|
|
Teilenummer | GT9P-19P-2.54DSA |
|
Beschreibung | Developed for Equipment Exposed to Harsh Environmental Conditions | |
Hersteller | Hirose Electric | |
Logo | ||
Gesamt 5 Seiten Interface Portions and In-line Portions of the Various Units and Devices
GT9 Series
Developed for Equipment
Exposed to Harsh Environmental Conditions
<12 Pos., 15 Pos., 16 Pos., 18 Pos., 19 Pos., and 25 Pos.>
Features
Bottom entry type
High-pressure type with dimple processing at contact portion
Flux prevention processing specification also available.* (Specification 05)
* Flux prevention processing: The hole connector is immersed in a flux prevention processing liquid and the
surface is coated to prevent flux wicking.
Custom orders of other numbers of Pos. can be accommodated.
Applications
Automotive equipment, IPM, and IGBT.
2003.7
| ||
Seiten | Gesamt 5 Seiten | |
PDF Download | [ GT9P-19P-2.54DSA Schematic.PDF ] |
Teilenummer | Beschreibung | Hersteller |
GT9P-19P-2.54DSA | Developed for Equipment Exposed to Harsh Environmental Conditions | Hirose Electric |
GT9P-19P-2.54DSA05 | Developed for Equipment Exposed to Harsh Environmental Conditions | Hirose Electric |
GT9P-19P-2.54DSA12 | Developed for Equipment Exposed to Harsh Environmental Conditions | Hirose Electric |
GT9P-19P-2.54DSA13 | Developed for Equipment Exposed to Harsh Environmental Conditions | Hirose Electric |
Teilenummer | Beschreibung | Hersteller |
CD40175BC | Hex D-Type Flip-Flop / Quad D-Type Flip-Flop. |
Fairchild Semiconductor |
KTD1146 | EPITAXIAL PLANAR NPN TRANSISTOR. |
KEC |
www.Datenblatt-PDF.com | 2020 | Kontakt | Suche |