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PDF CPC1150N Data sheet ( Hoja de datos )

Número de pieza CPC1150N
Descripción 4 Pin SOP OptoMOS Relays
Fabricantes Clare Inc. 
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No Preview Available ! CPC1150N Hoja de datos, Descripción, Manual

CPC1150N
4 Pin SOP OptoMOS® Relays
Load Voltage
Load Current
Max RON
CPC1150N
350
100
50
Units
V
mA
Features
Small 4 Pin SOP Package
Low Drive Power Requirements (TTL/CMOS
Compatible)
No Moving Parts
High Reliability
Arc-Free With No Snubbing Circuits
1500VRMS Input/Output Isolation
FCC Compatible
No EMI/RFI Generation
Machine Insertable, Wave Solderable
Tape & Reel Version Available
Applications
Telecommunications
Telecom Switching
Tip/Ring Circuits
Modem Switching (Laptop, Notebook, Pocket
Size)
Hookswitch
Dial Pulsing
Ground Start
Ringer Injection
Instrumentation
Multiplexers
Data Acquisition
Electronic Switching
I/O Subsystems
Meters (Watt-Hour, Water, Gas)
Medical Equipment-Patient/Equipment Isolation
Security
Aerospace
Industrial Controls
Description
The CPC1150N is a miniature 1-Form-B solid state
relay which uses optically coupled MOSFET technol-
ogy to provide 1500V of input to output isolation. The
efficient MOSFET switches and photovoltaic die use
Clares patented OptoMOS® architecture. The opti-
cally-coupled input is controlled by a highly efficient
GaAIAs infrared LED. The CPC1150N uses Clares
state of the art double molded vertical construction
packaging to produce the worlds smallest 4 pin SOP
package. The CPC1150N offers board space savings
of at least 20% over the competitors larger 4 Pin
SOP relay.
Approvals
UL / C-UL Recognized Component: File #E76270
BSI Certified - Certificate #: 8416
Ordering Information
Part #
CPC1150N
CPC1150NTR
Description
4 Pin SOP (100/tube)
4 Pin SOP (2,000/reel)
* For other packaging options, consult factory.
Pin Configuration
CPC1150N Pinout
1
+ Control
2
– Control
4
Load
3
Load
Switching Characteristics of
Normally Closed (Form B) Devices
CONTROL
10ms
+90%
+10%
TOFF
+90%
TON
DS-CPC1150N-R1.0
www.clare.com
1

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CPC1150N pdf
MECHANICAL DIMENSIONS
4 Pin SOIC Narrow (NSuffix)
.38 TYP.
(.015 TYP.)
.38 x 45¼
(.015 x 45¼ )
1.02 ± .025
(.040 ± .001)
.432 ± .127
(.017 ± .005)
.20 ± .025
(.008 ± .001)
6.096 ± .102
(.240 ± .004)
3.81 ± .08
(.150 ± .003)
2.16 MAX.
(.085)
4.09 ± 0.20
(0.161 ± 0.008)
2.54 TYP.
(.100 TYP.)
CPC1150N
PC Board Pattern (Top View)
2.54 ± 0.127
(0.100 ± 0.005)
1.448
(0.057)
5.66 ± 0.14
(0.223 ± 0.005)
0.889
(0.035)
Tape and Reel Packaging for 4 pin SOIC package
330.2 DiA
(13.00")
Top Cover
Tape Thickness
0.102 MAX
(0.004)
4.70
+_ 0.15
3.8
TYP
3.0 R
6.50+_
0.15
4.2
A
1.50 A
1.60
Embossed
Carrier
Embossment
8.00
1.5 dia
12.00
5.50+_ .10
.3 R MAX
TYP
2.30 +_ 0.15
2.00+_ .05
4.00+_ .10
1.75
.30
2.7+_ 0.15
SECTION A-A
Rev. 1.0
www.clare.com
Dimensions
mm
(inches)
5

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