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PDF CHR2411-QDG Data sheet ( Hoja de datos )

Número de pieza CHR2411-QDG
Descripción GaAs Monolithic Microwave IC
Fabricantes United Monolithic Semiconductors 
Logotipo United Monolithic Semiconductors Logotipo



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CHR2411-QDG
22-24.5GHz RX Multifunction
GaAs Monolithic Microwave IC in SMD leadless package
Description
The CHR2411-QDG is a monolithic
multifunction in K-Band which integrates a
low noise amplifier and a mixer generating an
IF signal from DC to 1MHz. All the active
devices are self biased on chip.
The circuit is manufactured with a standard
GaAs pHEMT process, 0.25µm gate length,
via holes through the substrate, air bridges
and electron beam gate lithography.
It is available in a 24 leads RoHS compliant
QFN4x4 package.
UMS
R2411
YYWW
Plastic package
Main Features
22-24.5GHz Bandwidth
7dB Typical Noise figure
23dB 2.5dB Stable gain in temperature
+5V single supply Voltage
24L-QFN4x4 SMD leadless package
MSL1
Multifunction block diagram
Main Electrical Characteristics
Tamb.= +25°C
Symbol
Parameter
Min Typ Max Unit
RF Frequency range
22 24.5 GHz
Gc Conversion Gain
19 23 27 dB
NF SSB Noise figure (IF=1MHz)
7 dB
LO & RF Input / Output Return Loss
-15 -8 dB
ESD Protection: Electrostatic discharge sensitive device. Observe handling precautions!
Ref. : CHR2411-QDG3116 - 26 Apr 13
1/10 Specifications subject to change without notice
United Monolithic Semiconductors S.A.S.
Bât. Charmille - Parc SILIC - 10, Avenue du Québec - 91140 VILLEBON-SUR-YVETTE - France
Tel.: +33 (0) 1 69 86 32 00 - Fax: +33 (0) 1 69 86 34 34

1 page




CHR2411-QDG pdf
22-24.5GHz RX Multifunction
Package outline (1)
CHR2411-QDG
Matt tin, Lead Free
Units :
From the standard :
25-
(Green)
mm
JEDEC MO-220
(VGGD)
GND
1- Nc
2- Nc
3- Gnd(2)
4- RF in
5- Gnd(2)
6- Nc
7- Nc
8- Gnd(2)
9- VgLNA
10- D1
11- VgBuffer
12- Nc
13- Nc
14- Gnd(2)
15- LO in
16- Gnd(2)
17- Nc
18- Nc
19- Nc
20- IF out
21- D2
22- D3
23- VdBuffer
24- Nc
(1) The package outline drawing included to this data-sheet is given for indication. Refer to the
application note AN0017 (http://www.ums-gaas.com) for exact package dimensions.
(2) It is strongly recommended to ground all pins marked “Gnd” through the PCB board.
Ensure that the PCB board is designed to provide the best possible ground to the package.
Ref. : CHR2411-QDG3116 - 26 Apr 13
5/10 Specifications subject to change without notice
Bât. Charmille - Parc SILIC - 10, Avenue du Québec - 91140 VILLEBON-SUR-YVETTE - France
Tel.: +33 (0) 1 69 86 32 00 - Fax: +33 (0) 1 69 86 34 34

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