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ACPM-7881 Schematic ( PDF Datasheet ) - Agilent

Teilenummer ACPM-7881
Beschreibung W-CDMA Power Amplifier
Hersteller Agilent
Logo Agilent Logo 




Gesamt 12 Seiten
ACPM-7881 Datasheet, Funktion
Agilent ACPM-7881
W-CDMA Power Amplifier
Data Sheet
Description
The ACPM-7881 is a high
performance W-CDMA power
amplifier module offered in a
4x4x1.1mm package. Designed
around Agilent Technologies’
GaAs Enhancement Mode
pHEMT process, the ACPM-
7881 offers premium power
added efficiency and linearity
in a very small form factor.
The PA is fully matched to 50
Ohms on the input and output.
Functional Block Diagram
Vdd1
(1)
Vdd3
(10)
The amplifier has excellent
ACLR and efficiency
performance at max Pout,
28.5dBm, and low quiescent
current (50mA) with a single
bias control voltage, Vctrl =
2.0V. No regulated voltages
are required to set the bias,
Vdd2 can be connected directly
to the battery.
Designed in a surface mount
RF package, the ACPM-7881 is
very cost and size competitive.
Features
Operating frequency: 1920 - 1980
MHz
28.5 dBm Linear Output Power @
3.5V
High Efficiency 46% PAE
Single bias, low quiescent current
(50mA)
Internal 50 ohm matching
networks for both RF input &
output
No regulated voltages required
3.2 - 4.5 V linear operation
4.0 x 4.0mm SMT Package
Low package profile, 1.1mm
Applications
W-CDMA Handsets
Data Cards
PDAs
RF in
(2)
Bias Control
MMIC
Output
Match
Module
Vctrl
Vdd2
Gnd
(4) (5) (3,6,7,9)
RF out
(8)






ACPM-7881 Datasheet, Funktion
-20
-25
-30
-35
-40
-45
-50
-55
-60
-65
-70
-10 -5 0 5 10 15 20 25 30
Pout (dBm)
Figure 9. ACLR2 vs Pout
30
29
28
27
26
25
24
23
22
21
20
-25 -20 -15 -10 -5 0 5 10 15 20 25 30
Pout (dBm)
Figure 10. Gain vs Pout
Data measured at 1980MHz
60
50
40
30
20
10
0
-10 -5 0
5 10 15 20 25 30
Pout (dBm)
Figure 11. PAE vs Pout
-20
-25
-30
-35
-40
-45
-50
-55
-60
-65
-70
-10 -5 0 5 10 15 20 25 30
Pout (dBm)
Figure 14. ACLR2 vs Pout
600
500
400
300
200
100
0
-10 -5 0
5 10 15 20 25 30
Pout (dBm)
Figure 12. Total Idd vs Pout
30
29
28
27
26
25
24
23
22
21
20
-25 -20 -15 -10 -5 0 5 10 15 20 25 30
Pout (dBm)
Figure 15. Gain vs Pout
-20
-25
-30
-35
-40
-45
-50
-55
-60
-10 -5 0
5 10 15 20 25 30
Pout (dBm)
Figure 13. ACLR1 vs Pout
6

6 Page









ACPM-7881 pdf, datenblatt
Solder Paste Recommendation
The ACPM-7881 package is a
lead free package that was
proven to pass MSL3 when
reflowed under lead free
solder reflow profile. The
recommended lead free solder
for SMT reflow is Sn-Ag-Cu
(95.5% Tin, 3.8% Silver, 0.7%
Copper) or other similar Sn-
Ag-Cu solders. This lead free
solder paste has a melting
point of 218°C (423°F), the
ternary eutectic of Sn-Ag-Cu
system, giving it the advantage
of being the lowest melting
lead free alternative. This
temperature is still low enough
to protect from damaging the
internal circuitry during solder
reflow operations provided the
exposure time at peak reflow
temperatures is not too
excessive.
In certain situations, the
designer may use leaded solder
paste for reflow. The
recommended solder for
mounting ACPM-7881 package
is Sn63 (63% Sn, 37% Pb). It is
a eutectic compound with a
typical melting point of 183°C.
www.agilent.com/
semiconductors
For product information and a complete list
of distributors, please go to our web site.
For technical assistance call:
Americas/Canada: +1 (800) 235-0312
or (408) 654-8675
Europe: +49 (0) 6441 92460
China: 10800 650 0017
Hong Kong: (+65) 6756 2394
India, Australia, New Zealand: (+65) 6755 1939
Japan: (+81 3) 3335-8152(Domestic/Inter-
national), or 0120-61-1280(Domestic Only)
Korea: (+65) 6755 1989
Singapore, Malaysia, Vietnam, Thailand,
Philippines, Indonesia: (+65) 6755 2044
Taiwan: (+65) 6755 1843
Data subject to change.
Copyright © 2004 Agilent Technologies, Inc.
Novermber 4, 2004
5989-1894EN

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