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RF7228 Schematic ( PDF Datasheet ) - RF Micro Devices

Teilenummer RF7228
Beschreibung 3V W-CDMA BAND 8 LINEAR PA MODULE
Hersteller RF Micro Devices
Logo RF Micro Devices Logo 




Gesamt 6 Seiten
RF7228 Datasheet, Funktion
RF7228
3V W-CDMA BAND 8 LINEAR PA MODULE
Package Style: Module, 10-Pin, 3mmx3mmx1.0mm
Features
HSDPA and HSPA+ Compliant
Low Voltage Positive Bias
Supply (3.0V to 4.35V)
+28.5dBm Linear Output
Power (+27.0dBm HSDPA)
High Efficiency Operation
41% at POUT=+28.5dBm
22% at POUT=+18.0dBm
11% at POUT=+10.0dBm
Low Quiescent Current in Low
Power Mode: 6mA
Internal Voltage Regulator
Eliminates the Need for Exter-
nal Reference Voltage (VREF)
3-Mode Power States with
Digital Control Interface
Integrated Power Coupler
Integrated Blocking and Col-
lector Decoupling Capacitors
Applications
WCDMA/HSDPA/HSUPA Wire-
less Handsets and Data
Cards
Dual-Mode UMTS Wireless
Handsets
VBAT 1
RF IN 2
VMODE1 3
VMODE0 4
VEN 5
AMP
Bias Control
& PA/VMODE
Enable
10 VCC
9 RF OUT
8 CPL IN
7 GND
6 CPL OUT
Functional Block Diagram
Product Description
The RF7228 is a high-power, high-efficiency, linear power amplifier
designed for use as the final RF amplifier in 3V, 50W-CDMA mobile cel-
lular equipment and spread-spectrum systems. This PA is developed for
UMTS Band 8 which operates in the 880MHz to 915MHz frequency band.
The RF7228 has two digital control pins to select one of three power
modes to optimize performance and current drain at lower power levels.
The part also has an integrated directional coupler which eliminates the
need for an external discrete coupler at the output. The RF7228 is fully
HSDPA and HSPA+ compliant and is assembled in a 10-pin, 3mmx3mm
module.
Ordering Information
RF7228
3V W-CDMA Band 8 Linear PA Module
RF7228PCBA-410 Fully Assembled Evaluation Board
Optimum Technology Matching® Applied
GaAs HBT
GaAs MESFET
InGaP HBT
SiGe BiCMOS
Si BiCMOS
SiGe HBT
GaAs pHEMT
Si CMOS
Si BJT
GaN HEMT
RF MEMS
LDMOS
RF MICRO DEVICES®, RFMD®, Optimum Technology Matching®, Enabling Wireless Connectivity™, PowerStar®, POLARIS™ TOTAL RADIO™ and UltimateBlue™ are trademarks of RFMD, LLC. BLUETOOTH is a trade-
mark owned by Bluetooth SIG, Inc., U.S.A. and licensed for use by RFMD. All other trade names, trademarks and registered trademarks are the property of their respective owners. ©2006, RF Micro Devices, Inc.
Prelim DS110224
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at (+1) 336-678-5570 or [email protected].
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RF7228 Datasheet, Funktion
RF7228
PCB Solder Mask Pattern
Liquid Photo-Imageable (LPI) solder mask is recommended. The solder mask footprint will match what is shown for the PCB
metal land pattern with a 2mil to 3mil expansion to accommodate solder mask registration clearance around all pads. The
center-grounding pad shall also have a solder mask clearance. Expansion of the pads to create solder mask clearance can be
provided in the master data or requested from the PCB fabrication supplier.
PCB Solder Mask Pattern (Top View)
Thermal Pad and Via Design
The PCB land pattern has been designed with a thermal pad that matches the die paddle size on the bottom of the device.
Thermal vias are required in the PCB layout to effectively conduct heat away from the package. The via pattern has been
designed to address thermal, power dissipation and electrical requirements of the device as well as accommodating routing
strategies.
The via pattern used for the RFMD qualification is based on thru-hole vias with 0.203mm to 0.330mm finished hole size on a
0.5mm to 1.2mm grid pattern with 0.025mm plating on via walls. If micro vias are used in a design, it is suggested that the
quantity of vias be increased by a 4:1 ratio to achieve similar results.
6 of 6
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at (+1) 336-678-5570 or [email protected].
Prelim DS110224

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