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Teilenummer | PC3H4J00000F |
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Beschreibung | Mini-flat Half Pitch Package AC Input Photocoupler | |
Hersteller | SHARP | |
Logo | ||
Gesamt 13 Seiten PC3H4J00000F
Series
*4-channel package type is also available.
(model No. PC3Q64QJ000F)
PC3H4J00000F Series
Mini-flat Half Pitch Package,
AC Input Photocoupler
■ Description
PC3H4J00000F Series contains an IRED optically
coupled to a phototransistor.
It is packaged in a 4-pin Mini-flat, half pitch type.
Input-output isolation voltage(rms) is 2.5kV.
Collector-emitter voltage is 80V and CTR is 20% to
400% at input current of ±1mA.
■ Features
1. 4-pin Mini-flat Half pitch package (Lead pitch :
1.27mm)
2. Double transfer mold package (Ideal for Flow
Soldering)
3. AC input type
4. High collector-emitter voltage (VCE : 80V)
5. Isolation voltage between input and output (V iso(rms):
2.5kV)
6. Lead-free and RoHS directive compliant
■ Agency approvals/Compliance
1. Recognized by UL1577 (Double protection isolation),
file No. E64380 (as model No. PC3H4)
2. Approved by VDE, DIN EN60747-5-2(*) (as an
option), file No. 40009162 (as model No. PC3H4)
3. Package resin : UL flammability grade (94V-0)
(*)DIN EN60747-5-2 : successor standard of DIN VDE0884
■ Applications
1. Programmable controllers
Notice The content of data sheet is subject to change without prior notice.
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP
devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
Sheet No.: D2-A01502EN http://www.Datasheet4U.com
1 Date Jun. 30. 2005
© SHARP Corporation
Fig.1 Forward Current vs. Ambient
Temperature
50
40
30
20
10
0
−30 0 25 50 55 75 100 125
Ambient temperature Ta (˚C)
Fig.3 Collector Power Dissipation vs.
Ambient Temperature
200
150
100
50
0
−30 0 25 50 75 100 125
Ambient temperature Ta (˚C)
Fig.5 Peak Forward Current vs. Duty Ratio
10 000
Pulse width≤100µs
Ta=25˚C
1 000
PC3H4J00000F Series
Fig.2 Diode Power Dissipation vs. Ambient
Temperature
100
80
70
60
40
20
0
−30 0 25 50 55 75 100 125
Ambient temperature Ta (˚C)
Fig.4 Total Power Dissipation vs. Ambient
Temperature
250
200
170
150
100
50
0
−30 0 25 50 75 100 125
Ambient temperature Ta (˚C)
Fig.6 Forward Current vs. Forward Voltage
100
Ta=50˚C
75˚C
10 100˚C
25˚C
0˚C
−30˚C
100
10
10−3
10−2
10−1
Duty ratio
1
6
1
0.1
0
0.5 1 1.5
Forward voltage VF (V)
2
Sheet No.: D2-A01502EN
6 Page ■ Package specification
● Tape and Reel package
Package materials
Carrier tape : PS
Cover tape : PET (three layer system)
Reel : PS
Carrier tape structure and Dimensions
FD
E
PC3H4J00000F Series
GJ
I
K
Dimensions List
ABC
12.0±0.3
H
5.5±0.1
I
1.75±0.1
J
7.5±0.1
0.3±0.05
2.3±0.1
D
8.0±0.1
K
3.1±0.1
L
E
2.0±0.1
L
φ1.6−+00.1
(Unit : mm)
FG
4.0±0.1 φ1.5−+00.1
Reel structure and Dimensions
ed
g
f
ab
Direction of product insertion
Dimensions List
ab
330 13.5±1.5
ef
23±1.0
2.0±0.5
(Unit : mm)
cd
100±1.0
13±0.5
g
2.0±0.5
Pull-out direction
[Packing : 3 000pcs/reel]
Sheet No.: D2-A01502EN
12
12 Page | ||
Seiten | Gesamt 13 Seiten | |
PDF Download | [ PC3H4J00000F Schematic.PDF ] |
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