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PDF 33660 Data sheet ( Hoja de datos )
| Número de pieza | 33660 | |
| Descripción | ISO K Line Serial Link Interface | |
| Fabricantes | Freescale Semiconductor | |
| Logotipo |  |
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Freescale Semiconductor
Advance Information
Document Number: MC33660
Rev 5.0, 10/2013
ISO K Line Serial Link Interface
The 33660 is a serial link bus interface device designed to provide
bi-directional half-duplex communication interfacing in automotive
diagnostic applications. It is designed to interface between the
vehicle’s on-board microcontroller, and systems off-board the vehicle
via the special ISO K line. The 33660 is designed to meet the
Diagnostic Systems ISO9141 specification. The device’s K line bus
driver’s output is fully protected against bus shorts and over-
temperature conditions.
The 33660 derives its robustness to temperature and voltage
extremes by being built on a SMARTMOS process, incorporating
CMOS logic, bipolar/MOS analog circuitry, and DMOS power FETs.
Although the 33660 was principally designed for automotive
applications, it is suited for other serial communication applications. It
is parametrically specified over an ambient temperature range of
-40 ºC ≤ TA ≤ 125 ºC and 8.0 V ≤ VBB ≤ 18 V supply. The economical
SO-8 surface-mount plastic package makes the 33660 very cost
effective.
Features
• Operates over wide supply voltage of 8.0 to 18 V
• Operating temperature of -40 to 125 °C
• Interfaces directly to standard CMOS microprocessors
• ISO K line pin protected against shorts to battery
• Thermal shutdown with hysteresis
• ISO K line pin capable of high currents
• ISO K line can be driven with up to 10 nF of parasitic capacitance
• 8.0 kV ESD protection attainable with few additional components
• Standby mode: no VBAT current drain with VDD at 5.0 V
• Low current drain during operation with VDD at 5.0 V
33660
ISO9141 PHYSICAL INTERFACE
EF SUFFIX (PB-FREE)
98ASB42564B
8-PIN SOICN
ORDERING INFORMATION
Device
(For tape and reel orders,
add an R2 suffix)
Temperature
Range (TA)
Package
MC33660EF
MC33660BEF
-40 to 125 °C
8-SOICN
+VBAT
VDD
VDD
33660
VDD
VBB
MCU
Dx
SCIRxD
SCITxD
CEN
RX
TX
ISO
GND
ISO K-LINE
Figure 1. 33660 Simplified Application Diagram
TXD
RXD
* This document contains certain information on a new product. Specifications and information herein are
subject to change without notice. © Freescale Semiconductor, Inc., 2011-2013. All rights reserved.
Free Datasheet http://www.datasheet4u.com/
1 page  
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 3. Maximum Ratings
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or
permanent damage to the device.
Rating
Symbol
Value
Unit
VDD DC Supply Voltage
VBB Load Dump Peak Voltage (in accordance with ISO 7637-2 & ISO
7637-3)
Pulse 5a - 33660B only
Pulse 5b
ISO Pin Load Dump Peak Voltage (3)
ESD Voltage (4)
Human Body Model (5)
Machine Model (5)
33660
33660B
Charge Device Model (5)
Corner Pins
All other Pins
Module Level ESD (Air Discharge, Powered) (6)
33660B only
ISO pin with 33 V zener diode and 470 pF capacitor to GND -
VDD
VBB(5a)
VBB(5b)
VISO
VESD1
VESD2
VESD3-1
VESD3-2
VESD4
-0.3 to 7.0
82
45
40
±2000
±150
±200
±750
±500
±25000
V
V
V
V
ISO Clamp Energy (7)
Storage Temperature
Operating Case Temperature
Operating Junction Temperature
Power Dissipation TA = 25 °C
Peak Package Reflow Temperature During Reflow (8), (9)
ECLAMP
TSTG
TC
TJ
PD
TPPRT
10
-55 to +150
-40 to +125
-40 to +150
100
Note 9.
mJ
°C
°C
°C
mW
°C
Thermal Resistance: Junction-to-Ambient
RθJA
150 °C/W
Notes
3. Device will survive double battery jump start conditions in typical applications for 10 minutes duration, but is not guaranteed to remain
within specified parametric limits during this duration.
4. ESD data available upon request.
5. ESD1 testing is performed in accordance with the Human Body Model (CZAP = 100 pF, RZAP = 1500 Ω), ESD2 testing is performed in
accordance with the Machine Model (CZAP = 200 pF, RZAP = 0 Ω), ESD3 testing is performed in accordance with the Charge Device
Model (CZAP = 4.0 pF).
6. ESD4 testing is performed in accordance with ISO 10605 ESD model (C = 330 pF, R = 2.0 kΩ). ESD discharges start at ±5.0 kV and
go up to ±25 kV in increments of 5.0 kV. There are two positions for discharges: 8.0 cm cable from ISO connector, 85 cm cable from
ISO connector. There are 10 ESD discharges per voltage at each cable position at a minimum of 1.0 s intervals. Remaining charge is
not bled off after every discharge.
7. Nonrepetitive clamping capability at 25 °C.
8. Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
9. Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow
Temperature and Moisture Sensitivity Levels (MSL), Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes
and enter the core ID to view all orderable parts. (i.e. MC33xxxD enter 33xxx), and review parametrics.
Analog Integrated Circuit Device Data
Freescale Semiconductor
33660
5
Free Datasheet http://www.datasheet4u.com/
5 Page 
PACKAGING
PACKAGING
PACKAGE DIMENSIONS
PACKAGE DIMENSIONS
For the most current package revision, visit www.freescale.com and perform a keyword search using the “98A” listed below.
EF SUFFIX (PB-FREE)
8-PIN
98ASB42564B
REV. V
Analog Integrated Circuit Device Data
Freescale Semiconductor
33660
11
Free Datasheet http://www.datasheet4u.com/
11 Page | ||
| Páginas | Total 14 Páginas | |
| PDF Descargar | [ Datasheet 33660.PDF ] | |
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