|
|
Teilenummer | WS1103 |
|
Beschreibung | CDMA Cell 3x3 Power Amplifier Module | |
Hersteller | AVAGO | |
Logo | ||
Gesamt 15 Seiten WS1103
CDMA Cell 3x3 Power Amplifier Module
(824-849 MHz)
Data Sheet
Description
The WS1103 is a CDMA(Code Division Multiple Access)
power amplifier module designed for handsets operat-
ing in the 824-849 MHz bandwidth.
The WS1103 features CoolPAM circuit technology that
offers state-of-the-art reliability, temperature stability
and ruggedness.
Digital mode control of CoolPAM reduces current
consumption, which enables extended talk time of
mobile devices.
The WS1103 meets stringent CDMA linearity
requirements to and beyond 28 dBm output power. The
3 mm x 3 mm form factor 8-pin surface mount package is
self contained, incorporating 50 ohm input and output
matching networks.
Functional Block Diagram
Features
• Excellent linearity
• Low quiescent current
• High efficiency
PAE at 28 dBm: 41.2%
PAE at 16 dBm: 17.7%
• 8-pin surface mounting package
3 mm x 3 mm x 1.0 mm
• Internal 50 ohm matching networks for both RF input
and output
• RoHS compliant
Applications
• Digital CDMA Cellular
• Wireless local loop
Order Information
Part Number
WS1103-TR1
WS1103-BLK
No. of Devices
1,000
100
Container
7”Tape and Reel
BULK
Vcc1 (1)
Vcc2 (8)
RF
INPUT
(2)
INPUT
MATCH
DA
INTER
STAGE
MATCH
PA
MMIC
BIAS CIRCUIT & CONTROL LOGIC
Vcont (3)
Vref (4)
OUTPUT
MATCH
MODULE
RF
OUTPUT
(7)
Free Datasheet http://www.datasheet4u.com/
Package Dimensions and Pin Descriptions
PIN 1 MARK
18
0.60
27
3 ± 0.1
36
45
0.15 x 45
0.80
3 ± 0.1
TOP VIEW
0.7 1.40
2.80
1.20
1.0 ± 0.1
SIDE VIEW
0.40
0.40
3.0
1.40
PIN DESCRIPTIONS
PIN #
1
2
3
4
5
6
7
8
NAME
Vcc1
RF In
Vcont
Vref
GND
GND
RF Out
Vcc2
DESCRIPTION
Supply Voltage
RF Input
Control Voltage
Reference Voltage
Ground
Ground
RF Output
Supply Voltage
R 0.10
X-RAY BOTTOM VIEW
0.40
Figure 8. Package dimensional drawing and pin descriptions (all dimensions are in millimeters)
PIN 1 MARK
1103
PYYWW
AAAAA
Figure 9. Marking specifications
Manufacturing Part Number
Lot Number
P
YY
WW
AAAAA
Manufacturing Info
Manufacturing Year
Work Week
Assembly Lot
Free Datasheet http://www.datasheet4u.com/
6 Page TP
TL
Tsmax
Tsmin
25
RAMP UP
tp
tL
ts
PREHEAT
RAMP DOWN
t 25°C TO PEAK
TIME
Figure 19. Typical SMT reflow profile for maximum temperature = 260 +0/-5°C
CRITICAL ZONE
TL TO TP
Table 7. Typical SMT Reflow Profile for Maximum Temperature = 260 +0/-5°C
Profile Feature
Average Ramp-Up Rate (TL to TP)
Preheat
- Temperature Min (Tsmin)
- Temperature Max (Tsmax)
- Time (Min to Max) (ts)
Tsmax to TL
- Ramp-Up Rate
Time Maintained Above:
- Temperature (TL)
- Time (TL)
Peak Temperature (Tp)
Time Within 5°C of Actual Peak Temperature (tp)
Ramp-Down Rate
Time 25°C to Peak Temperature
Sn-Pb Solder
3°C/sec max
100°C
150°C
60-120 sec
183°C
60-150 sec
240 +0/-5°C
10-30 sec
6°C /sec max
6 min max.
Pb-Free Solder
3°C/sec max
150°C
200°C
60-180 sec
3°C /sec max
217°C
60-150 sec
260 +0/-5°C
20-40 sec
6°C /sec max
8 min max.
12
Free Datasheet http://www.datasheet4u.com/
12 Page | ||
Seiten | Gesamt 15 Seiten | |
PDF Download | [ WS1103 Schematic.PDF ] |
Teilenummer | Beschreibung | Hersteller |
WS1102 | 3 x 3 Power Amplifier Module | AVAGO |
WS1102 | Electric energy meter | Iskra |
WS1102 | Drie fasen kWh meter | Alectryon |
WS1103 | CDMA Cell 3x3 Power Amplifier Module | AVAGO |
WS1105 | CDMA Cell 3x3 Power Amplifier Module | AVAGO |
Teilenummer | Beschreibung | Hersteller |
CD40175BC | Hex D-Type Flip-Flop / Quad D-Type Flip-Flop. |
Fairchild Semiconductor |
KTD1146 | EPITAXIAL PLANAR NPN TRANSISTOR. |
KEC |
www.Datenblatt-PDF.com | 2020 | Kontakt | Suche |