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RClamp0522PA Schematic ( PDF Datasheet ) - Semtech Corporation

Teilenummer RClamp0522PA
Beschreibung Ultra Low Capacitance TVS Arrays
Hersteller Semtech Corporation
Logo Semtech Corporation Logo 




Gesamt 13 Seiten
RClamp0522PA Datasheet, Funktion
PROTECTION PRODUCTS - RailClamp®
Description
RailClamp® T VS arrays are ultra lo w capacitance ESD
protection devices designed to protect high speed data
interfaces. This series has been specifically designed to
protect sensitive components which are connected to
high-speed data and transmission lines from overvolt-
age caused by ESD (electrostatic discharge), CDE
(Cable Discharge Events), and EFT (electrical fast
transients).
The RClamp®0522PA and R Clamp®0524PA have a
typical capacitance of only 0.30pF between I/O pins.
This allows it to be used on circuits operating in excess
of 3GHz without signal attenuation. They may be used
to meet the ESD immunity req uirements of IEC 6 1000-
4-2. The R Clamp0522PA is designed t o protect two
lines, while the R Clamp0524PA will pr otect four lines.
The R Clamp0522PA is in a 6-pin SLP1 610P4 pack age.
It measures 1.6 x 1.0 with a nominal height of 0.58mm.
The RClamp0524PA is in a 1 0-pin SLP2510P8 package.
It measures 2.5 x 1.0 with a nominal height of 0.58mm.
The leads are spaced at a pitch of 0.5mm and are fin-
ished with lead-free NiPdAu. They are designed for easy
PCB layout by allowing the traces to run straight through
the device. The combination of small size, low capaci-
tance, and high level of ESD protection makes them a
flexible solution for applications such as HDMI,
DisplayPortTM, MDDI, and eSA TA int erfaces.
RClamp0522PA
RClamp0524PA
Ultra Low Capacitance T VS Arrays
PRELIMINARY
Features
‹ ESD protection for high-speed data lines to
IEC 61000-4-2 (ESD) ±1 7kV (air), ±1 2kV (cont act)
IEC 61000-4-5 (Lightning) 5A (8/20 μs)
IEC 61000-4-4 (EFT) 40A (5/50ns)
‹ Package design optimized for high speed lines
‹ Flow-Through design
‹ Protects two or four I/O lines
‹ Low capacitance: 0.3pF typical (I/O to I/O)
‹ Low clamping voltage
‹ Low operating voltage: 5V
‹ Solid-state silicon-avalanche technology
Mechanical Characteristics
‹ SLP1610P4 6-pin pack age (1.6 x 1 .0 x 0.58mm)
‹ SLP2510P8 10-pin package (2.5 x 1 .0 x 0.58mm)
‹ Pb-Free, Halogen F ree, R oHS/WEEE Com pliant
‹ Lead Pitch: 0.5mm
‹ Lead finish: NiPdAu
‹ Marking: Marking Code
‹ Packaging: Tape and R eel
Applications
‹ High Definition Multi-Media Interface (HDMI)
‹ Digital Visual Interface (DVI)
‹ DisplayPortTM Interface
‹ MDDI Ports
‹ PCI Express
‹ eSATA Int erfaces
Circuit Diagram - RClamp0522PA
Circuit Diagram - R Clamp0524PA
Pin 1
Pin 2
3, 4
2-Line Protection
Revision 3/8/2010
Pin 1
Pin 2
Pin 4
Pin 5
3, 8
4-Line Protection
1 www.semtech.comhttp://www.Datasheet4U.com






RClamp0522PA Datasheet, Funktion
PROTECTION PRODUCTS
Applications Information
Design Recommendations for HDMI Protection
Adding external ESD protection to HDMI ports can be
challenging. First, ESD protection devices have an
inherent junction capacitance. F urthermore, adding
even a small amount of capacitance will cause the
impedance of the differential pair to drop. Second,
large packages and land pattern requirements cause
discontinuities that adve rsely af fect signal int egrity.
The R Clamp0524PA and R Clamp0522PA are
specifically designed for protection of high-speed
interfaces such as HDMI. They present <0.4pF
capacitance between the pairs while being rated to
handle >±8kV ESD contact discharges (>±15kV air
discharge) as outlined in IEC 6 1000-4-2. Each de vice
is in a leadless SLP package that is less than 1 .1mm
wide. They are designed such that the traces flow
straight through the device. The narrow package and
flow-through design reduces discontinuities and
minimizes impact on signal int egrity. This becomes
even more critical as signal speeds increase.
Pin Configuration
Figure 1 is an example of how to route the high speed
differential traces thr ough the R Clamp0524PA. The
solid line represents the PCB trace. The PCB traces
are used to connect the pin pairs for each line (pin 1 to
pin 10, pin 2 to pin 9, pin 4 to pin 7, pin 5 to pin 6).
For example, line 1 enters at pin 1 and exits at Pin 10
and the PCB trace connects pin 1 and 1 0 together.
This is true for lines connected at pins 2, 4, and 5 also.
Ground is connected at pins 3 and 8. One large
ground pad should be used in lieu of two separate
pads. The same layout rules apply for the
RClamp0522PA.
TDR Measurements for HDMI
The combination of low capacitance, small package, and
flow-through design means it is possible to use these
devices to meet the HDMI impedance requirements of
100 Ohms ±15% without any PCB board modification.
Figure 3 shows a typical impedance test result for a
TDR risetime of 200ps using a Semtech evaluation
board with 100 Ohm traces throughout. Measure-
ments were taken using a TDR method as outlined in
the HDMI Compliance Test Specification (CTS). In each
RClamp0522PA
RClamp0524PA
PRELIMINARY
1
12
11
10
GND
9
8
7
1
6
5
4
GND
3
2
1
GND
GND
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© 2010 Semtech Corp.
6
www.semtech.com

6 Page









RClamp0522PA pdf, datenblatt
PROTECTION PRODUCTS
OOuuttlliinnee Drawing - SOLP-82510P8
RClamp0522PA
RClamp0524PA
PRELIMINARY
A
PIN 1
INDICATOR
(LASER MARK)
D
aaa C
A2
R0.125
12
E/2 LxN
B
E
A1
b1xN
bbb
A
SEATING
PLANE
C
CAB
DIMENSIONS
DIM
INCHES
MIN NOM MAX
MILLIMETERS
MIN NOM MAX
A .020 .023 .026 0.50 0.58 0.65
A1 0.00 .001 .002 0.00 0.03 0.05
A2 (.005)
(0.13)
b .006 .008 .010 0.15 0.20 0.25
b1 .014 .016 .018 0.35 0.40 0.45
D .094 .098 .102 2.40 2.50 2.60
E .035 .039 .043 0.90 1.00 1.10
e .020 BSC
0.50 BSC
L .012 .015 .017 0.30 0.38 0.425
N8
aaa .003
8
0.08
bbb .004
0.10
2X R0.075
7 PLACES
N
e bxN
bbb C A B
D/2
NOTES:
1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
Land Pattern - SLP2510P8
P1
P
Z (C) G
X
X1
Y
(Y1)
DIMENSIONS
DIM INCHES
MILLIMETERS
C (.034)
G .008
P .020
P1 .039
X .008
X1 .016
Y .027
Y1 (.061)
Z .061
(0.875)
0.20
0.50
1.00
0.20
0.40
0.675
(1.55)
1.55
NOTES:
1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
2. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY.
CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR
COMPANY'S MANUFACTURING GUIDELINES ARE MET.
© 2010 Semtech Corp.
12
www.semtech.com

12 Page





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