Datenblatt-pdf.com

FDZ372NZ Schematic ( PDF Datasheet ) - Fairchild Semiconductor

Teilenummer FDZ372NZ
Beschreibung N-Channel 1.5 V Specified PowerTrench Thin WL-CSP MOSFET
Hersteller Fairchild Semiconductor
Logo Fairchild Semiconductor Logo 




Gesamt 7 Seiten
FDZ372NZ Datasheet, Funktion
March 2010
FDZ372NZ
N-Channel 1.5 V Specified PowerTrench® Thin WL-CSP MOSFET
20 V, 4.7 A, 50 m
Features
General Description
„ Max rDS(on) = 50 mat VGS = 4.5 V, ID = 2 A
„ Max rDS(on) = 60 mat VGS = 2.5 V, ID = 2 A
„ Max rDS(on) = 72 mat VGS = 1.8 V, ID = 1 A
„ Max rDS(on) = 93 mat VGS = 1.5 V, ID = 1 A
„ Occupies only 1.0 mm2 of PCB area. Less than 30% of the
area of 2x2 BGA
„ Ultra-thin package: less than 0.4 mm height when mounted
to PCB
„ HBM ESD protection level > 3200V (Note3)
„ RoHS Compliant
Designed on Fairchild's advanced 1.5 V PowerTrench® process
with state of the art "fine pitch" Thin WLCSP packaging process,
the FDZ372NZ minimizes both PCB space and rDS(on). This
advanced WLCSP MOSFET embodies a breakthrough in
packaging technology which enables the device to combine
excellent thermal transfer characteristics, ultra-low profile
packaging, low gate charge, and low rDS(on).
Applications
„ Battery management
„ Load switch
„ Battery protection
Pin 1
S
DS
G
Pin 1
BOTTOM
WL-CSP 1.0X1.0 Thin
TOP
MOSFET Maximum Ratings TA = 25 °C unless otherwise noted
Symbol
VDS
VGS
ID
PD
TJ, TSTG
Parameter
Drain to Source Voltage
Gate to Source Voltage
Drain Current -Continuous
-Pulsed
TA = 25 °C
Power Dissipation
TA = 25 °C
Power Dissipation
TA = 25 °C
Operating and Storage Junction Temperature Range
Thermal Characteristics
(Note 1a)
(Note 1a)
(Note 1b)
Ratings
20
±8
4.7
12
1.7
0.5
-55 to +150
Units
V
V
A
W
°C
RθJA
RθJA
Thermal Resistance, Junction to Ambient
Thermal Resistance, Junction to Ambient
Package Marking and Ordering Information
Device Marking
L
Device
FDZ372NZ
Package
WL-CSP 1.0x1.0 Thin
(Note 1a)
(Note 1b)
75
260
Reel Size
7 ’’
Tape Width
8 mm
°C/W
Quantity
5000 units
©2010 Fairchild Semiconductor Corporation
FDZ372NZ Rev.C2
1
www.fairchildsemi.com






FDZ372NZ Datasheet, Funktion
Dimensional Outline and Pad Layout
©2010 Fairchild Semiconductor Corporation
FDZ372NZ Rev.C2
6
www.fairchildsemi.com

6 Page







SeitenGesamt 7 Seiten
PDF Download[ FDZ372NZ Schematic.PDF ]


Link teilen




Besondere Datenblatt

TeilenummerBeschreibungHersteller
FDZ372NZN-Channel 1.5 V Specified PowerTrench Thin WL-CSP MOSFETFairchild Semiconductor
Fairchild Semiconductor

TeilenummerBeschreibungHersteller
CD40175BC

Hex D-Type Flip-Flop / Quad D-Type Flip-Flop.

Fairchild Semiconductor
Fairchild Semiconductor
KTD1146

EPITAXIAL PLANAR NPN TRANSISTOR.

KEC
KEC


www.Datenblatt-PDF.com    |   2020   |  Kontakt  |   Suche