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CAV24C04 Schematic ( PDF Datasheet ) - ON Semiconductor

Teilenummer CAV24C04
Beschreibung (CAV24C02 - CAV24C16) I2C CMOS Serial EEPROM
Hersteller ON Semiconductor
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Gesamt 15 Seiten
CAV24C04 Datasheet, Funktion
CAV24C02, CAV24C04,
CAV24C08, CAV24C16
2-Kb, 4-Kb, 8-Kb and 16-Kb
I2C CMOS Serial EEPROM
Description
The CAV24C02/04/08/16 are 2−Kb, 4−Kb, 8−Kb and 16−Kb
respectively CMOS Serial EEPROM devices organized internally as
16/32/64 and 128 pages respectively of 16 bytes each. All devices
support both the Standard (100 kHz) as well as Fast (400 kHz) I2C
protocol.
Data is written by providing a starting address, then loading 1 to 16
contiguous bytes into a Page Write Buffer, and then writing all data to
non−volatile memory in one internal write cycle. Data is read by
providing a starting address and then shifting out data serially while
automatically incrementing the internal address count.
External address pins make it possible to address up to eight
CAV24C02, four CAV24C04, two CAV24C08 and one CAV24C16
device on the same bus.
Features
Automotive Temperature Grade 1 (−40°C to +125°C)
Supports Standard and Fast I2C Protocol
2.5 V to 5.5 V Supply Voltage Range
16−Byte Page Write Buffer
Hardware Write Protection for Entire Memory
CAV Prefix for Automotive and Other Applications Requiring Site
and Change Control
Schmitt Triggers and Noise Suppression Filters on I2C Bus Inputs
(SCL and SDA)
Low power CMOS Technology
1,000,000 Program/Erase Cycles
100 Year Data Retention
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
VCC
SCL
A2, A1, A0
WP
CAV24Cxx
SDA
VSS
Figure 1. Functional Symbol
This document contains information on some products that are still under development.
ON Semiconductor reserves the right to change or discontinue these products without
notice.
www.onsemi.com
TSSOP−8
Y SUFFIX
CASE 948AL
SOIC−8
W SUFFIX
CASE 751BD
WLCSP−4***
C4A SUFFIX
CASE 567DC
WLCSP−5***
C5A SUFFIX
CASE 567DD
PIN CONFIGURATIONS
SOIC (W), TSSOP (Y)
CAV24C__
16 / 08 / 04 / 02
NC / NC / NC / A0
NC / NC / A1 / A1
NC / A2 / A2 / A2
VSS
18
27
36
45
(Top View)
Pin 1 1
2 Pin 1 1 2
VCC
WP
SCL
SDA
3
A VCC
VSS
B SCL SDA
VCC
VSS
SDA
A
B
WP SCL C
WLCSP−4***
WLCSP−5***
(Top Views)
PIN FUNCTION
Pin Name
A0, A1, A2
Function
Device Address Input
SDA
Serial Data Input/Output
SCL Serial Clock Input
WP Write Protect Input
VCC Power Supply
VSS Ground
NC No Connect
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 14 of this data sheet.
© Semiconductor Components Industries, LLC, 2015
November, 2015 − Rev. 4
1
Publication Order Number:
CAV24C02/D






CAV24C04 Datasheet, Funktion
CAV24C02, CAV24C04, CAV24C08, CAV24C16
SCL
SDA
START
CONDITION
STOP
CONDITION
Figure 2. Start/Stop Timing
SCL FROM
MASTER
1 0 1 0 A2 A1 A0 R/W CAV24C02
1 0 1 0 A2 A1 a8 R/W CAV24C04
1 0 1 0 A2 a9 a8 R/W CAV24C08
1 0 1 0 a10 a9 a8 R/W CAV24C16
Figure 3. Slave Address Bits
BUS RELEASE DELAY (TRANSMITTER)
18
BUS RELEASE DELAY
(RECEIVER)
9
DATA OUTPUT
FROM TRANSMITTER
DATA OUTPUT
FROM RECEIVER
START
ACK DELAY (v tAA)
Figure 4. Acknowledge Timing
ACK SETUP (w tSU:DAT)
tF tHIGH
tR
tLOW
tLOW
SCL
tSU:STA
tHD:SDA
tHD:DAT
tSU:DAT
SDA IN
SDA OUT
tAA tDH
Figure 5. Bus Timing
tSU:STO
tBUF
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6

6 Page









CAV24C04 pdf, datenblatt
CAV24C02, CAV24C04, CAV24C08, CAV24C16
PACKAGE DIMENSIONS
WLCSP4, 0.84x0.86
CASE 567DC
ISSUE D
PIN A1
ÈÈÈÈREFERENCE
E
2X 0.10 C
AB
D
2X 0.10 C TOP VIEW
* Die Coat
(Optional)
A3*
DETAIL A
0.10 C
A2
A
DETAIL A
0.05 C
NOTE 4
A1
SIDE VIEW
C
SEATING
PLANE
NOTE 3
A2
A
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DATUM C, THE SEATING PLANE, IS DEFINED BY
THE SPHERICAL CROWNS OF THE CONTACT
BALLS.
4. COPLANARITY APPLIES TO SPHERICAL CROWNS
OF THE CONTACT BALLS.
5. DIMENSION b IS MEASURED AT THE MAXIMUM
CONTACT BALL DIAMETER PARALLEL TO DATUM C.
MILLIMETERS
DIM MIN MAX
A 0.28 0.38
A1 0.08 0.12
A2 0.23 REF
A3* 0.025 REF
b 0.16 0.20
D 0.84 BSC
E 0.86 BSC
e 0.40 BSC
* Die Coat (Optional)
4X b
0.10 M C A B
NOTE 5
e
B
A
12
BOTTOM VIEW
e
RECOMMENDED
SOLDERING FOOTPRINT*
A1 PACKAGE
OUTLINE
0.40
PITCH
4X
0.18
0.40
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
www.onsemi.com
12

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