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PDF GL5ZS302BOS Data sheet ( Hoja de datos )

Número de pieza GL5ZS302BOS
Descripción DEVICE SPECIFICATION FOR Light Emitting Diode
Fabricantes Sharp Electrionic Components 
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No Preview Available ! GL5ZS302BOS Hoja de datos, Descripción, Manual

PREPARED BY:
Lvl
-7’- . tieda
APPROVED BY:
Jk
3-F “LAS
DATE:
-WI
DATE:
/ ,t/97
-
ELECTRONIC COMPONENTS GROUP
SHARP CORPOFNI’ION
SPlkIFICATION
SPECNo.
DC396029
J&16/99
::: 10 Pages
REPRESENTATIVE DIVISION:
Opto-Electronic Devices Division
DEVICE SPECIFICATION FOR
Light Emitting Diode
MODEL No.
GL5ZS302BOS
1. These specification sheets include materials protected under the copyright of Sharp Corporation (“Sharp”).
Please do not reproduce or cause anyone to reproduce them without Sharp’s consent.
2. When using this product, please observe the absolute maximum ratings and the instructions for use outlined
in these specification sheets, as well as the precautions mentioned below. Sharp assumes no responsibility
for any damage resulting from use of the product which does not comply with the absolute maximum ratings
and the instructions included in these specification sheets, and the precautions mentioned below.
(Precautions)
(1) This products is designed for use in the following application areas:
* OA equipment * Audio visual equipment * Home appliance
* Telecommunication equipment (Terminal) * Measuring equipment
r * Tooling machines * Computers
1
If the use of the product in the above application areas is for equipment listed in paragraphs
(2) or (3). please be sure to observe the precautions given in those respective paragraphs.
(2) Appropriate measures, such as fail-safe design and redundant design considering
the safety design of the overall system and equipment, should be taken to ensure reliability
and safety when this product is used for equipment which demands high reliability and
safety in function and precision, such as ;
* Transportation control and safety equipment (aircraft, train, automobile etc.)
* Traffic signals * Gas leakage sensor breakers * Rescue and security equipment
[ * Other safety equipment
I
(3) Please do not use this product for equipment which require extremely high reliability
and safety in function and precision, such as ;
* Space equipment * Telecommunication equipment (for trunk lines)
i * Nuclear power control equipment * Medical equipment
1
(4) Please contact and consult with a Sharp sales representative if there are any questions
regarding interpretation of the above three paragraphs.
3. Please contact and consult with a Sharp sales representative for any questions about this product.
CUSTOMER’S APPROVAL
DATE:
BY:
DATE:
&,i //c$
PRESENTED BY:
9-i , ./kzzzq2
M.Katoh,
Department General Manager of
Engineering Dept.m
Opto-Electronic Devices Division
Electronic Components Group
SHARP CORPORATION
/99)’

1 page




GL5ZS302BOS pdf
Peak Forward Current
vs. Duty Ratio
(Ta=25%)
DG996029
MODEL No.
GL5ZS302BOS
Jun/16/99
PAGE
4110
10
l/100
l/10
Duty Raito
1
DR
10
3-4. Characteristics Diagram(typ) (Note 1)
Forward Current vs.Forward
100 I
Voltage
(Ta=25”C)
1
10
0. 1
1
1.2 1.4 1.6 1.8 2 2.2 2.42.6
Forward Vo I tage VF (VI
Relative Ominous Intensity
1000
vs. Froward Voltaca
(Ta=ZS’C)
.5-Ln 100
2
:
10
2
O-
.r 5
E1
3
.-,” 0. 1
z
Relative Luminous Intensity
vs. Ambient Temperature
( I F=2OmA)
1000
.$-
scc*
liiiiiiiiiiiiiiil
j 1 j j / / / //
ii 100
.-ea v
-I5
Ii ii
.-z
%I
-E 10
-60-40-20
0 20 40 60 80 100 120
Ambient Temprature
Ta (“C).
0. 1 1
10 100
Forward Current IFGnAI
(Note 1) Above characteristic data are typical data and not a guarantteed data.

5 Page





GL5ZS302BOS arduino
DG996029
MODEL No.
GL5ZS302BOS
I Jun/16/99
( PAGE
lo/lo
7 - 3. Soldering Conditions
Solder the lead pins under the following conditions
Type of S oldering I
Conditions
1. Manual soldering
295”C*S”C, within 3 seconds
2. Wave soldering
260°C+S”C, within 5 seconds
3. Auto soldering
P reheating 70°C to 8O”c, within 30 seconds
S oldering 245°C25°C. within 5 seconds
(Note) Avoid dipping resin into soldering bath
Avoid applying stress to lead pins while they are heated.For example ,
whenthe LEDlamp is moved with the heat applied to the lead pins during
manual soldering or solder repair, disconnection mayoccur.
7 - 4. For cleaning
( 1) Solvent cleaning : Solvent temperature 45°C or less
Immersion for 3 min or less
(2) Ultrasonic cleaning : The effect to device by ultrasonic cleaning differs
by cleaning bath size.ultrasonic power
output, cleaning time, PYBsize or device mounting
condition etc. Please test it in actual using condition
and confirm that doesn’t occur any defect before starting
the ultrasonic cleaning.
<3 > Applicable solvent : Ethyl alcohol, Methyl alcohol, Isopropyl alcohol
In case when the other solvent is used,there are cases that
the packaging resin is eroded Please use the other solvent
after thorough confirmation is performed in actual using condition.

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