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PDF RFPA5201E Data sheet ( Hoja de datos )
| Número de pieza | RFPA5201E | |
| Descripción | WiFi Power Amplifier | |
| Fabricantes | RF Micro Devices | |
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RFPA5201E
WiFi Power Amplifier
5.0V, 2.4GHz to 2.5GHz
The RFPA5201E is an integrated Power Amplifier (PA) designed for
high performance WiFi systems requiring up to +29dBm linear output
power. The PA is manufactured on an advanced RFMD InGaP
Heterojunction Bipolar Transistor (HBT) process for optimal efficiency
and linearity (EVM).
The RFPA5201E integrates the power detector, biasing and input/output
match which reduces the number of external components and
manufacturability cost. The device is mounted on a 14-pin, 7 x 7mm
LGA laminate package and meets the RF specifications for 802.11b/g/n
systems.
VCC 1
PA_EN 2
14 VCC3
13 GND
GND 3
12 GND
RF_In 4
Input
Match
GND 5
PA_EN 6
Bias
Network
Output
Match 11 RF_Out
Power
Detector
10 GND
9 VCC3
VREG 7
Functional Block Diagram
8 PDet
RFPA5201E
Package: Laminate, 14-pin,
7.0mm x 7.0mm x 1.0mm
Features
■ POUT = 29dBm; EVM = -30dB
11n MCS7
■ Input and Output Matched
to 50Ω
■ High Gain: 33dB
■ Integrated Power Detector
■ High Impedance Enable Pin
■ High PAE Design
Applications
■ IEEE 802.11b/g/n WiFi Systems
■ Customer Premise Equipment
(CPE)
■ Wireless Access Points, Gateways
& Routers
■ Microcells
Ordering Information
RFPA5201ESB
Standard 5 piece bag
RFPA5201ESQ
Standard 25 piece bag
RFPA5201ESR
Standard 100 piece reel
RFPA5201ETR13
Standard 2500 piece reel
RFPA5201EPCK-410 Fully assembled evaluation board w/5 piece bag
RF Micro Devices Inc. 7628 Thorndike Road, Greensboro, NC 27409-9421
For sales or technical support, contact RFMD at +1.336.678.5570 or [email protected].
DS140331
RF MICRO DEVICES® and RFMD® are trademarks of RFMD, LLC. BLUETOOTH is a trademark owned by Bluetooth SIG, Inc., U.S.A. and licensed for use by RFMD. All other trade names,
trademarks, and registered trademarks are the property of their respective owners. ©2013, RF Micro Devices, Inc.
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RFPA5201E
Package Drawing
VCC 1
PA_EN 2
GND 3
RF_In 4
GND 5
PA_EN 6
VREG 7
Pin Out
14 VCC3
13 GND
12 GND
11 RF_Out
10 GND
9 VCC3
8 PDet
Notes
1. Shaded area represents Pin 1 location.
2. Thermal vias for center slug “B” should be incorporated into the PCB design. The number and size of thermal vias will depend on the application
Example of the number and size of vias can be found on the RFMD evaluation board layout
RF Micro Devices Inc. 7628 Thorndike Road, Greensboro, NC 27409-9421
For sales or technical support, contact RFMD at +1.336.678.5570 or [email protected].
DS140331
The information in this publication is believed to be accurate. However, no responsibility is assumed by RF Micro Devices, Inc. ("RFMD") for its use, nor for any infringement of patents or other rights of
third parties resulting from its use. No license is granted by implication or otherwise under any patent or patent rights of RFMD. RFMD reserves the right to change component circuitry, recommended
application circuitry and specifications at any time without prior notice.
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| Páginas | Total 7 Páginas | |
| PDF Descargar | [ Datasheet RFPA5201E.PDF ] | |
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