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PDF PC817XJ0000F Data sheet ( Hoja de datos )

Número de pieza PC817XJ0000F
Descripción DIP 4pin General Purpose Photocoupler
Fabricantes Sharp 
Logotipo Sharp Logotipo



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PC817XJ0000F
Series
4-channel package type is also available.
(model No. PC847XJ0000F Series)
PC817XJ0000F Series
DIP 4pin General Purpose
Photocoupler
Description
PC817XJ0000F Series contains an IRED optically
coupled to a phototransistor.
It is packaged in a 4pin DIP, available in wide-lead
spacing option and SMT gullwing lead-form option.
Input-output isolation voltage(rms) is 5.0kV.
Collector-emitter voltage is 80V and CTR is 50% to
600% at input current of 5mA.
Features
1. 4pin DIP package
2. Double transfer mold package (Ideal for Flow Solder-
ing)
3. High collector-emitter voltage (VCEO:80V)
4. Current transfer ratio (CTR : MIN. 50% at IF=5 mA,
VCE=5V)
5. Several CTR ranks available
6. High isolation voltage between input and output
(Viso(rms) : 5.0 kV)
7. Lead-free and RoHS directive compliant
Agency approvals/Compliance
1. Recognized by UL1577 (Double protection isolation),
file No. E64380 (as model No. PC817)
2. Package resin : UL flammability grade
(94V-0)
Applications
1. I/O isolation for MCUs (Micro Controller Units)
2. Noise suppression in switching circuits
3. Signal transmission between circuits of different po-
tentials and impedances
Notice The content of data sheet is subject to change without prior notice.
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP
devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
Sheet No.: D2-A03102EN
1 Date Jun. 30. 2005
© SHARP Corporation Free Datasheet http://www.Datasheet4U.com

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PC817XJ0000F pdf
PC817XJ0000F Series
Model Line-up
Lead Form
Package
Model No.
Through-Hole
Wide Through-Hole
Sleeve
100pcs/sleeve
PC817XJ0000F
PC817XFJ000F
PC817X1J000F
PC817XF1J00F
PC817X2J000F
PC817XF2J00F
PC817X3J000F
PC817XF3J00F
PC817X4J000F
PC817XF4J00F
PC817X5J000F
PC817XF5J00F
PC817X6J000F
PC817XF6J00F
PC817X7J000F
PC817XF7J00F
PC817X8J000F
PC817XF8J00F
PC817X9J000F
PC817XF9J00F
PC817X0J000F
PC817XF0J00F
IC [mA]
Rank mark (IF=5mA, VCE=5V, Ta=25˚C)
with or without
A
B
C
D
A or B
B or C
C or D
A, B or C
B, C or D
A, B, C or D
2.5 to 30.0
4.0 to 8.0
6.5 to 13.0
10.0 to 20.0
15.0 to 30.0
4.0 to 13.0
6.5 to 20.0
10.0 to 30.0
4.0 to 20.0
6.5 to 30.0
4.0 to 30.0
Lead Form
Package
Model No.
SMT Gullwing
Wide SMT Gullwing
Sleeve
100pcs/sleeve
Taping
2 000pcs/reel
PC817XIJ000F PC817XPJ000F PC817XFPJ00F
PC817XI1J00F PC817XP1J00F
PC817XI2J00F PC817XP2J00F
PC817XI3J00F PC817XP3J00F
PC817XI4J00F PC817XP4J00F
PC817XI5J00F PC817XP5J00F
PC817XI6J00F PC817XP6J00F
PC817XI7J00F PC817XP7J00F
PC817XI8J00F PC817XP8J00F
PC817XI9J00F PC817XP9J00F
PC817XI0J00F PC817XP0J00F
Rank mark
with or without
A
B
C
D
A or B
B or C
C or D
A, B or C
B, C or D
A, B, C or D
IC [mA]
(IF=5mA, VCE=5V, Ta=25˚C)
2.5 to 30.0
4.0 to 8.0
6.5 to 13.0
10.0 to 20.0
15.0 to 30.0
4.0 to 13.0
6.5 to 20.0
10.0 to 30.0
4.0 to 20.0
6.5 to 30.0
4.0 to 30.0
Please contact a local SHARP sales representative to inquire about production status.
Sheet No.: D2-A03102EN
5
Free Datasheet http://www.Datasheet4U.com

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PC817XJ0000F arduino
PC817XJ0000F Series
Cleaning instructions
Solvent cleaning:
Solvent temperature should be 45˚C or below Immersion time should be 3 minutes or less
Ultrasonic cleaning:
The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time,
size of PCB and mounting method of the device.
Therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of
mass production.
Recommended solvent materials:
Ethyl alcohol, Methyl alcohol and Isopropyl alcohol
In case the other type of solvent materials are intended to be used, please make sure they work fine in ac-
tual using conditions since some materials may erode the packaging resin.
Presence of ODC
This product shall not contain the following materials.
And they are not used in the production process for this product.
Regulation substances : CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform)
Specific brominated flame retardants such as the PBBOs and PBBs are not used in this product at all.
This product shall not contain the following materials banned in the RoHS Directive (2002/95/EC).
•Lead, Mercury, Cadmium, Hexavalent chromium, Polybrominated biphenyls (PBB), Polybrominated di-
phenyl ethers (PBDE).
11
Sheet No.: D2-A03102EN
Free Datasheet http://www.Datasheet4U.com

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