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PDF AUIRG4BC30S-S Data sheet ( Hoja de datos )
| Número de pieza | AUIRG4BC30S-S | |
| Descripción | INSULATED GATE BIPOLAR TRANSISTOR | |
| Fabricantes | IRF | |
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AUTOMOTIVE GRADE
PD - 96340
AUIRG4BC30S-S
INSULATED GATE BIPOLAR TRANSISTOR
Features
AUIRG4BC30S-SL
Standard Speed IGBT
C VCES = 600V
• Standard: optimized for minimum saturation
voltage and low operating frequencies (< 1kHz)
• Lead-Free, RoHS Compliant
• Automotive Qualified *
G
E
n-channel
VCE(on) typ. = 1.4V
@VGE = 15V, IC = 18A
Benefits
• Typical Applications: PTC Heater,
Discharge Switch & Relay Replacements
D2Pak
AUIRG4BC30S-S
TO-262
AUIRG4BC30S-SL
GC
E
Absolute Maximum Ratings
Gate
Collector
Emitter
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These
are stress ratings only; and functional operation of the device at these or any other condition beyond those indicated in
the specifications is not implied.Exposure to absolute-maximum-rated conditions for extended periods may affect device
reliability. The thermal resistance and power dissipation ratings are measured under board mounteadnd still air conditions.
Ambient temperature (T A) is 25 °C, unless otherwise specified
Parameter
Max.
Units
VCES
IC @ TC = 25°C
IC @ TC = 100°C
ICM
ILM
VGE
EARV
PD @ TC = 25°C
PD @ TC = 100°C
TJ
TSTG
Collector-to-Emitter Breakdown Voltage
Continuous Collector Current
Continuous Collector Current
Pulsed Collector Current
Clamped Inductive Load Current
Gate-to-Emitter Voltage
Reverse Voltage Avalanche Energy
Maximum Power Dissipation
Maximum Power Dissipation
Operating Junction and
Storage Temperature Range
Soldering Temperature, for 10 seconds
600
34
18
68
68
±20
10
100
42
-55 to +150
300 (0.063 in. (1.6mm) from case )
V
A
V
mJ
W
°C
Thermal Resistance
RθJC
RθCS
RθJA
Wt
Parameter
Junction-to-Case
Case-to-Sink, Flat, Greased Surface
Junction-to-Ambient, typical socket mount
Weight
Typ.
–––
0.50
–––
1.44
Max.
1.2
–––
40
–––
Units
°C/W
g (oz)
* When mounted on 1" square PCB (FR-4 or G-10 Material ). For recommended footprint and soldering techniques
refer to application note #AN-994.
www.irf.com
1
12/03/10
http://www.Datasheet4U.com
1 page  
AUIRG4BC30S-S/SL
35
30
25
20
15
10
5
0
25
50 75 100 125
TC , Case Temperature ( ° C)
150
3.0 VGE = 15V
80 us PULSE WIDTH
2.5
IC = 36 A
2.0
IC = 18 A
1.5
IC = 9.09AA
1.0
-60 -40 -20 0 20 40 60 80 100 120 140 160
TJ , Junction Temperature ( °C)
Fig. 4 - Maximum Collector Current vs. Case
Temperature
Fig. 5 - Typical Collector-to-Emitter Voltage
vs. Junction Temperature
10
1
D = 0.50
0.20
0.10
0.1 0.05
0.02
0.01
0.01
0.00001
PDM
t1
SINGLE PULSE
(THERMAL RESPONSE)
Notes:
1. Duty factor D = t1 / t2
2. Peak TJ = PDM x Z thJC + TC
t2
0.0001
0.001
0.01
t1 , Rectangular Pulse Duration (sec)
0.1
Fig. 6 - Maximum Effective Transient Thermal Impedance, Junction-to-Case
www.irf.com
1
5
5 Page 
D2Pak Tape & Reel Information
Dimensions are shown in millimeters (inches)
AUIRG4BC30S-S/SL
TRR
1.60 (.063)
1.50 (.059)
4.10 (.161)
3.90 (.153)
FEED DIRECTION 1.85 (.073)
1.65 (.065)
TRL
10.90 (.429)
10.70 (.421)
1.60 (.063)
1.50 (.059)
11.60 (.457)
11.40 (.449)
15.42 (.609)
15.22 (.601)
1.75 (.069)
1.25 (.049)
16.10 (.634)
15.90 (.626)
0.368 (.0145)
0.342 (.0135)
24.30 (.957)
23.90 (.941)
4.72 (.136)
4.52 (.178)
FEED DIRECTION
13.50 (.532)
12.80 (.504)
27.40 (1.079)
23.90 (.941)
4
330.00
(14.173)
MAX.
60.00 (2.362)
MIN.
NOTES :
1. COMFORMS TO EIA-418.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION MEASURED @ HUB.
4. INCLUDES FLANGE DISTORTION @ OUTER EDGE.
26.40 (1.039)
24.40 (.961)
3
30.40 (1.197)
MAX.
4
www.irf.com
11
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| PDF Descargar | [ Datasheet AUIRG4BC30S-S.PDF ] | |
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