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PDF EClamp8052P Data sheet ( Hoja de datos )

Número de pieza EClamp8052P
Descripción 2-Line Common Mode Filter and Low Capacitance ESD Protection
Fabricantes Semtech Corporation 
Logotipo Semtech Corporation Logotipo



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EClamp8052P
2-Line Common Mode Filter
and Low Capacitance ESD Protection
PROTECTION PRODUCTS - EMIClamp®
PRELIMINARY
Description
Features
EClamp®8052P integrates common mode filtering with
low capacitance ESD protection and is designed
specifically for MIPI, MHL, and HDMI interfaces. Each
device provides filtering and ESD protection for one
high-speed differential pair.
EClamp8052P is an easily implemented solution for
replacing discrete common mode chokes and ESD
protection devices in a single package. These devices
utilize silicon avalanche technology for superior ESD
and TLP clamping performance. They feature high
maximum ESD withstand voltage of +/- 25kV contact,
+/-30kV air discharge per IEC 61000-4-2. The inte-
grated common-mode choke has a typical differential
mode cutoff frequency >3GHZ and typical common
mode suppression of 10dB at 500MHz and 15dB from
1GHz to 2.8GHz. Each channel series resistance is
1.8 Ohms maximum.
EClamp8052P is in a 7-pin SGP1917N5 package,
measuring 1.9 x 1.7mm with a nominal height of
0.55mm. The leads have a nominal pin-to-pin pitch of
0.50mm. Flow- through package design simplifies PCB
layout and maintains signal integrity on high-speed
lines.
ESD protection for high-speed data lines to
IEC 61000-4-2 (ESD) ±30kV (air), ±25kV (contact)
IEC 61000-4-5 (Lightning) 6A (8/20μs)
IEC 61000-4-4 (EFT) 40A (5/50ns)
Package design optimized for high speed lines
ESD protection and common mode filtering for two
high-speed lines
High differential bandwidth cutoff frequency
Qualified to AECQ-100
Low ESD clamping voltage
Low dynamic resistance: 0.50 Ohms (Typ)
Solid-state silicon-avalanche technology
Mechanical Characteristics
SGP1917N5 package
Pb-Free, Halogen Free, RoHS/WEEE Compliant
Molding compound flammability rating: UL 94V-0
Marking: Marking code + date code
Packaging: Tape and Reel
Applications
MIPI Camera Serial Interface (CSI)
MIPI Display Serial Interface (DSI)
HDMI Interfaces
MHL Interfaces
USB 2.0 Interfaces
Circuit Diagram
Pin Configuration (Top View)
I/O+ In
I/OIn
GND
I/O+ Out
I/OOut
I/O+ In 1
I/OIn
I/O+ Out
I/OOut
GND
Revision 8/5/2014 1 www.semtech.com

1 page




EClamp8052P pdf
PROTECTION PRODUCTS
Typical Characteristics
ESD Clamping (+8kV Contact per IEC 61000-4-2)
150
130
110
90
70
50
30
10
10
10
Measured with 50 Ohm scope input
impedance, 2GHz bandwidth. Corrected
for 50 Ohm, 20dB attenuator. ESD gun
return path connected to ESD ground plane. 
Pin1 or 2 to GND,TA = 25OC
0 10 20 30 40 50 60
Time (ns)
TLP Characteristic (Positive)
EC8052P_AR_ESDP8
70 80
30
TA = 25OC
TP = 100ns
25
TR = 0.2ns
0.7TP < TSAMPLE < 0.9TP
20
EClamp8052P
PRELIMINARY
ESD Clamping (-8kV Contact per IEC 61000-4-2)
0
20
40
60
80
100
120
140
160
10
Measured with 50 Ohm scope input
impedance, 2GHz bandwidth. Corrected
for 50 Ohm, 20dB attenuator. ESD gun
return path connected to ESD ground plane. 
Pin1 or 2 to GND,TA = 25OC
EC8052P_AR_ESDN8
0 10 20 30 40 50 60 70 80
Time (ns)
TLP Characteristic (Negative)
0
TA = 25OC
TP = 100ns
5
TR = 0.2ns
0.7TP < TSAMPLE < 0.9TP
10
15 15
10 20
5
EC8052P_AR_TLPP
0
0 5 10 15 20 25 30
VDUT (V)
Clamping Voltage vs. Peak Pulse Current (tp=8/20us)
25
30
25
20 15 10
5
VDUT (V)
Reverse Leakage vs. Temperature
EC8052P_AR_TLPN
0
20
TA = 25OC
18 tr = 8µs
td = 20µs
16 Surge applied and measured on same pin
14
12
10
8
6
4
2
0
01234
Peak Pulse Current ‐ IPP (A)
I/O  IN (Input Side)
EC8052P_AR_8_20
567
© 2014 Semtech Corporation
8
VR = 5V
Any Pin to GND
6
4
2
0
50
5
0
50
Temperature (OC)
100
EC8052P_AR_IR
150
www.semtech.com

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