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ABA-31563 Schematic ( PDF Datasheet ) - Agilent

Teilenummer ABA-31563
Beschreibung 3.5 GHz Broadband Silicon RFIC Amplifier
Hersteller Agilent
Logo Agilent Logo 




Gesamt 8 Seiten
ABA-31563 Datasheet, Funktion
Agilent ABA-31563
3.5 GHz Broadband Silicon
RFIC Amplifier
Data Sheet
Features
• Operating Frequency DC ~ 3.5GHz
• 21.5 dB Gain
• VSWR < 2.0 throughout operating
frequency
• 2.2 dBm Output P1dB
Description
Agilent’s ABA-31563 is an
economical, easy-to-use, inter-
nally 50matched, silicon
monolithic broadband amplifier
that offers excellent gain and
broadband response from DC to
3.5 GHz. Packaged in an ultra-
miniature SOT-363 package, it
requires half the board space of
a SOT-143 package.
At 2 GHz, the ABA-31563 offers
a small-signal gain of 21.5 dB,
output P1dB of 2.2 dBm and
13.1 dBm output third order
intercept point. It is suitable for
use as wideband applications.
They are designed for low cost
gain blocks in cellular applica-
tions, DBS tuners, LNB and other
wireless communication systems.
Surface Mount Package
SOT-363 /SC70
Pin Connections and
Package Marking
GND 1
GND 2
Input
Output
& Vcc
GND 3
Vcc
Note:
Top View. Package marking provides orientation
and identification. “x” is the date code.
• 13.1 dBm Output IP3
• 3.8 dB Noise Figure
• Unconditionally Stable
• Single 3V Supply (Id = 14 mA)
• Lead-free
Applications
• Amplifier for Cellular, Cordless,
Special Mobile Radio, PCS, ISM,
Wireless LAN, DBS, TVRO, and TV
Tuner Applications
Attention:
Observe precautions for
handling electrostatic
sensitive devices.
ESD Machine Model (Class A)
ESD Human Body Model (Class 1B)
ABA-31563 is fabricated using
Agilent’s HP25 silicon bipolar
process, which employs a double-
diffused single polysilicon
process with self-aligned submi-
cron emitter geometry. The
process is capable of simulta-
neous high fT and high NPN
breakdown (25 GHz fT at 6V
BVCEO). The process utilizes
industry standard device oxide
isolation technologies and
submicron aluminum multilayer
interconnect to achieve superior
performance, high uniformity,
and proven reliability.
Simplified Schematic
Vcc
RF
Input
Ground 2
Ground 3
Refer to Agilent Application Note A004R:
Electrostatic Discharge Damage and Control.
RF
Output
& Vcc
Ground 1






ABA-31563 Datasheet, Funktion
Device Models
Refer to Agilent’s web site
www.agilent.com/view/rf
Ordering Information
Part Number
Devices per Container
ABA-31563-TR1G
3000
ABA-31563-TR2G
10000
ABA-31563-BLKG
100
Note: Only lead-free option available.
Container
7" reel
13" reel
antistatic bag
Package Dimensions
Outline 63 (SOT-363/SC-70)
Recommended PCB Pad Layout for
Agilent's SC70 6L/SOT-363 Products
0.026
HE E
e
D
A1
b
A2 A
Q1
L
0.039
0.079
0.018
Dimensions in inches.
c
SYMBOL
E
D
HE
A
A2
A1
Q1
e
b
c
L
DIMENSIONS (mm)
MIN.
MAX.
1.15 1.35
1.80 2.25
1.80 2.40
0.80 1.10
0.80 1.00
0.00 0.10
0.10 0.40
0.650 BCS
0.15 0.30
0.10 0.20
0.10 0.30
NOTES:
1. All dimensions are in mm.
2. Dimensions are inclusive of plating.
3. Dimensions are exclusive of mold flash & metal burr.
4. All specifications comply to EIAJ SC70.
5. Die is facing up for mold and facing down for trim/form,
ie: reverse trim/form.
6. Package surface to be mirror finish.
6

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