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ACPF-7024 Schematic ( PDF Datasheet ) - AVAGO

Teilenummer ACPF-7024
Beschreibung ISM Bandpass Filter
Hersteller AVAGO
Logo AVAGO Logo 




Gesamt 9 Seiten
ACPF-7024 Datasheet, Funktion
ACPF-7024
ISM Bandpass Filter (2401 – 2482 MHz)
Data Sheet
Description
The Avago ACPF-7024 is a miniaturized Bandpass Filter
designed for use in the 2.4 GHz Industrial, Scientific and
Medical (ISM) band.
The ACPF-7024 is designed to enable concurrent operation
of Wireless LAN and Bluetooth applications which coexist
with other wireless standards, such as 2.5 GHz WiMAX,
PCS, and LTE Bands 7 and 40, without performance degra-
dations due to interference.
The ACPF-7024 is designed with Avago Technologies’ in-
novative Film Bulk Acoustic Resonator (FBAR) technol-
ogy, which makes possible ultra-small, high-Q filters at a
fraction of their usual size.
The ACPF-7024 also utilizes Avago Technologies’advanced
Microcap bonded-wafer technology. This chip scale min-
iaturization process results in a package footprint of only
1.6 x 2.0 mm with a maximum height of 0.95 mm
The ACPF-7024 is compatible with high volume, lead-free
SMT soldering processes and can be direct surface
mounted to a PCB or a transfer molded module.
Functional Block Diagram
Features
 50 Input/Output
 No external matching required
 Low Insertion Loss, High Interference Rejection
 Miniature Size
– 1.6 x 2.0 mm size
– 0.95 mm Max Height
 High Power Rating
– +27 dBm Abs Max Input Power
 Environmental
– RoHS 6 Compliant
– Halogen free
– TBBPA Free
Specifications
 Performance guaranteed -30° to +85°C
 Low Insertion Loss
Applications
802.11 b/g/n WLAN or Bluetooth datacom in handsets,
mobile and portable communications devices.
Port 1
Port 2






ACPF-7024 Datasheet, Funktion
ACPF-7024
A PCB layout using the principles illustrated in the figure
above is recommended to optimize performance of the
ACPF-7024.
Note: This filter is symmetrical; either port can be used for
either the Input or Output.
It is important to maximize isolation between the Input
and Output ports to maintain out-of-band rejection.
High isolation is achieved by: (1) maintaining a continu-
ous ground plane around the I/O connections, and (2)
surrounding the I/O ports with sufficient ground vias to
enclose the connections in a “Faraday cage.”
Figure 15. ACPF-7024 Superposed on PCB Layout (top view)
Figure 16. Recommended Solder Stencil (top view)
6
Notes:
1. Dimensions in mm
2. Top view
3. Chamfer or radius all corners 0.05 mm min

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