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PC81718NIP0F Schematic ( PDF Datasheet ) - Sharp

Teilenummer PC81718NIP0F
Beschreibung Low Input Current Photocoupler
Hersteller Sharp
Logo Sharp Logo 




Gesamt 14 Seiten
PC81718NIP0F Datasheet, Funktion
PC8171xNSZ0F
Series
PC8171xNSZ0F Series
DIP 4pin High CMR,
Low Input Current
Photocoupler
Description
PC8171xNSZ0F Series contains an IRED optically
coupled to a phototransistor.
It is packaged in a 4pin DIP, available in SMT gullw-
ing lead-form option.
Input-output isolation voltage(rms) is 5.0kV.
Collector-emitter voltage is 80V, CTR is 100% to
600% at input current of 0.5mA and CMR is MIN.
10kV/µs.
Features
1. 4pin DIP package
2. Double transfer mold package (Ideal for Flow Solder-
ing)
3. Low input current type (IF=0.5mA)
4. High collector-emitter voltage(VCEO : 80V)
5. High noise immunity due to high common rejection
voltage (CMR : MIN. 10kV/µs)
6. High isolation voltage between input and output
(Viso(rms) : 5.0 kV)
7. Lead-free and RoHS directive compliant
Agency approvals/Compliance
1. Recognized by UL1577 (Double protection isolation),
file No. E64380 (as model No. PC8171)
2. Package resin : UL flammability grade (94V-0)
Applications
1. Programmable controllers
2. Facsimiles
3. Telephones
Notice The content of data sheet is subject to change without prior notice.
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP
devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
Sheet No.: D2-A03302EN
1 Date Jun. 30. 2005
© SHARP Corporation






PC81718NIP0F Datasheet, Funktion
Fig.1 Test Circuit for Common Mode Rejection Voltage
PC8171xNSZ0F Series
RL Vnp
VCM
(dV/dt)
VCM
VCC
1)
Vcp
Vnp
VCM
:
High wave
pulse
VO
(Vcp Nearly = dV/dt×Cf×RL)
RL=470
1) Vcp : Voltage which is generated by displacement current in floating
VCC=9V
capacitance between primary and secondary side.
Fig.2 Forward Current vs. Ambient
Temperature
15
10
5
Fig.3 Diode Power Dissipation vs. Ambient
Temperature
15
10
5
0
30 0 25 50 75 100 125
Ambient temperature Ta (˚C)
Fig.4 Collector Power Dissipation vs.
Ambient Temperature
250
200
150
100
50
0
30 0 25 50 75 100 125
Ambient temperature Ta (˚C)
0
30 0 25 50 75 100 125
Ambient temperature Ta (˚C)
Fig.5 Total Power Dissipation vs. Ambient
Temperature
250
200
170
150
100
50
0
30 0 25 50 75 100 125
Ambient temperature Ta (˚C)
Sheet No.: D2-A03302EN
6

6 Page









PC81718NIP0F pdf, datenblatt
PC8171xNSZ0F Series
Package specification
Sleeve package
Package materials
Sleeve : HIPS (with anti-static material)
Stopper : Styrene-Elastomer
Package method
MAX. 100pcs of products shall be packaged in a sleeve.
Both ends shall be closed by tabbed and tabless stoppers.
The product shall be arranged in the sleeve with its anode mark on the tabless
stopper side.
MAX. 20 sleeves in one case.
Sleeve outline dimensions
12.0
520±2
6.7 (Unit : mm)
Sheet No.: D2-A03302EN
12

12 Page





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