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Teilenummer | PC3H411NIP0F |
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Beschreibung | Low Input Current Photocoupler | |
Hersteller | Sharp | |
Logo | ||
Gesamt 13 Seiten PC3H41xNIP0F
Series
∗4-channel package type is also available.
(model No. )
PC3H41xNIP0F Series
Mini-flat Half Pitch Package,
High CMR, AC Input,
Low Input Current Photocoupler
■ Description
PC3H41xNIP0F Series contains a IRED optically
coupled to a phototransistor.
It is packaged in a 4-pin Mini-flat, half pitch type.
Input-output isolation voltage(rms) is 2.5kV.
Collector-emitter Voltage is 80V, CTR is 50% to
400% at input current of ±0.5mA, and CMR is MIN.
10kV/µs.
■ Features
1. 4-pin Mini-flat Half pitch package (Lead pitch :
1.27mm)
2. Double transfer mold package (Ideal for Flow
Soldering)
3. AC input type
4. Low input current type (IF=±0.5mA)
5. High collector-emitter voltage (VCEO : 80V)
6. High noise immunity due to high common mode
rejection voltage (CMR : MIN. 10kV/µs)
7. Isolation voltage between input and output (Viso(rms) :
2.5kV)
8. RoHS directive compliant
■ Agency approvals/Compliance
1. Recognized by UL1577 (Double protection isolation),
file No. E64380 (as model No. PC3H41)
2. Package resin : UL flammability grade (94V-0)
■ Applications
1. Programmable controllers
2. Facsimiles
3. Telephones
Notice The content of data sheet is subject to change without prior notice.
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP
devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
1
Sheet No.: D2-A02102FEN
Date Jun. 30. 2005
© SHARP Corporation
Fig.1 Test Circuit for Common Mode Rejection Voltage
PC3H41xNIP0F Series
RL Vnp
VCM
(dV/dt)
VCC
VCM
:
High wave
pulse
RL=470Ω
VCC=9V
VCM
1)
Vcp
Vnp
VO
(Vcp Nearly = dV/dt×Cf×RL)
1) Vcp : Voltage which is generated by displacement current in floating
capacitance between primary and secondary side.
Fig.2 Forward Current vs. Ambient
Temperature
15
10
5
Fig.3 Diode Power Dissipation vs. Ambient
Temperature
15
10
5
0
−30 0 25 50 75 100 125
Ambient temperature Ta (˚C)
Fig.4 Collector Power Dissipation vs.
Ambient Temperature
250
200
150
100
50
0
−30 0 25 50 75 100 125
Ambient temperature Ta (˚C)
0
−30 0 25 50 75 100 125
Ambient temperature Ta (˚C)
Fig.5 Total Power Dissipation vs. Ambient
Temperature
250
200
170
150
100
50
0
−30 0 25 50 75 100 125
Ambient temperature Ta (˚C)
Sheet No.: D2-A02102FEN
6
6 Page ■ Package specification
● Tape and Reel package
Package materials
Carrier tape : PS
Cover tape : PET (three layer system)
Reel : PS
Carrier tape structure and Dimensions
FD
E
PC3H41xNIP0F Series
GJ
I
K
Dimensions List
AB
C
12.0±0.3
H
5.5±0.1
I
1.75±0.1
J
7.5±0.1
0.3±0.05
2.3±0.1
D
8.0±0.1
K
3.1±0.1
L
E
2.0±0.1
L
φ1.6−+00.1
(Unit : mm)
FG
4.0±0.1 φ1.5−+00.1
Reel structure and Dimensions
ed
g
f
ab
Direction of product insertion
Dimensions List
ab
330 13.5±1.5
ef
23±1.0
2.0±0.5
(Unit : mm)
cd
100±1.0
13±0.5
g
2.0±0.5
Pull-out direction
[Packing : 3 000pcs/reel]
Sheet No.: D2-A02102FEN
12
12 Page | ||
Seiten | Gesamt 13 Seiten | |
PDF Download | [ PC3H411NIP0F Schematic.PDF ] |
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