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RF5355 Schematic ( PDF Datasheet ) - RF Micro Devices

Teilenummer RF5355
Beschreibung 5GHz LINEAR POWER AMPLIFIER
Hersteller RF Micro Devices
Logo RF Micro Devices Logo 




Gesamt 11 Seiten
RF5355 Datasheet, Funktion
RF5355
3.3V, 5GHz LINEAR POWER AMPLIFIER
Package Style: QFN, 8-Pin, 2.2mmx2.2mmx0.45mm
Features
Single Supply Voltage 3.0V to
5.0 V
No external matching compo-
nents
28dB Typical Gain Across
Band
POUT=17dBm@<4% TYP
EVM across Operating Band
4900MHz to 5850MHz Fre-
quency Range
Applications
IEEE802.11a/n and
IEEE802.16e Applications
HyperLAN
WiFi Systems
Commercial and Consumer
Systems
Portable Battery-Powered
Equipment
Spread-Spectrum and MMDS
Systems
VC1 1
8
7
6 RF OUT
Input
Match
Interstage
Match
Interstage
Match
Output
Match
RF IN 2
Bias
3
5 RF OUT
4
Functional Block Diagram
Product Description
The RF5355 is a linear, medium-power, high-efficiency power amplifier IC
designed specifically for battery-powered WiFi applications such as PC
cards, mini PCI, and compact flash applications. It is also designed to
meet IEEE802.11a, IEEE802.11n, IEEE802.16e (4.9GHz to 5.850GHz
only) WiMax, FCC, and ETSI requirements for operation in the 4.9GHz to
5.850GHz band. The device is manufactured on an advanced InGap GaAs
Heterojunction Bipolar Transistor process, and has been designed for use
as the final RF amplifier in 5GHz WiFi and other spread-spectrum trans-
mitters. The device is provided in a QFN, 8-pin, 2.2mmx2.2mmx0.45mm,
leadless chip carrier with backside ground. The RF5355 operates from a
single supply and will be easily incorporated into WiFi and other designs
with minimal external components.
Ordering Information
RF5355
RF5355SR
RF5355TR7
RF5355PCK-410
Standard 25 piece bag
Standard 100 piece reel
Standard 2500 piece reel
Fully Assembled Evaluation Board and 5 loose sample pieces.
DS110618
Optimum Technology Matching® Applied
GaAs HBT
GaAs MESFET
InGaP HBT
SiGe BiCMOS
Si BiCMOS
SiGe HBT
GaAs pHEMT
Si CMOS
Si BJT
GaN HEMT
RF MEMS
LDMOS
RF MICRO DEVICES®, RFMD®, Optimum Technology Matching®, Enabling Wireless Connectivity™, PowerStar®, POLARIS™ TOTAL RADIO™ and UltimateBlue™ are trademarks of RFMD, LLC. BLUETOOTH is a trade-
mark owned by Bluetooth SIG, Inc., U.S.A. and licensed for use by RFMD. All other trade names, trademarks and registered trademarks are the property of their respective owners. ©2006, RF Micro Devices, Inc.
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at (+1) 336-678-5570 or [email protected].
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RF5355 Datasheet, Funktion
RF5355
PCB Design Requirements
PCB Surface Finish
The PCB surface finish used for RFMD's qualification process is electroless nickel, immersion gold. Typical thickness is 3 micro-
inch to 8 micro-inch gold over 180 micro-inch nickel.
PCB Land Pattern Recommendation *
PCB land patterns for RFMD components are based on IPC-7351 standards and RFMD empirical data. The pad pattern shown
has been developed and tested for optimized assembly at RFMD. The PCB land pattern has been developed to accommodate
lead and package tolerances. Since surface mount processes vary from company to company, careful process development is
recommended.
PCB Metal Land Pattern
PCB Solder Mask Pattern
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7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at (+1) 336-678-5570 or [email protected].
DS110618

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