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PDF RF3855 Data sheet ( Hoja de datos )
| Número de pieza | RF3855 | |
| Descripción | 3.1V LINEAR POWER AMPLIFIER | |
| Fabricantes | RF Micro Devices | |
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Hay una vista previa y un enlace de descarga de RF3855 (archivo pdf) en la parte inferior de esta página. Total 6 Páginas | ||
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RF38553.1 V
Linear Power
Amplifier
RF3855
3.1V LINEAR POWER AMPLIFIER
Package Style: QFN, 16-Pin, 4 x 4
Features
Single 3.1V Supply
Applications
L-BAND SATCOM Applications
1 16 15 14 13
VPD1 2
12 VCC1
MODE 3
11 VCC1
VPD2 4
10 VCC
56789
Functional Block Diagram
Product Description
The RF3855 is a high-power, high-efficiency linear amplifier IC targeting L-
BAND SATCOM Applications. The device is manufactured on an advanced
Gallium Arsenide process, and has been designed for use as the final RF
amplifier applications in the 1611MHz to 1618MHz band. The package is
a 4mmx4mm, 16-pin QFN plastic package with backside ground.
Ordering Information
RF3855
3.1V Linear Power Amplifier
DS110914
Optimum Technology Matching® Applied
GaAs HBT
SiGe BiCMOS
GaAs pHEMT
GaN HEMT
GaAs MESFET
Si BiCMOS
Si CMOS
InGaP HBT
SiGe HBT
Si BJT
RF MICRO DEVICES®, RFMD®, Optimum Technology Matching®, Enabling Wireless Connectivity™, PowerStar®, POLARIS™ TOTAL RADIO™ and UltimateBlue™ are trademarks of RFMD, LLC. BLUETOOTH is a trade-
mark owned by Bluetooth SIG, Inc., U.S.A. and licensed for use by RFMD. All other trade names, trademarks and registered trademarks are the property of their respective owners. ©2006, RF Micro Devices, Inc.
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at (+1) 336-678-5570 or [email protected].
1 of 6
1 page  
RF3855
PCB Design Requirements
PCB Surface Finish
The PCB surface finish used for RFMD’s qualification process is electroless nickel, immersion gold. Typical thickness is 3inch
to 8inch gold over 180inch nickel.
PCB Land Pattern Recommendation
PCB land patterns are based on IPC-SM-782 standards when possible. The pad pattern shown has been developed and tested
for optimized assembly at RFMD; however, it may require some modifications to address company specific assembly pro-
cesses. The PCB land pattern has been developed to accommodate lead and package tolerances.
PCB Metal Land Pattern
Pin 1
A = 0.51 x 0.89 (mm) Typ.
B = 0.89 x 0.51 (mm) Typ.
C = 1.52 (mm) Sq.
3.20 Typ.
0.81 Typ.
AA AA A
Dimensions in mm.
1.73 Typ.
B
B
0.81 Typ.
0.81 Typ.
B C B 1.60 Typ.
BB
0.94 Typ.
AA AA A
Figure 1. PCB Metal Land Pattern (Top View)
1.60 Typ.
1.73 Typ.
DS110914
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at (+1) 336-678-5570 or [email protected].
5 of 6
5 Page | ||
| Páginas | Total 6 Páginas | |
| PDF Descargar | [ Datasheet RF3855.PDF ] | |
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