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PDF AH11 Data sheet ( Hoja de datos )
| Número de pieza | AH11 | |
| Descripción | High Dynamic Range Dual Amplifier | |
| Fabricantes | TriQuint Semiconductor | |
| Logotipo |  |
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AH11
High Dynamic Range Dual Amplifier
Applications
Mobile Infrastructure
Defense / Homeland Security
Fixed Wireless
Product Features
150 – 3000 MHz
+44 dBm OIP3 (1900 MHz, balanced circuit)
Single-ended performance:
13.5 dB Gain
2.7 dB Noise Figure
+21 dBm P1dB
Single +5 Volt Supply
Lead-free / RoHS-compliant SOIC-8 package
SOIC-8 package
Functional Block Diagram
General Description
The AH11 is a high linearity amplifier for use in digital
communication systems. It combines low noise figure and
high intercept point into a low-cost SMT solution. This
device extends the linear efficiency advantages of
TriQuint’s AH1 to higher power levels by combining two
internally matched die. This dual-amplifier configuration
allows for the optimal design of balanced or push-pull
operation. The amplifier can also be used for single-ended
operation in each branch of a diversity receive system.
A mature and reliable GaAs MESFET technology is
employed to maximize linearity while achieving low noise
figure. The SOIC-8 package is lead-free /RoHS-compliant
package and is thermally enhanced to achieve an MTTF
greater than 100 years at a case temperature of 85C. All
devices are 100% RF and DC tested.
Pin Configuration
Pin No.
1
2, 3, 6, 7
4
5
8
Backside Paddle
Function
RF In (Amp 1)
RF/DC GND
RF In (Amp 2)
RF Out (Amp 2)
RF Out (Amp 1)
RF/DC GND
Data Sheet: Rev A 0 6/23/11
© 2011 TriQuint Semiconductor, Inc.
Ordering Information
Part No.
AH11-G
Description
High Dynamic Range Dual Amplifier
AH11BAL-PCB 0.6-2.1 GHz Balanced Eval Board
Standard T/R size = 500 pieces on a 7” reel.
- 1 of 7 -
Disclaimer: Subject to change without notice
Connecting the Digital World to the Global Network®
1 page  
AH11
High Dynamic Range Dual Amplifier
Pin Description
Pin
1
2, 3, 6, 7
4
5
8
n/a
Label
RF In (Amp 1)
Ground
RF In (Amp 2)
RF Out (Amp 2)
RF Out (Amp 1)
Backside Paddle
Description
RF Input. Requires matching circuit to 50 Ω. See application circuits.
RF/DC ground. Provide via path to ground.
RF Input. Requires matching circuit to 50 Ω. See application circuits.
RF Output. Requires DC blocking capacitor. See application circuits.
RF Output. Requires DC blocking capacitor. See application circuits.
Use recommended via pattern to minimize inductance and thermal resistance
Applications Information
PC Board Layouts
PCB Material (stackup):
1/2oz. Cu top layer
0.014 inch Nelco N-4000-13
1/2oz. Cu middle layer 1
Core Nelco N-4000-13
1/2 Cu middle layer 2
0.014 inch Nelco N-4000-13
1/2oz. Cu bottom layer
Finished board thickness is 0.062±.006
The pad pattern shown has been developed and tested for
optimized assembly at TriQuint Semiconductor. The PCB land
pattern has been developed to accommodate lead and package
tolerances. Since surface mount processes vary from company to
company, careful process development is recommended.
For further technical information, Refer to
http://www.triquint.com/prodserv/more_info/default.aspx?prod_id=AH11
Data Sheet: Rev A 0 6/23/11
© 2011 TriQuint Semiconductor, Inc.
- 5 of 7 -
Disclaimer: Subject to change without notice
Connecting the Digital World to the Global Network®
5 Page | ||
| Páginas | Total 7 Páginas | |
| PDF Descargar | [ Datasheet AH11.PDF ] | |
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