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Número de pieza | SDA-3000 | |
Descripción | GaAs Distributed Amplifier | |
Fabricantes | RF Micro Devices | |
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Hay una vista previa y un enlace de descarga de SDA-3000 (archivo pdf) en la parte inferior de esta página. Total 7 Páginas | ||
No Preview Available ! SDA-3000
GaAs Distributed Amplifier
RFMD’s SDA-3000 is a directly coupled (DC) GaAs
microwave monolithic integrated circuit (MMIC) driver
amplifier die designed for use as a Mach Zehnder Modulated
(MZM) laser driver employing single-ended (SE) architectures
with V (V-pi) ranging from 4V to 7V, clock driver for return-to-
zero (RZ) and carrier select (CS) Carver Modulators,
broadband automated test equipment (ATE), instrumentation,
military, and aerospace applications.
SDA-3000
Package: Die, 3.10mm x 1.45mm x
0.102mm
Features
■ DC to 24GHz Operation
■ +25dBm P3dB
■ Gain = 16dB Typical
■ Noise Figure = 2.1dB at
10GHz
■ Output Voltage to 7VPP
■ Single Supply Voltage
■ 160mA Total Current
Applications
■ Driver for Single-ended (SE)
MZM, NRZ, DPSK, ODB, RZ
■ Clock Driver for RZ and CS
Pulse Carver
■ Broadband ATE
■ Instrumentation
■ Military
■ Aerospace
Functional Block Diagram
Ordering Information
SDA-3000
GaAs Distributed Amplifier, GelPak, 10 pieces or more
SDA-3000SB GaAs Distributed Amplifier, GelPak, 2 pieces
RF Micro Devices Inc. 7628 Thorndike Road, Greensboro, NC 27409-9421
For sales or technical support, contact RFMD at +1.336.678.5570 or [email protected].
DS140204
RF MICRO DEVICES® and RFMD® are trademarks of RFMD, LLC. BLUETOOTH is a trademark owned by Bluetooth SIG, Inc., U.S.A. and licensed for use by RFMD. All other trade names,
trademarks, and registered trademarks are the property of their respective owners. ©2013, RF Micro Devices, Inc.
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1 page SDA-3000
Application Schematic
NOTE: Drain Bias (VDD) must be applied through a broadband bias tee or external bias network.
Die Drawing (Dimensions in millimeters)
Notes:
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7.
No connection required for unlabeled bond pads
Die thickness is 0.102mm (4mil)
Typical bond pad is 0.100mm square
Backside metallization: gold
Backside metal is ground
Bond pad metallization: gold
Refer to drawing posted at www.rfmd.com for tolerances
RF Micro Devices Inc. 7628 Thorndike Road, Greensboro, NC 27409-9421
DS140204
For sales or technical support, contact RFMD at +1.336.678.5570 or [email protected].
The information in this publication is believed to be accurate. However, no responsibility is assumed by RF Micro Devices, Inc. ("RFMD") for its use, nor for any infringement of patents or other rights of
third parties resulting from its use. No license is granted by implication or otherwise under any patent or patent rights of RFMD. RFMD reserves the right to change component circuitry, recommended
application circuitry and specifications at any time without prior notice.
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5 Page |
Páginas | Total 7 Páginas | |
PDF Descargar | [ Datasheet SDA-3000.PDF ] |
Número de pieza | Descripción | Fabricantes |
SDA-3000 | GaAs Distributed Amplifier | RF Micro Devices |
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