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PDF RF5603 Data sheet ( Hoja de datos )
| Número de pieza | RF5603 | |
| Descripción | LINEAR POWER AMPLIFIER | |
| Fabricantes | RF Micro Devices | |
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Hay una vista previa y un enlace de descarga de RF5603 (archivo pdf) en la parte inferior de esta página. Total 24 Páginas | ||
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RF56033.0 V
to 5.0V,
3.3GHz to
3.8GHz Lin-
ear Power
Amplifier
RF5603
3.0V TO 5.0V, 3.3GHz TO 3.8GHz
LINEAR POWER AMPLIFIER
Package Style: QFN, 16-Pin, 3mmx3mmx0.45mm
Features
High Gain; 32dB
2.5% EVM (RMS) at 24dBm,
3.3 V
2.5% EVM (RMS) at 26dBm,
5.0 V
Internal Power Detector
Integrated Input Match
Applications
WiMAX USB Data Cards
WiMAX Customer Premises
Equipment
WiMAX Access Points
IEEE 802.16 WiMAX Systems
16 15 14 13
BIAS VCC 1
12 RF OUT
RF IN 2
1st
Stage
Input
Match
2nd
Stage
Interstage
Match
3rd
Stage
Interstage
Match
11 RF OUT
NC 3
10 RF OUT
Detector
Bias
VREG1 4
9 GND
5678
Functional Block Diagram
Product Description
The RF5603 is a linear power amplifier IC designed specifically for WiMAX
medium power applications. The device is manufactured on an advanced
InGaP Heterojunction Bipolar Transistor (HBT) process, and has been
designed for use as the final RF amplifier in 802.16e transmitters. The
device is provided in a 3mmx3mmx0.45mm, 16-pin, leadless chip carrier
with a backside ground. The RF5603 is designed to maintain linearity over
a wide range of conditions and power outputs.
DS120213
Optimum Technology Matching® Applied
GaAs HBT
GaAs MESFET
InGaP HBT
SiGe BiCMOS
Si BiCMOS
SiGe HBT
GaAs pHEMT
Si CMOS
Si BJT
GaN HEMT
RF MEMS
LDMOS
RF MICRO DEVICES®, RFMD®, Optimum Technology Matching®, Enabling Wireless Connectivity™, PowerStar®, POLARIS™ TOTAL RADIO™ and UltimateBlue™ are trademarks of RFMD, LLC. BLUETOOTH is a trade-
mark owned by Bluetooth SIG, Inc., U.S.A. and licensed for use by RFMD. All other trade names, trademarks and registered trademarks are the property of their respective owners. ©2006, RF Micro Devices, Inc.
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at (+1) 336-678-5570 or [email protected].
1 of 24
1 page  
RF5603
PCB Design Requirements
PCB Surface Finish
The PCB surface finish used for RFMD's qualification process is electroless nickel, immersion gold. Typical thickness is 3inch
to 8inch gold over 180inch nickel.
PCB Land Pattern Recommendation
PCB land patterns for RFMD components are based on IPC-7351 standards and RFMD empirical data. The pad pattern shown
has been developed and tested for optimized assembly at RFMD. The PCB land pattern has been developed to accommodate
lead and package tolerances. Since surface mount processes vary from company to company, careful process development is
recommended.
PCB Metal Land and Solder Mask Pattern
Thermal vias for center slug “B” should be incorporated into the PCB design. The number and size of thermal vias will depend
on the application, the power dissipation, and the electrical requirements. Example of the number and size of vias can be
found on the RFMD evaluation board layout.
DS120213
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at (+1) 336-678-5570 or [email protected].
5 of 24
5 Page 
Evaluation Board Layout
RF5603
Assembly
Top
Inner 1
Inner 2
DS120213
Back
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at (+1) 336-678-5570 or [email protected].
11 of 24
11 Page | ||
| Páginas | Total 24 Páginas | |
| PDF Descargar | [ Datasheet RF5603.PDF ] | |
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