|
|
PDF ADNS-7550 Data sheet ( Hoja de datos )
| Número de pieza | ADNS-7550 | |
| Descripción | Integrated molded lead-frame DIP Sensor | |
| Fabricantes | AVAGO | |
| Logotipo |  |
|
Hay una vista previa y un enlace de descarga de ADNS-7550 (archivo pdf) en la parte inferior de esta página. Total 30 Páginas | ||
|
No Preview Available !
ADNS-7550
Integrated molded lead-frame DIP Sensor
Data Sheet
Theory of Operation
The ADNS-7550 integrated molded lead-frame DIP
sensor comprises of sensor and VCSEL in a single
package.
The advanced class of VCSEL was engineered by Avago
Technologies to provide a laser diode with a single lon-
gitudinal and a single transverse mode. In contrast to
most oxide-based single-mode VCSEL, this class of Avago
VCSEL remains within single mode operation over a wide
range of output power. It has significantly lower power
consumption than a LED. It is an excellent choice for
optical navigation applications.
The sensor is based on LaserStream™ technology, which
measures changes in position by optically acquiring se-
quential surface images (frames) and mathematically
determining the direction and magnitude of movement.
It contains an Image Acquisition System (IAS), a Digital
Signal Processor (DSP), and a four wire serial port. The IAS
acquires microscopic surface images via the lens and il-
lumination system. These images are processed by the
DSP to determine the direction and distance of motion.
The DSP calculates the Δx and Δy relative displacement
values. An external microcontroller reads the Δx and Δy
information from the sensor serial port. The microcon-
troller then translates the data into PS2, USB, or RF signals
before sending them to the host PC or game console.
Features
• Wide operating voltage: 4.0V-5.25V.
• Small form factor, integrated molded lead-frame chip-
on-board package
• LaserStream™ technology
• High speed motion detection up to 30 ips and 8g
• Enhanced SmartSpeed self-adjusting frame rate for
optimum performance
• Motion detect pin output
• 12-bits motion data registers.
• Internal oscillator – no clock input needed.
• Selectable 400, 800, 1200, 1600, 2000 cpi resolution.
• Four wire serial port
• Minimal number of passive components
• Laser fault detect circuitry on-chip for Eye Safety
Compliance
• Advanced Technology VCSEL chip
• Single Mode Lasing operation
• 832-865 nm wavelength
Applications
• Laser Mice
• Optical trackballs
• Integrated molded lead-frame input devices
1 page  
Assembly Recommendation
1. Insert the integrated molded lead-frame DIP
sensor and all other electrical components into the
application PCB.
2. This sensor package is only qualified for wave-solder
process.
3. Wave-solder the entire assembly in a no-wash solder
process utilizing a solder fixture. The solder fixture
is needed to protect the sensor during the solder
process. The fixture should be designed to expose
the sensor leads to solder while shielding the optical
aperture from direct solder contact.
4. Place the lens onto the base plate. Care must be taken
to avoid contamination on the optical surfaces.
5. Remove the protective kapton tapes from the optical
aperture of the sensor and VCSEL respectively. Care
must be taken to keep contaminants from entering
the aperture.
6. Insert the PCB assembly over the lens onto the base
plate. The sensor package should self-align to the lens.
The optical position reference for the PCB is set by the
base plate and lens. The alignment guide post of the
lens locks the lens and integrated molded lead-frame
DIP sensor together. Note that the PCB motion due to
button presses must be minimized to maintain optical
alignment.
7. Optional: The lens can be permanently locked to the
sensor package by melting the lens’ guide posts over
the sensor with heat staking process.
8. Tune the laser output power from the VCSEL to meet
the Eye Safe Class I Standard as detailed in the LASER
Power Adjustment Procedure.
9. Install the mouse top case. There must be a feature in
the top case (or other area) to press down onto the
sensor to ensure the sensor and lenses are interlocked
to the correct vertical height.
Design considerations for improving ESD Performance
For improved electrostatic discharge performance,
typical creepage and clearance distance are shown in
the table below. Assumption: base plate construction as
per the Avago supplied IGES file and ADNS-6150, ADNS-
6160-001 or ADNS-6170-002 lens:
Lens
Creepage
Clearance
ADNS-6150
12.0 mm
2.1 mm
ADNS-6160-001
13.50 mm
1.28 mm
ADNS-6170-002
20.30 mm
1.28 mm
Note that the lens material is polycarbonate and
therefore, cyanoacrylate based adhesives or other
adhesives that may damage the lens should NOT be
used.
14.18
0.558
7X 1.78
0.070
3.18 Lens interference 2.31
0.125 0.091
(2.78)
0.110
0 Pin #1
0
Optical center
0.89
0.035
13.35
0.526
Figure 5. Recommended PCB mechanical cutouts and spacing
5
∅ 1.10
0.043
16X ∅ 0.70
0.028
Pad ring
5 Page 
Figure 9. Recommended Soldering Reflow Profile
DC Electrical Specifications
Electrical Characteristics over recommended operating conditions. (Typical values at 25 °C, VDD=5.0 V, VDDIO= 2.8V)
Parameter
DC Supply Current
in various modes
Peak Supply Current
Shutdown Supply
Current
Input Low Voltage
Input High Voltage
Input Hysteresis
Input Leakage Current
XY_LASER Current
Symbol
IDD_RUN
IDDSTDWN
VIL
VIH
VI_HYS
Ileak
ILAS
Minimum Typical Maximum Units
2.8 3.5
mA
40
150 200
mA
μA
0.8VDDIO
100
±1
0.8
0.2VDDIO
±10
V
V
mV
μA
mA
Notes
Average current, including LASER current.
No load on MISO, MOTION.
NCS, SCLK = VDDIO
MOSI, MISO = Hi-Z
SCLK, MOSI, NCS
SCLK, MOSI, NCS
SCLK, MOSI, NCS
Vin = 0.7*VDDIO , SCLK, MOSI, NCS
VXY_LASER >=0.3V
LSRPWR_CFG0 = 0xFF
LSRPWR_CFG 1 = 0x00
Laser Current (fault mode) ILAS_FAULT
Output Low Voltage,
MISO, MOTION
VOL
Output High Voltage,
MISO, MOTION
VOH
Output Low Voltage,
LASER_NEN
VOL
Output High Voltage,
LASER_NEN
VOH
Input Capacitance
Cin
0.8*VDDIO
0.8*VREFB
300 uA
0.2*VDDIO V
V
0.2*VREFB V
V
10 pF
XY_LASER Rleakage < 75kOhms to Gnd
Iout=1mA, MISO, MOTION
Iout=-1mA, MISO, MOTION
Iout= 1mA, LASER_NEN
Iout= -0.5mA, LASER_NEN
MOSI, NCS, SCLK
11
11 Page | ||
| Páginas | Total 30 Páginas | |
| PDF Descargar | [ Datasheet ADNS-7550.PDF ] | |
Hoja de datos destacado
| Número de pieza | Descripción | Fabricantes |
| ADNS-7550 | Integrated molded lead-frame DIP Sensor |  PixArt |
| ADNS-7550 | Integrated molded lead-frame DIP Sensor | AVAGO |
| Número de pieza | Descripción | Fabricantes |
| SLA6805M | High Voltage 3 phase Motor Driver IC. |
 Sanken |
| SDC1742 | 12- and 14-Bit Hybrid Synchro / Resolver-to-Digital Converters. |
 Analog Devices |
|
DataSheet.es es una pagina web que funciona como un repositorio de manuales o hoja de datos de muchos de los productos más populares, |
| DataSheet.es | 2020 | Privacy Policy | Contacto | Buscar |