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ACPM-7331 Schematic ( PDF Datasheet ) - AVAGO

Teilenummer ACPM-7331
Beschreibung 4x4 Power Amplifier Module
Hersteller AVAGO
Logo AVAGO Logo 




Gesamt 14 Seiten
ACPM-7331 Datasheet, Funktion
ACPM-7331
UMTS1900 4x4 Power Amplifier Module
(1850-1910MHz)
Data Sheet
Description
The ACPM-7331, a Wide-band
Code Division Multiple
Access(WCDMA) Power Amplifier
(PA), is a fully matched 10-pin
surface mount module developed
for WCDMA handset applications.
This power amplifier module
operates in the 1850-1910MHz
bandwidth. The ACPM-7331
meets the stringent WCDMA
linearity requirements for output
power of up to 28.5dBm.
The ACPM-7331 is also
developed to meets HSDPA
specs. Mode Control pins are
provided for high efficiency
improvement of the low output
power range.
The ACPM-7331 is self contained,
incorporating 50ohm input and
output matching networks.
Functional Block Diagram
Vcc2(10)
Features
• Excellent linearity
• Low quiescent current
• High Efficiency
36% at Pout=28.5dBm
20% at Pout=16dBm
8% at Pout=8dBm
(without DCDC Converter)
• 10-pin surface mounting package
(4 mm x 4 mm x 1.1 mm)
• Internal 50 ohm matching networks
for both RF input & output
Applications
• WCDMA handset (HSDPA)
RF Input
(2)
Vcc1 (1)
Input
Match
DA
Inter
Stage
Match
PA
MMIC
Bias Circuit & Control Logic
Vmode1 (3) Vmode0 (4)
Ven (5)
Output
Match
MODULE
RF Output
(8)
This preliminary data is provided to assist you in the evaluation of product(s) currently under development. Until Avago Technologies releases this product for general
sales, Avago Technologies reserves the right to alter prices, specifications, features, capabilities, functions, release dates, and remove availability of the product(s) at
anytime.
ACPM-7331
Revision Date: May 30, 2006
Revision Number: DS 0.08
Preliminary Data Sheet






ACPM-7331 Datasheet, Funktion
Package Dimensions and Pin Descriptions
Pin 1 Mark
1 10
29
3 8 4 ± 0.1
47
56
0.40 TYP.
4 +/- 0.1
TOP VIEW
1.1 +/- 0.1
SIDE VIEW
1.90 1.70
0.85
1.20
1.90
0.40
0.40
Pin #
1
2
3
4
5
6
7
8
9
10
Name
Vcc1
RF In
Vmode1
Vmode0
Ven
GND
GND
RF Out
GND
Vcc2
Description
Supply Voltage
RF Input
Control Voltage
Control Voltage
Enable Voltage
Ground
Ground
RF Output
Ground
Supply Voltage
X-RAY BOTTOM VIEW
PIN DESCRIPTIONS
Figure 3. Package Dimensional Drawing and Pin Descriptions.
Notes:
1. All dimensions are in millimeters
2. Dimensions without tolerance: .XX Æ +/-0.05mm

6 Page









ACPM-7331 pdf, datenblatt
Figure 10. Typical SMT Reflow Profile for Maximum Temperature = 260 +0/-5oC
Table 8. Typical SMT Reflow Profile for Maximum Temperature = 260+0 / -5
Profile Feature
Average ramp-up rate (TL to TP)
Preheat
- Temperature Min (Tsmin)
- Temperature Max (Tsmax)
- Time (min to max) (ts)
Tsmax to TL
- Ramp-up Rate
Time maintained above:
- Temperature (TL)
- Time (TL)
Peak temperature (Tp)
Time within 5of actual Peak Temperature (tp)
Ramp-down Rate
Time 25to Peak Temperature
Sn-Pb Solder
3/sec max
100
150
60-120 sec
183
60-150 sec
240 +0/-5
10-30 sec
6/sec max
6 min max.
Pb-Free Solder
3/sec max
100
150
60-180 sec
3/sec max
217
60-150 sec
260 +0/-5
10-30 sec
6/sec max
8 min max.

12 Page





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