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PESD5V0L4UF Schematic ( PDF Datasheet ) - NXP Semiconductors

Teilenummer PESD5V0L4UF
Beschreibung Low capacitance unidirectional quadruple ESD protection diode arrays
Hersteller NXP Semiconductors
Logo NXP Semiconductors Logo 




Gesamt 17 Seiten
PESD5V0L4UF Datasheet, Funktion
PESDxL4UF; PESDxL4UG;
PESDxL4UW
Low capacitance unidirectional quadruple ESD protection
diode arrays
Rev. 04 — 28 February 2008
Product data sheet
1. Product profile
1.1 General description
Low capacitance unidirectional quadruple ElectroStatic Discharge (ESD) protection diode
arrays in small Surface-Mounted Device (SMD) plastic packages designed to protect up to
four signal lines from the damage caused by ESD and other transients.
Table 1. Product overview
Type number
Package
NXP
PESD3V3L4UF
SOT886
PESD5V0L4UF
SOT886
PESD3V3L4UG
SOT353
PESD5V0L4UG
SOT353
PESD3V3L4UW
SOT665
PESD5V0L4UW
SOT665
JEITA
-
-
SC-88A
SC-88A
-
-
JEDEC
MO-252
MO-252
-
-
-
-
Package configuration
leadless ultra small
leadless ultra small
very small
very small
ultra small and flat lead
ultra small and flat lead
1.2 Features
I ESD protection of up to four lines
I Low diode capacitance
I Max. peak pulse power: PPP = 30 W
I Low clamping voltage: VCL = 12 V
I Ultra low leakage current: IRM = 5 nA
I ESD protection up to 20 kV
I IEC 61000-4-2; level 4 (ESD)
I IEC 61000-4-5 (surge); IPP = 2.5 A
1.3 Applications
I Computers and peripherals
I Audio and video equipment
I Cellular handsets and accessories
I Communication systems
I Portable electronics
I Subscriber Identity Module (SIM) card
protection






PESD5V0L4UF Datasheet, Funktion
NXP Semiconductors
PESDxL4UF/G/W
Low capacitance unidirectional quadruple ESD protection diode arrays
Table 9. Characteristics …continued
Tamb = 25 °C unless otherwise specified.
Symbol Parameter
Conditions
Cd diode capacitance
f = 1 MHz;
VR = 0 V
PESD3V3L4UF
PESD3V3L4UG
PESD3V3L4UW
PESD5V0L4UF
PESD5V0L4UG
PESD5V0L4UW
VCL clamping voltage
PESD3V3L4UF
PESD3V3L4UG
PESD3V3L4UW
IPP = 1 A
PESD3V3L4UF
PESD3V3L4UG
PESD3V3L4UW
IPP = 3 A
PESD5V0L4UF
PESD5V0L4UG
PESD5V0L4UW
IPP = 1 A
PESD5V0L4UF
PESD5V0L4UG
PESD5V0L4UW
IPP = 2.5 A
rdif differential resistance IR = 1 mA
PESD3V3L4UF
PESD3V3L4UG
PESD3V3L4UW
PESD5V0L4UF
PESD5V0L4UG
PESD5V0L4UW
Min Typ Max Unit
-
-
[1][2][3]
-
-
-
-
22 28 pF
16 19 pF
- 8V
- 12 V
- 10 V
- 13 V
- - 200
- - 100
[1] Non-repetitive current pulse 8/20 µs exponential decay waveform according to IEC 61000-4-5.
[2] For PESDxL4UF measured from pin 1, 3, 4 or 6 to pin 2 or 5.
[3] For PESDxL4UG and PESDxL4UW measured from pin 1, 3, 4 or 5 to pin 2.
PESDXL4UF_G_W_4
Product data sheet
Rev. 04 — 28 February 2008
© NXP B.V. 2008. All rights reserved.
6 of 17

6 Page









PESD5V0L4UF pdf, datenblatt
NXP Semiconductors
PESDxL4UF/G/W
Low capacitance unidirectional quadruple ESD protection diode arrays
9. Packing information
Table 10. Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.[1]
Type number Package Description
PESD3V3L4UF SOT886
PESD5V0L4UF SOT886
PESD3V3L4UG SOT353
PESD5V0L4UG SOT353
PESD3V3L4UW SOT665
PESD5V0L4UW SOT665
4 mm pitch, 8 mm tape and reel; T1
4 mm pitch, 8 mm tape and reel; T4
4 mm pitch, 8 mm tape and reel; T1
4 mm pitch, 8 mm tape and reel; T4
4 mm pitch, 8 mm tape and reel; T1
4 mm pitch, 8 mm tape and reel; T2
4 mm pitch, 8 mm tape and reel; T1
4 mm pitch, 8 mm tape and reel; T2
2 mm pitch, 8 mm tape and reel
4 mm pitch, 8 mm tape and reel
2 mm pitch, 8 mm tape and reel
4 mm pitch, 8 mm tape and reel
Packing quantity
3000 4000 5000
[2] - - -115
[3] - - -132
[2] - - -115
[3] - - -132
[2] -115 -
-
[4] -125 -
-
[2] -115 -
-
[4] -125 -
-
---
- -115 -
---
- -115 -
8 000
-
-
-
-
-
-
-
-
-315
-
-315
-
10 000
-
-
-
-
-135
-165
-135
-165
-
-
-
-
[1] For further information and the availability of packing methods, see Section 13.
[2] T1: normal taping
[3] T4: 90° rotated reverse taping
[4] T2: reverse taping
10. Soldering
1.250
0.675
0.370
(6×)
0.500
0.270
(6×)
0.325
(6×)
1.700
0.500
0.425
(6×)
solder lands
solder paste
occupied area
Dimensions in mm
sot886_fr
Reflow soldering is the only recommended soldering method.
Fig 13. Reflow soldering footprint PESDxL4UF (SOT886)
PESDXL4UF_G_W_4
Product data sheet
Rev. 04 — 28 February 2008
© NXP B.V. 2008. All rights reserved.
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