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Teilenummer | CDZ55C18 |
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Beschreibung | Zener Diodes | |
Hersteller | Crownpo Technology | |
Logo | ||
Gesamt 6 Seiten Zener Diodes
CDZ55C-Series
Crownpo Technology
Features
• This diode is also available in other case styles
including the 0805 case with the type designation
CDZ55C-S-Series.
• Silicon Planar Power Zener Diodes.
Mechanical Data
Case: 1206
Weight : approx.10 mg
Marking : Cathode band
.067 (1.70)
.051 (1.30)
1206
.134 (3.40)
.118 (3.00)
12
.030 (.75)
.014 (.35)
.037 (.95)
.029 (.75)
Dimensions in inches and (millimeters)
Mounting Pad Layout
.025(.635)
.085(2.16) Typ.
Typ.
.067 (1.70)
Typ.
Maximum Ratings and Thermal Characteristics (T amb = 25 °C, unless otherwise specified)
Parameter
Power dissipation
Junction temperature
Storage temperature range
Thermal resıstanceJunction to ambient aır
Symbol
Ptot
Tj
Tstg
RθJA
Value
500
175
- 65 to + 175
300
Unit
mW
°C
°C
°C/W
Electrical Characteristics
Parameter
Forward voltage IF = 200 mA
Symbol
VF
Max
1.5
Unit
V
16-Aug-07
Document No. 31004
www.crownpo.com
CDZ55C-Series
Crownpo Technology
Suggested thermal profiles for soldering processes
280
260
240
220
200
180
160
140
120
Peak
Max dwell
time 4 sec
100
80
60
Soak
Max gradient
2oC/s
Cool down
Max gradient
-4 oC/s
40
Preheat
2 0 Max gradient
2oC/s
30 60
90 120 150 180 210 240 270 300
Time (seconds)
Fig.1 Typical Wave Soldering Thermal Profile
330
360
240
220
200
180
160
140
120
100
80
60
40
20
16-Aug-07
Document No. 31004
Peak soldering temperature
2 1 0 - 2 3 5o C f o r s t a n d a r d d e v i c e s
2 3 5 - 2 5 5o C f o r P b - f r e e d e v i c e s
Soak
Max time 2 min
Reflow
Max time
85 sec
Cool down
Max gradient -4 oC/s
Preheat
Max time 4 min.
Max gradient 2.5 oC/s
30
60
90
120
150
180
210
240
270
Time (seconds)
Fig.2 Typical IR Reflow Soldering Thermal Profile
300
www.crownpo.com
6 Page | ||
Seiten | Gesamt 6 Seiten | |
PDF Download | [ CDZ55C18 Schematic.PDF ] |
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