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ACPM-7382 Schematic ( PDF Datasheet ) - Avago

Teilenummer ACPM-7382
Beschreibung UMTS Band1 (1920-1980MHz) 4x4 Power Amplifier Module
Hersteller Avago
Logo Avago Logo 




Gesamt 16 Seiten
ACPM-7382 Datasheet, Funktion
ACPM-7382
UMTS Band1 (1920-1980MHz) 4x4 Power Amplifier Module
Data Sheet
Description
The ACPM-7382 is a fully matched 10-pin surface mount
module developed for UMTS Band1. This power amplifier
module operates in the 1920-1980MHz bandwidth. The
ACPM-7382 meets stringent UMTS linearity requirements
up to 28.25dBm output power. The 4mmx4mm form fac-
tor package is self contained, incorporating 50ohm input
and output matching networks
The ACPM-7382 features 5th generation of CoolPAM cir-
cuit technology which supports 3 power modes – bypass,
mid and high power modes. The CoolPAM is stage bypass
technology enhancing PAE (power added efficiency) at
low and medium power range. Active bypass feature is
added to 5th generation to enhance PAE further at low
output range. This helps to extend talk time.
The power amplifier is manufactured on an advanced
InGaP HBT (hetero-junction Bipolar Transistor) MMIC (mi-
crowave monolithic integrated circuit) technology offer-
ing state-of-the-art reliability, temperature stability and
ruggedness.
Block Diagram
Features
Thin Package (0.9mm typ)
Excellent Linearity
3-mode power control with Vbp and Vmode
Bypass / Mid Power Mode / High Power Mode
High Efficiency at max output power
10-pin surface mounting package
Internal 50ohm matching networks for both RF input
and output
Lead-free, RoHS compliant, Green
Applications
UMTS Band1
Ordering Information
Part Number
ACPM-7382-TR1
ACPM-7382-BLK
Number of
Devices
1,000
100
Container
178mm (7”) Tape/Reel
BULK






ACPM-7382 Datasheet, Funktion
CoolPAM
Avago Technologies’ CoolPAM is stage-bypass PA technol-
ogy which saves more power compared with convention-
al PA. With this technology, the ACPM-7382 has very low
quiescent current, and efficiencies at low and medium
output power ranges are high.
Incorporation of bias circuit
The ACPM-7382 has internal bias circuit, which removes
the need for external constant voltage source (LDO). PA
on/off is controlled by Ven. This is digitally control pin.
3-mode power control with two mode control pins
The ACPM-7382 supports three power modes ( bypass
power mode/mid power mode/high power mode) with
two mode control pins (Vmode and Vbp). This control
scheme enables the ACPM-7382 to save power consump-
tion more, which accordingly gives extended talk time.
PDF (probability density function) showing distribution
of output power of mobile in real field gives motivation
for stage-bypass PA. Output power is less than 16dBm for
most of operating time (during talking), so it is important
to save power consumption at low and medium output
power ranges.
PDF and Current
Average current & Talk time
Average current consumed by PA can be calculated by
summing up current at each output power weighted with
probability. So it is expressed with integration of multipli-
cation of current and probability at each output power.
Talk time is extended more as average current consump-
tion is lowered.
Mode control pins
Vmode and Vbp are digitally controlled by baseband and
they control the operating mode of the PA. The operating
logic table is summarized on the page 2. These pins do not
require constant voltage for interface. .
UMTS PA performance comparison
– CoolPAM 4 and CoolPAM 5
450
400
350
300
250
200
150
100
50
0
-10
CP5
CP4
0
10
Pout(dBm)
20
30
70
60
50
40
30
20
10
CP5
CP4
0-10 -8 -6 -4 -2 0 2 4 6 8 10 12 14 16
Pout(dBm)
Icc Comparison of CP5 to CP4 (Avago CoolPAM)
The 5th generation of CoolPAM technology, ACPM-7382
can dramatically reduce Icc down to 3mA at bypass mode,
which improves overall talk time and battery usage time
of handset more compared with the CP4.


6 Page









ACPM-7382 pdf, datenblatt
Handling and Storage
ESD (Electrostatic Discharge)
Electrostatic discharge occurs naturally in the environ-
ment. With the increase in voltage potential, the outlet of
neutralization or discharge will be sought. If the acquired
discharge route is through a semiconductor device, de-
structive damage will result.
ESD countermeasure methods should be developed and
used to control potential ESD damage during handling in
a factory environment at each manufacturing site.
MSL (Moisture Sensitivity Level)
Plastic encapsulated surface mount package is sensitive
to damage induced by absorbed moisture and tempera-
ture.
Avago Technologies follows JEDEC Standard J-STD 020B.
Each component and package type is classified for mois-
ture sensitivity by soaking a known dry package at vari-
ous temperatures and relative humidity, and times. After
soak, the components are subjected to three consecutive
simulated reflows.
The out of bag exposure time maximum limits are de-
termined by the classification test describe below which
corresponds to a MSL classification level 6 to 1 according
to the JEDEC standard IPC/JEDEC J-STD-020B and J-STD-
033.
ACPM-7382 is MSL3. Thus, according to the J-STD-033
p.11 the maximum Manufacturers Exposure Time (MET)
for this part is 168 hours. After this time period, the part
would need to be removed from the reel, de-taped and
then re-baked. MSL classification reflow temperature for
the ACPM-7382 is targeted at 260° +0/-5°. Figure and ta-
ble on next page show typical SMT profile for maximum
temperature of 260 +0/-5°.
Moisture Classification Level and Floor Life
MSL Level
1
2
Floor Life (out of bag) at factory ambient 30°C/60% RH or as stated
Unlimited at 30°C/85% RH
1 year
2a 4 weeks
3 168 hours
4 72 hours
5 48 hours
5a 24 hours
6 Mandatory bake before use.
After bake, must be reflowed within
the time limit specified on the label
Note :
1. The MSL Level is marked on the MSL Label on each shipping bag.
12

12 Page





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