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ACPM-7355 Schematic ( PDF Datasheet ) - AVAGO

Teilenummer ACPM-7355
Beschreibung Power Amplifier Module
Hersteller AVAGO
Logo AVAGO Logo 




Gesamt 19 Seiten
ACPM-7355 Datasheet, Funktion
ACPM-7355
UMTS Dual-Band 4x5mm Power Amplifier Module
(Band2/Band5)
Data Sheet
Description
The ACPM-7355 is a dual-band PAM (Power Amplifier
Module) designed for UMTS Band2 and Band5. The ACPM-
7355 meets stringent UMTS linearity requirements. The
4mmx5mm form factor 14-pin surface mount package
is self contained, incorporating 50ohm input and output
matching networks
The ACPM-7355 features 5th generation of CoolPAM
circuit technology which supports 3 modes – bypass, mid
and high power modes. The CoolPAM is stage bypass
technology which enables power amplifier to lower
power consumption. Active bypass feature is added to
5th generation to enhance power added efficiency at low
output range and this technology extends talk time of
mobiles more by further saving power amplifier’s current
consumption.
The power amplifier is manufactured on an advanced
InGaP HBT (hetero-junction Bipolar Transistor) MMIC
(microwave monolithic integrated circuit) technology
offering state-of-the-art reliability, temperature stability
and ruggedness.
The Module is housed in a cost effective, small and thin
4x5mm package.
Features
x Dual-Band PA (Band2 and Band5)
x Small Size (4x5mm)
x Thin Package (1.0mm typ)
x Excellent Linearity
x 3-mode power control
x Bypass / Mid Power Mode / High Power Mode
High Efficiency at max output power
x 14-pin surface mounting package
x Internal 50ohm matching networks for both RF input
and output
x Lead-free, RoHS compliant, Green
Applications
x UMTS Band2 and Band5
Ordering Information
Part Number
ACPM-7355-TR1
ACPM-7355-BLK
Number of
Devices
1000
100
Container
178mm (7”) Tape/Reel
Bulk
Block Diagram
Bypass
Circuit
Impedance
Transformer
RFin_LB
Vcc1
Ven_LB
Ven_HB
Input Match &
Power Divider
Bias Circuit & Control Logic
Output
Match
RFout_LB
Vcc2
Vmode
Vbp
RFin_HB
Input Match &
Power Divider
Output
Match
RFout_HB
Bypass
Circuit
Impedance
Transformer
Free Datasheet http://www.datasheet4u.com/






ACPM-7355 Datasheet, Funktion
Characteristics Data of Band5
(Vcc = 3.4V, Ven_Low = 2.6, Vbp, Vmode = 0V or 2.6V, T = 25°C, Zin/Zout = 50ohm, Rel99)
500
450 824MHz, 3.4V
400 837MHz, 3.4V
350 847MHz, 3.4V
300
250
200
150
100
50
0
-5 0 5 10 15 20 25 30
Pout (dBm)
Total Current vs. Output Power
35
824MHz, 3.4V
30 837MHz, 3.4V
25 847MHz, 3.4V
20
15
10
5
0
-5 0 5
Gain vs. Output Power
10 15 20 25 30
Pout (dBm)
-30
824MHz, 3.4V
-35 837MHz, 3.4V
847MHz, 3.4V
-40
-45
-50
-55
-60
-5 0 5 10 15 20 25 30
Pout (dBm)
Adjacent Channel Power Ratio 1 vs. Output Power
-40
824MHz, 3.4V
-45 837MHz, 3.4V
847MHz, 3.4V
-50
-55
-60
-65
-70
-5 0 5 10 15 20 25 30
Pout (dBm)
Adjacent Channel Power Ratio 2 vs. Output Power
50
45 824MHz, 3.4V
40 837MHz, 3.4V
35 847MHz, 3.4V
30
25
20
15
10
5
0
-5 0 5 10 15 20 25 30
Pout (dBm)
Power Added Efficiency vs. Output Power
6
Free Datasheet http://www.datasheet4u.com/

6 Page









ACPM-7355 pdf, datenblatt
Metallization
0.60
0.40
0.50
0.73
0.25
Solder Mask Opening
0.70
0.50
0.33
ø 0.3 Via
on 0.6 pitch
0.55
2.30
0.73
2.40
Solder Paste Stencil Aperture
0.60 0.50
0.40
2.10
0.73
2.00
12
PCB Design Guidelines
The recommended PCB land pattern is shown in figures
on the left side. The substrate is coated with solder mask
between the I/O and conductive paddle to protect the
gold pads from short circuit that is caused by solder
bleeding/bridging.
Stencil Design Guidelines
A properly designed solder screen or stencil is required
to ensure optimum amount of solder paste is deposited
onto the PCB pads.
The recommended stencil layout is shown here. Reducing
the stencil opening can potentially generate more voids.
On the other hand, stencil openings larger than 100% will
lead to excessive solder paste smear or bridging across
the I/O pads or conductive paddle to adjacent I/O pads.
Considering the fact that solder paste thickness will
directly affect the quality of the solder joint, a good choice
is to use laser cut stencil composed of 0.100mm(4mils) or
0.127mm(5mils) thick stainless steel which is capable of
producing the required fine stencil outline.
Free Datasheet http://www.datasheet4u.com/

12 Page





SeitenGesamt 19 Seiten
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