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Teilenummer | PC123GY2J00F |
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Beschreibung | DIP 4pin Reinforced Insulation Type Photocoupler | |
Hersteller | SHARP | |
Logo | ||
Gesamt 16 Seiten PC123N02J00F
Series
PC123N02J00F Series
DIP 4pin Reinforced Insulation Type
Photocoupler
■ Description
PC123N02J00F Series contains an IRED optically
coupled to a phototransistor.
It is packaged in a 4-pin DIP , available in wide-lead
spacing option and SMT gullwing lead-form option.
Input-output isolation voltage(rms) is 5kV.
CTR is 50% to 400% at input current of 5mA
■ Features
1. 4-pin DIP package
2. Double transfer mold package (Ideal for Flow Solder-
ing)
3. Current transfer ratio (CTR : MIN. 50% at I
VCE=5V)
4. Several CTR ranks available
F=5 mA,
5. Reinforced insulation type (Isolation distance : MIN.
0.4mm)
6. Long creepage distance type (wide lead-form type
only : MIN. 8mm)
7. High isolation voltage between input and output
(Viso(rms) : 5kV)
8. Lead-free and RoHS directive compliant
■ Agency approvals/Compliance
1. Recognized by UL1577 (Double protection isolation),
file No. E64380 (as model No. PC123)
2. Approved by BSI, BS-EN60065, file No. 7087, BS-
EN60950 file No. 7409, (as model No. PC123)
3. Approved by SEMKO, EN60065, EN60950, (as mod-
el No. PC123)
4. Approved by DEMKO, EN60065, EN60950, (as mod-
el No. PC123)
5. Approved by NEMKO, EN60065, EN60950, (as mod-
el No. PC123)
6. Approved by FIMKO, EN60065, EN60950, (as model
No. PC123)
7. Recognized by CSA file No. CA95323 (as model No.
PC123)
8. Approved by VDE, DIN EN60747-5-2( ∗) (as an op-
tion), file No. 40008087 (as model No. PC123)
9. Package resin : UL flammability grade (94V - 0)
(∗) DIN EN60747-5-2 : successor standard of DIN VDE0884.
■ Applications
1. I/O isolation for MCUs (Micro Controller Units)
2. Noise suppression in switching circuits
3. Signal transmission between circuits of dif ferent po-
tentials and impedances
4. Over voltage detection
Notice The content of data sheet is subject to change without prior notice.
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP
devices shown in catalogs, data books, etc. Contact SHARPin order to obtain the latest device specification sheets before using any SHARPdevice.
Sheet No.: D2-A09401EN
1 Date Sep. 1. 2006 http://www.Datasheet4U.com
© SHARP Corporation
PC123N02J00F Series
■ Model Line-up
Lead Form
Package
DIN
EN60747-5-2
Model No.
Through-Hole
Sleeve
100pcs/sleeve
Wide Through-Hole
Rank mark
−
Approved
−
Approved
PC123N02J00F
PC123NA2J00F
PC123NB2J00F
PC123NC2J00F
PC123NS2J00F
PC123YN2J00F
PC123YA2J00F
PC123YB2J00F
PC123YC2J00F
PC123YS2J00F
PC123F02J00F
PC123F12J00F
PC123F22J00F
PC123F52J00F
PC123FS2J00F
PC123Y02J00F With or without
PC123Y12J00F
L
PC123Y22J00F
M
PC123Y52J00F
N
PC123Y82J00F
E
IC[mA]
(IF=5mA,
VCE=5V,
Ta=25˚C)
2.5 to 20
2.5 to 7.5
5 to 12.5
10 to 20
5 to 10
Lead Form
Package
DIN
EN60747-5-2
Model No.
SMT Gullwing
Taping
2 000pcs/reel
Wide SMT Gullwing
Rank mark
−
Approved
−
Approved
PC123P02J00F
PC123P12J00F
PC123P22J00F
PC123P52J00F
PC123P82J00F
−
PC123GY2J00F
PC123HY2J00F
PC123EY2J00F
−
−
With or without
PC123Y13J00F
L
PC123Y23J00F
M
PC123Y53J00F
N
PC123Y83J00F
E
Please contact a local SHARP sales representative to inquire about production status.
IC[mA]
(IF=5mA,
VCE=5V,
Ta=25˚C)
2.5 to 20
2.5 to 7.5
5 to 12.5
10 to 20
5 to 10
Sheet No.: D2-A09401EN
6
6 Page PC123N02J00F Series
● Cleaning instructions
Solvent cleaning :
Solvent temperature should be 45˚C or below. Immersion time should be 3 minutes or less.
Ultrasonic cleaning :
The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time,
size of PCB and mounting method of the device.
Therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of
mass production.
Recommended solvent materials :
Ethyl alcohol, Methyl alcohol and Isopropyl alcohol.
In case the other type of solvent materials are intended to be used, please make sure they work fine in
actual using conditions since some materials may erode the packaging resin.
● Presence of ODC
This product shall not contain the following materials.
And they are not used in the production process for this product.
Regulation substances : CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform)
Specific brominated flame retardants such as the PBB and PBDE are not used in this product at all.
This product shall not contain the following materials banned in the RoHS Directive (2002/95/EC).
•Lead, Mercury, Cadmium, Hexavalent chromium, Polybrominated biphenyls (PBB), Polybrominated
diphenyl ethers (PBDE).
Sheet No.: D2-A09401EN
12
12 Page | ||
Seiten | Gesamt 16 Seiten | |
PDF Download | [ PC123GY2J00F Schematic.PDF ] |
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