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PDF ACPM-7331-TR1 Data sheet ( Hoja de datos )
| Número de pieza | ACPM-7331-TR1 | |
| Descripción | Power Amplifier Module | |
| Fabricantes | AVAGO | |
| Logotipo |  |
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ACPM-7331-TR1
UMTS1900 4x4 Power Amplifier
(1850-1910MHz)
Data Sheet
Description
The ACPM-7331, a Wide-band Code Division Multiple
Access(WCDMA) Power Amplifier (PA), is a fully matched
10-pin surface mount module developed for WCDMA
handset applications. This power amplifier module is
developed to cover 1850-1910MHz bandwidth. The
ACPM-7331 meets the stringent WCDMA linearity require-
ments for output power of up to 28.5dBm. The ACPM-
7331 is also developed to meet HSDPA specs.
The ACPM-7331 is designed to enhance the efficiency at
low and medium output power range by using 3-mode
control scheme with 2 mode control pins. This provides
extended talk time.
The ACPM-7331 is self contained, incorporating 50ohm
input and output matching networks.
Order information
Part Number
ACPM-7331-TR1
ACPM-7331-BLKR
No. of Devices
1000
100
Container
7”Tape and Reel
BULK
Features
• Excellent Linearity
• Low quiescent current
• High Efficiency
PAE at 28.5dBm: 33.2%
PAE at 16dBm: 16.1%
PAE at 8dBm: 6%
• 10-pin surface mounting package
4mmx4mmx1.1mm(typ)
• Internal 50ohm matching networks for both RF input
and output
• RoHS Compliant
Applications
• WCDMA Handset (HSDPA)
Functional Block Diagram
Vcc2(10)
RF Input
(2)
Vcc1 (1)
MMIC
Input
Match
Inter
DA Stage
Match
Bias Circuit & Control Logic
PA
Output
Match
RF Output
(8)
TR Switch
Vmode1
Vmode0
Ven
MODULE
Free Datasheet http://www.datasheet4u.com/
1 page  
Characteristics Data (WCDMA, Vcc=3.4V, Ven=2.6V, T=25°C, Zin/Zout=50ohm)
650
600
550
500
450 185GHz
400 188GHz
350 191GHz
300
250
200
150
100
50
0
-10 -5 0 5 10 15 20 25 30
Pout (dBm)
35
30
185GHz
25 188GHz
191GHz
20
15
10
5
-10 -5 0 5 10 15 20 25 30
Pout (dBm)
Figure 1. Total Current vs. Output Power
Figure 2. Gain vs. Output Power
45
40
35
185GHz
30 188GHz
25 191GHz
20
15
10
5
0
-10 -5 0 5 10 15 20 25 30
Pout (dBm)
-30
-35
-40
-45
-50
-55
-60
-65
-10
-5
185GHz
188GHz
191GHz
0 5 10 15 20 25 30
Pout (dBm)
Figure 3. Power Added Efficiency vs. Output Power
Figure 4. Adjacent Channel Leakage Ratio 1 vs. Output Power
-40
-45
185GHz
-50 188GHz
191GHz
-55
-60
-65
-70
-10 -5 0 5 10 15 20 25
Pout (dBm)
Figure 5. Adjacent Channel Leakage Ratio 2 vs. Output Power
30
Free Datasheet http://www.datasheet4u.com/
5 Page 
PCB Design Guidelines
The recommended ACPM-7331 PCB land pattern is shown
in Figure 18 and Figure 19. The substrate is coated with
solder mask between the I/O and conductive paddle to
protect the gold pads from short circuit that is caused by
solder bleeding/bridging.
0.4
0.6
0.1
Stencil Design Guidelines
A properly designed solder screen or stencil is required
to ensure optimum amount of solder paste is deposited
onto the PCB pads. The recommended stencil layout is
shown in Figure 20. Reducing the stencil opening can po-
tentially generate more voids. On the other hand, stencil
openings larger than 100% will lead to excessive solder
paste smear or bridging across the I/O pads or conduc-
tive paddle to adjacent I/O pads. Considering the fact
that solder paste thickness will directly affect the quality
of the solder joint, a good choice is to use laser cut stencil
composed of 0.10mm(4mils)or 0.127mm(5mils) thick
stainless steel which is capable of producing the required
fine stencil outline.
0.85
0.25
Figure 18. Metallization
0.7
0.5
0.5
Ø 0.3mm
on 0.6mm pitch
0.55
1.8
0.85
2.4
Figure 19. Solder Mask Opening
0.6
0.4
0.5
1.6
0.85
2.0
Figure 20. Solder Paste Stencil Aperture
11
Free Datasheet http://www.datasheet4u.com/
11 Page | ||
| Páginas | Total 18 Páginas | |
| PDF Descargar | [ Datasheet ACPM-7331-TR1.PDF ] | |
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