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PDF PC900V0YIZXF Data sheet ( Hoja de datos )
| Número de pieza | PC900V0YIZXF | |
| Descripción | Photocoupler | |
| Fabricantes | Sharp | |
| Logotipo |  |
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Hay una vista previa y un enlace de descarga de PC900V0YIZXF (archivo pdf) en la parte inferior de esta página. Total 16 Páginas | ||
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PC900V0NSZXF Series
PC900V0NSZXF
Series
Digital Output, Normal OFF
Operation DIP 6 pin ∗OPIC
Photocoupler
■ Description
PC900V0NSZXF Series contains an IRED optically
coupled to an OPIC chip.
It is packaged in a 6 pin DIP, available in SMT
gullwing lead-form and Wide SMT gullwing lead-form
option.
Input-output isolation voltage(rms) is 5.0kV.
■ Features
1. 6 pin DIP package
2. Double transfer mold package
(Ideal for Flow Soldering)
3. Normal OFF operation, open collector output
4. TTL and LSTTL compatible output
5. Operating supply voltage (VCC : 3 to 15 V)
6. Isolation voltage (Viso(rms) : 5.0 kV)
7. Lead-free and RoHS directive compliant
■ Agency approvals/Compliance
1. Recognized by UL1577 (Double protection isolation),
file No. E64380 (as model No. PC900V)
2. Approved by VDE, DIN EN60747-5-2(∗) (as an
option), file No. 40008189 (as model No. PC900V)
3. Package resin : UL flammability grade (94V-0)
(∗)DIN EN60747-5-2 : successor standard of DIN VDE0884
■ Applications
1. Programmable controllers
2. PC peripherals
3. Electronic musical instruments
∗ "OPIC"(Optical IC) is a trademark of the SHARP Corporation. An OPIC consists of a light-detecting element and a signal-processing
circuit integrated onto a single chip.
Notice The content of data sheet is subject to change without prior notice.
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP
devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
Sheet No.: D2-A05302EN
1 Date Jun. 30. 2005
© SHARP Corporation
1 page  
■ Absolute Maximum Ratings
(Ta=25˚C)
Parameter
Symbol Rating
Unit
Input
Forward current
*1 Peak forward current
Reverse voltage
Power dissipation
IF
IFM
VR
P
50 mA
1A
6V
70 mW
Supply voltage VCC
16
V
High level output voltage
Output
VOH
16
V
Low level output current IOL
50 mA
Power dissipation PO
150 mW
Total power dissipation Ptot
170 mW
Operating temperature
Topr
Storage temperature
Tstg
*2 Isolation voltage
Viso (rms)
*3 Soldering temperature
Tsol
*1 Pulse width≤100µs, Duty ratio : 0.001
*2 40 to 60%RH, AC for 1minute, f=60Hz
*3 For 10s
−25 to +85
−40 to +125
5.0
260
˚C
˚C
kV
˚C
PC900V0NSZXF Series
■ Electro-optical Characteristics
Parameter
Symbol
Conditions
Forward voltage
VF
IF=4mA
IF=0.3mA
Reverse current
IR
Ta=25˚C, VR=3V
Terminal capacitance
Ct
Ta=25˚C, V=0, f=1kHz
Operating Supply voltage VCC
−
Low level output voltage VOL
IOL=16mA, VCC=5V, IF=4mA
High level output current IOH
VO=VCC=15V, IF=0
Low level supply current ICCL
VCC=5V, IF=4mA
High level supply current
*4 "High→Low" input
threshold current
*5 "Low→High" input
threshold current
*6 Hysteresis
ICCH
IFHL
IFLH
IFLH/IFHL
VCC=5V, IF=0
Ta=25˚C, VCC=5V, RL=280Ω
VCC=5V, RL=280Ω
Ta=25˚C, VCC=5V, RL=280Ω
VCC=5V, RL=280Ω
VCC=5V, RL=280Ω
Isolation voltage
RISO Ta=25˚C, DC500V, 40 to 60%RH
"High→Low" propagation delay time tPHL
"Low→High" propagation delay time tPLH
Ta=25˚C, VCC=5V, IF=4mA
Rise time
tr
RL=280Ω
Fall time
tf
*4 IFHL represents forward current when output goes from high to low.
*5 IFLH represents forward current when output goes from low to high.
*6 Hysteresis stands for IFLH/IFHL.
(Unless otherwise specified Ta=0 to +70˚C)
MIN. TYP. MAX. Unit
− 1.1 1.4
0.7 1.0
−
V
− − 10 µA
− 30 250 pF
3 − 15 V
− 0.2 0.4 V
− − 100 µA
− 2.5 5.0 mA
− 1.0 5.0 mA
−
1.1 2.0
mA
− − 4.0
0.4 0.8
0.3 −
− mA
−
0.5
5×1010
0.7
1×1011
0.9
−
−
Ω
−13
−26
− 0.1 0.5 µs
− 0.05 0.5
Sheet No.: D2-A05302EN
5
5 Page 
■ Manufacturing Guidelines
● Soldering Method
Reflow Soldering:
Reflow soldering should follow the temperature profile shown below.
Soldering should not exceed the curve of temperature profile and time.
Please don't solder more than twice.
(˚C)
300 Terminal : 260˚C peak
( package surface : 250˚C peak)
PC900V0NSZXF Series
200
100 Preheat
150 to 180˚C, 120s or less
Reflow
220˚C or more, 60s or less
0
0 1 2 3 4 (min)
Flow Soldering :
Due to SHARP's double transfer mold construction submersion in flow solder bath is allowed under the below
listed guidelines.
Flow soldering should be completed below 270˚C and within 10s.
Preheating is within the bounds of 100 to 150˚C and 30 to 80s.
Please don't solder more than twice.
Hand soldering
Hand soldering should be completed within 3s when the point of solder iron is below 400˚C.
Please don't solder more than twice.
Other notices
Please test the soldering method in actual condition and make sure the soldering works fine, since the impact
on the junction between the device and PCB varies depending on the tooling and soldering conditions.
Sheet No.: D2-A05302EN
11
11 Page | ||
| Páginas | Total 16 Páginas | |
| PDF Descargar | [ Datasheet PC900V0YIZXF.PDF ] | |
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