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PDF ACPM-5013 Data sheet ( Hoja de datos )
| Número de pieza | ACPM-5013 | |
| Descripción | Power Amplifier Module | |
| Fabricantes | AVAGO | |
| Logotipo |  |
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ACPM-5013
3 x 3 mm Power Amplifier Module
LTE Band13/14 (777-798 MHz)
Data Sheet
Description
The ACPM-5013 is a fully matched 10-pin surface mount
module developed for LTE Band 13 and Band 14, operating
in the 777-798 MHz bandwidth. The ACPM-5013 meets
stringent LTE linearity requirements up to 27.5 dBm output
power (MPR = 0 dB). The 3 x 3 mm form factor package is
self contained, incorporating 50 ohm input and output
matching networks. The PA also contains internal DC
blocking capacitors for RF input and output ports.
The ACPM-5013 features 5th generation of CoolPAM
(CoolPAM5) circuit technology which supports 3 power
modes – bypass, mid and high power modes. The CoolPAM
is stage bypass technology enhancing PAE (power added
efficiency) at low and medium power range. The active
bypass feature is added to CoolPAM5 to enhance the PAE
further at low output range and it enables the PA to have
exceptionally low quiescent current. It dramatically saves
the average power consumption and accordingly extends
the talk time of mobiles and prolongs a battery life.
A directional coupler is integrated into the module and
both coupling and isolation ports are available exter-
nally, supporting daisy chain. The integrated coupler
has excellent coupler directivity, which minimizes the
coupled output power variation or delivered power
variation caused by the load mismatch from the antenna.
The coupler directivity, or the output power variation into
the mismatched load, is critical to the TRP and SAR per-
formance of the mobile phones in real field operations as
well as compliance tests for the system specifications.
The ACPM-5013 has integrated on-chip Vref and on-
module bias switch as the one of the key features of the
CoolPAM-5, so an external constant voltage source is not
required, eliminating the external LDO regulators and
switches from circuit boards of mobile devices. It also
makes the PA fully digital-controllable by the Ven pin that
simply turns the PA on and off from the digital control logic
input from baseband chipsets. All of the digital control
input pins such as the Ven, Vmode and Vbp are fully CMOS
Features
x Thin Package (0.9 mm typ)
x Excellent Linearity
x Compliant with 3GPP Public Safety Band Emission
(NS_07) Spec
x 3-mode power control with Vbp and Vmode
x Bypass / Mid Power Mode / High Power Mode
x High Efficiency at max output power
x 10-pin surface mounting package
x Internal 50 ohm matching networks for both RF input
and output
x Integrated coupler
x Coupler and Isolation ports for daisy chain
x Lead-free, RoHS compliant, Green
Applications
x LTE Band13 / Band 14 Handset and Data Card
Ordering Information
Part Number
ACPM-5013-TR1
Number of Devices
1000
ACPM-5013-BLK 100
Container
178mm (7”)
Tape/Reel
Bulk
Description( Cont.)
compatible and can operate down to the 1.35 V logic. The
current consumption by digital control pins is negligible.
The power amplifier is manufactured on an advanced
InGaP HBT (hetero-junction Bipolar Transistor) MMIC
(microwave monolithic integrated circuit) technology
offering state-of-the-art reliability, temperature stability
and ruggedness.
Free Datasheet http://www.datasheet4u.com/
1 page  
Footprint
All dimensions are in millimeter
0.10 1.50
Pin 1
2.80
0.25
0.3 0.10
X-Ray Top View
0.125
0.60
0.35
0.35
PIN Descriptions
Pin # Name
1 Vcc1
2 RFin
3 Vbp
4 Vmode
5 Ven
6 CPL
7 GND
8 ISO
9 RFOut
10 Vcc2
Description
DC Supply Voltage
RF Input
Bypass Control
Mode Control
PA Enable
Coupling port of Coupler
Ground
Isolation port of Coupler
RF Out
DC Supply Voltage
5
Free Datasheet http://www.datasheet4u.com/
5 Page 
Handling and Storage
ESD (Electrostatic Discharge)
Electrostatic discharge occurs naturally in the environ-
ment. With the increase in voltage potential, the outlet of
neutralization or discharge will be sought. If the acquired
discharge route is through a semiconductor device,
destructive damage will result.
ESD countermeasure methods should be developed and
used to control potential ESD damage during handling in
a factory environment at each manufacturing site.
MSL (Moisture Sensitivity Level)
Plastic encapsulated surface mount package is sensitive to
damage induced by absorbed moisture and temperature.
Avago Technologies follows JEDEC Standard J-STD 020B.
Each component and package type is classified for
moisture sensitivity by soaking a known dry package at
various temperatures and relative humidity, and times.
After soak, the components are subjected to three con-
secutive simulated reflows.
The out of bag exposure time maximum limits are deter-
mined by the classification test describe below which cor-
responds to a MSL classification level 6 to 1 according to
the JEDEC standard IPC/JEDEC J-STD-020B and J-STD-033.
ACPM-5013 is MSL3. Thus, according to the J-STD-033
p.11 the maximum Manufacturers Exposure Time (MET)
for this part is 168 hours. After this time period, the part
would need to be removed from the reel, de-taped and
then re-baked. MSL classification reflow temperature for
the ACPM-5013 is targeted at 260°C +0/-5°C. Figure and
table on next page show typical SMT profile for maximum
temperature of 260 +0/-5°C.
Moisture Classification Level and Floor Life
MSL Level
1
Floor Life (out of bag) at factory ambient =< 30°C/60% RH or as stated
Unlimited at =< 30°C/85% RH
2 1 year
2a 4 weeks
3 168 hours
4 72 hours
5 48 hours
5a 24 hours
6 Mandatory bake before use. After bake, must be reflowed within the time limit specified on the label
Note :
1. The MSL Level is marked on the MSL Label on each shipping bag.
11
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11 Page | ||
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