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PDF PE42556 Data sheet ( Hoja de datos )
| Número de pieza | PE42556 | |
| Descripción | SPDT RF Switch | |
| Fabricantes | Peregrine Semiconductor | |
| Logotipo |  |
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Product Description
The PE42556 RF switch is designed for use in Test/ATE,
cellular and other wireless applications. This broadband
general purpose switch maintains excellent RF
performance and linearity from 9 kHz through
13500 MHz. The PE42556 integrates on-board CMOS
control logic driven by a single-pin, low voltage CMOS
control input. It also has a logic select pin which enables
changing the logic definition of the control pin. Additional
features include a novel user defined logic table, enabled
by the on-board CMOS circuitry. The PE42556 also
exhibits excellent isolation of 26 dB at 13500 MHz, fast
settling time, and is offered in a tiny Flip Chip package.
The PE42556 is manufactured on Peregrine’s
UltraCMOS® process, a patented variation of silicon-on-
insulator (SOI) technology on a sapphire substrate,
offering the performance of GaAs with the economy and
integration of conventional CMOS.
Product Specification
PE42556 Flip Chip
UltraCMOS® SPDT RF Switch
9 kHz - 13500 MHz
Features
HaRP™ technology enhanced
Eliminates gate lag
No insertion loss or phase drift
Fast settling time
Next Gen 0.25 μm process technology
Single-pin 3.3V CMOS logic control
High isolation: 26 dB@ 13.5 GHz
Low insertion loss: 1.7 dB @ 13.5 GHz
P1dB: 33 dBm typical
Return loss: 13 dB @ 13.5 GHz (typ)
IIP3: +56 dBm typical
High ESD: 4kV HBM
Absorptive switch design
Flip Chip packaging
Figure 1. Functional Diagram
Figure 2. Die Photo (Bumps Up)
Flip Chip Packaging
71-0031
Document No. 70-0289-06 │ www.psemi.com
©2009-2012 Peregrine Semiconductor Corp. All rights reserved.
Page 1 of 10
1 page  
PE42556
Product Specification
Evaluation Kit
The SPDT switch EK Board was designed to ease
customer evaluation of Peregrine's PE42556 (dual
use with PE42554). The RF Common port is
connected through a 50 ohm transmission line via
the top SMA connector, J1. RF1 and RF2 are
connected through 50 ohm transmission lines via
SMA connectors J3, and J2, respectively. A
through 50 ohm transmission line is available via
SMA connectors J4 and J5. This transmission line
can be used to estimate the loss of the PCB over
the environmental conditions being evaluated.
The board is constructed of a four metal layers
with a total thickness of 62 mils. The top and
bottom layers are ROGERS RO4003 material with
an 8 mil core and Er = 3.55. The middle layers
provide ground for the transmission lines. The RF
transmission lines were designed using a coplanar
waveguide with ground plane model using a trace
width of 15 mils, and trace gaps of 10 mils.
General Comments
--
Transmission lines connected to J1, J2, and J3 should
have exactly the same electrical length.
The path from J2 to J3 including the distance through the part
should have the same length as J4 and J5 and be in parallel to
J4 to J5.
NOTES:
1. USE 101-0402-02 PCB
Figure 6. Evaluation Board Layouts
Peregrine Specification 101/0402
X
Figure 7. Evaluation Board Schematic
Peregrine Specification 102/0478
J9
HEADER, 12 PIN
1 CTL
3 LS
5 NC
7 VDD
9 VSS
11 GND
GND 2
GND 4
GND 6
GND 8
GND 10
GND 12
J1 2
1
6 RFC
U1
PE42554
RF1 8
RF2 4
2 J3
1
2
J2
1
J4 2
1
Document No. 70-0289-06 │ www.psemi.com
2
J5
1
©2009-2012 Peregrine Semiconductor Corp. All rights reserved.
Page 5 of 10
5 Page | ||
| Páginas | Total 10 Páginas | |
| PDF Descargar | [ Datasheet PE42556.PDF ] | |
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