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PESD5V0U1UL Schematic ( PDF Datasheet ) - NXP Semiconductors

Teilenummer PESD5V0U1UL
Beschreibung Ultra low capacitance unidirectional ESD protection diodes
Hersteller NXP Semiconductors
Logo NXP Semiconductors Logo 




Gesamt 12 Seiten
PESD5V0U1UL Datasheet, Funktion
PESD5V0U1UA;
PESD5V0U1UB; PESD5V0U1UL
Ultra low capacitance unidirectional ESD protection diodes
Rev. 01 — 30 October 2008
Product data sheet
1. Product profile
1.1 General description
Ultra low capacitance unidirectional ElectroStatic Discharge (ESD) protection diodes in
small Surface-Mounted Device (SMD) plastic packages designed to protect one signal
line from the damage caused by ESD and other transients.
Table 1. Product overview
Type number
Package
NXP
PESD5V0U1UA
SOD323
PESD5V0U1UB
SOD523
PESD5V0U1UL
SOD882
JEITA
SC-76
SC-79
-
Package configuration
very small
ultra small and flat lead
leadless ultra small
1.2 Features
I Unidirectional ESD protection of one line I ESD protection up to 9 kV
I Ultra low diode capacitance: Cd = 2 pF I IEC 61000-4-2; level 4 (ESD)
I Very low leakage current: IRM = 1 nA I AEC-Q101 qualified
1.3 Applications
I USB interfaces
I 10/100/1000 Mbit/s Ethernet
I FireWire
I High-speed data lines
I Subscriber Identity Module (SIM) card
protection
I Cellular handsets and accessories
I Portable electronics
I Communication systems
I Computers and peripherals
I Audio and video equipment
1.4 Quick reference data
Table 2. Quick reference data
Tamb = 25 °C unless otherwise specified.
Symbol Parameter
Conditions
VRWM
reverse standoff voltage
Min Typ Max Unit
- - 5V






PESD5V0U1UL Datasheet, Funktion
NXP Semiconductors
PESD5V0U1UA/UB/UL
Ultra low capacitance unidirectional ESD protection diodes
7. Application information
The PESD5V0U1Ux series is designed for the protection of one unidirectional data or
signal line from the damage caused by ESD. The devices may be used on lines where the
signal polarities are either positive or negative with respect to ground.
line to be protected
(positive signal polarity)
line to be protected
(negative signal polarity)
DUT
DUT
GND
GND
unidirectional protection of one line
006aab251
Fig 5. Application diagram
Circuit board layout and protection device placement
Circuit board layout is critical for the suppression of ESD and Electrical Fast
Transient (EFT). The following guidelines are recommended:
1. Place the device as close to the input terminal or connector as possible.
2. The path length between the device and the protected line should be minimized.
3. Keep parallel signal paths to a minimum.
4. Avoid running protected conductors in parallel with unprotected conductors.
5. Minimize all Printed-Circuit Board (PCB) conductive loops including power and
ground loops.
6. Minimize the length of the transient return path to ground.
7. Avoid using shared transient return paths to a common ground point.
8. Ground planes should be used whenever possible. For multilayer PCBs, use ground
vias.
8. Test information
8.1 Quality information
This product has been qualified in accordance with the Automotive Electronics Council
(AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is
suitable for use in automotive applications.
PESD5V0U1UA_UB_UL_1
Product data sheet
Rev. 01 — 30 October 2008
© NXP B.V. 2008. All rights reserved.
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PESD5V0U1UL pdf, datenblatt
NXP Semiconductors
PESD5V0U1UA/UB/UL
Ultra low capacitance unidirectional ESD protection diodes
15. Contents
1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1 General description. . . . . . . . . . . . . . . . . . . . . . 1
1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.4 Quick reference data. . . . . . . . . . . . . . . . . . . . . 1
2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2
3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2
4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3
6 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4
7 Application information. . . . . . . . . . . . . . . . . . . 6
8 Test information . . . . . . . . . . . . . . . . . . . . . . . . . 6
8.1 Quality information . . . . . . . . . . . . . . . . . . . . . . 6
9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 7
10 Packing information. . . . . . . . . . . . . . . . . . . . . . 7
11 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
12 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 10
13 Legal information. . . . . . . . . . . . . . . . . . . . . . . 11
13.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 11
13.2 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
13.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
13.4 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
14 Contact information. . . . . . . . . . . . . . . . . . . . . 11
15 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2008.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 30 October 2008
Document identifier: PESD5V0U1UA_UB_UL_1

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