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CHR2294 Schematic ( PDF Datasheet ) - United Monolithic Semiconductors

Teilenummer CHR2294
Beschreibung GaAs Monolithic Microwave IC
Hersteller United Monolithic Semiconductors
Logo United Monolithic Semiconductors Logo 




Gesamt 8 Seiten
CHR2294 Datasheet, Funktion
CHR2294
RoHS COMPLIANT
25-35GHz Single Side Band Mixer
Self biased
GaAs Monolithic Microwave IC
Description
The CHR2294 is a multifunction chip (MFC)
which integrates a self biased LO buffer
amplifier and a sub-harmonically balanced
diodes mixer for 2LO suppression and image
rejection. It is usable for both up-conversion
and down-conversion. It is designed for a
wide range of applications, typically
commercial communication systems for
broadband local access. The backside of the
chip is both RF and DC grounded. This helps
to simplify the assembly process.
The circuit is manufactured with a pHEMT
process, 0.25µm gate length, via holes
through the substrate, air bridges and
electron beam gate lithography.
It is available in chip form.
Main Features
Broadband performances: 25-35GHz
11dB conversion Loss
15dBc image rejection
+9dBm LO input power
+2.5dBm input power (1dB gain comp.)
Low DC power consumption, 55mA@4V
Chip size: 2.06 x 1.25 x 0.10mm
Up-conversion Supradyne mode
IF=1.2GHz
30
25
20
15
10
5
0
CL sup (dB)
Imag Supp (dBc)
-5
P LO@RF (dBm)
P 2xLO @RF (dBm)
-10
-15
-20
-25
-30
-35
-40
-45
-50
22 23 24 25 26 27 28 29 30 31 32 33 34 35 36
RF frequency (GHz)
Main Characteristics
Tamb. = 25°C
Parameter
Min Typ Max
FRF RF frequency range
25 35
FLO LO frequency range
11 19
FIF IF frequency range
DC 3.5
Lc Conversion Loss
15 11
ESD Protection: Electrostatic discharge sensitive device. Observe handling precautions!
Unit
GHz
GHz
GHz
dB
Ref. : DSCHR22940197 - 16 Jul 10
1/8 Specifications subject to change without notice
United Monolithic Semiconductors S.A.S.
Route Départementale 128 - B.P.46 - 91401 Orsay Cedex France
Tel. : +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09






CHR2294 Datasheet, Funktion
CHR2294
25-35GHz SSB Mixer
Chip Assembly and Mechanical Data
Bonding pad positions
(Chip thickness: 100µm)
To VD DC Drain Supply
10nF
120pF
Note: Supply feed should be bypassed. 25µm diameter gold wire is recommended.
Ref. : DSCHR22940197 - 16 Jul 10
6/8 Specifications subject to change without notice
Route Départementale 128, B.P.46 - 91401 ORSAY Cedex - FRANCE
Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09

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