......................................................................................................... 200 mA
Peak Forward Surge Current IFSM………………………………….. ……………………………………………1 A
RB521S-40C2
CYStek Product Specification
1 page  
CYStech Electronics Corp.
SOD-523 Dimension
Spec. No. : C302C2
Issued Date : 2003.12.05
Revised Date : 2010.12.10
Page No. : 5/5
Marking Code :
1 C2
12
Style : Pin 1. Cathode 2. Anode
2-lead SOD-523 Plastic Package
CYStek Package Code : C2
*: Typical
DIM
Millimeters
Min. Max.
Inches
DIM Millimeters
Min. Max. Min. Min. Max.
Inches
Min. Max.
A 0.510 0.770 0.020 0.031 E 1.100 1.300 0.043 0.051
A1 0.500 0.700 0.020 0.028 E1 1.500 1.700 0.059 0.067
b 0.250 0.350 0.010 0.014 E2
0.200 REF
0.008 REF
c 0.080 0.150 0.003 0.006 L 0.010 0.070 0.001 0.003
D 0.750 0.850 0.030 0.033 θ
7° REF
7° REF
Notes: 1.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
2.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material:
• Lead: Pure tin plated.
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0.
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
• CYStek reserves the right to make changes to its products without notice.
• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
RB521S-40C2
CYStek Product Specification
5 Page | ||
| Páginas | Total 5 Páginas | |
| PDF Descargar | [ Datasheet RB521S-40C2.PDF ] | |
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