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PDF PESD1CAN Data sheet ( Hoja de datos )
| Número de pieza | PESD1CAN | |
| Descripción | CAN bus ESD protection diode | |
| Fabricantes | NXP Semiconductors | |
| Logotipo |  |
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PESD1CAN
CAN bus ESD protection diode
Rev. 04 — 15 February 2008
Product data sheet
1. Product profile
1.1 General description
PESD1CAN in a small SOT23 (TO-236AB) Surface-Mounted Device (SMD) plastic
package designed to protect two automotive Controller Area Network (CAN) bus lines
from the damage caused by ElectroStatic Discharge (ESD) and other transients.
1.2 Features
I Due to the integrated diode structure only one small SOT23 package is needed to
protect two CAN bus lines
I Max. peak pulse power: PPP = 200 W at tp = 8/20 µs
I Low clamping voltage: VCL = 40 V at IPP = 1 A
I Ultra low leakage current: IRM < 1 nA
I Typ. diode capacitance matching: ∆Cd/Cd = 0.1 %
I ESD protection up to 23 kV
I IEC 61000-4-2, level 4 (ESD)
I IEC 61000-4-5 (surge); IPP = 3 A at tp = 8/20 µs
I Small SMD plastic package
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1.3 Applications
I CAN bus protection
I Automotive applications
1.4 Quick reference data
Table 1. Quick reference data
Tamb = 25 °C unless otherwise specified.
Symbol Parameter
Conditions
Per diode
VRWM
Cd
reverse standoff voltage
diode capacitance
f = 1 MHz; VR = 0 V
Min Typ Max Unit
- - 24 V
- 11 17 pF
datasheet
p
1 page  
NXP Semiconductors
PESD1CAN
CAN bus ESD protection diode
104
PPP
(W)
103
006aaa257
1.2
PPP
PPP(25°C)
0.8
001aaa193
102 0.4
10
1
10 102 103 104
tp (µs)
Tamb = 25 °C
Fig 3. Peak pulse power as a function of exponential
pulse duration; typical values
0
0 50 100 150 200
Tj (°C)
Fig 4. Relative variation of peak pulse power as a
function of junction temperature; typical values
20
Cd
(pF)
16
006aaa258
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IPP
12
IR
−VCL −VBR −VRWM
IRM
−IRM
VRWM VBR VCL
8 −IR
4
0
0 5 10 15 20 25
VR (V)
f = 1 MHz; Tamb = 25 °C
Fig 5. Diode capacitance as a function of reverse
voltage; typical values
−
−IPP
+
006aaa676
Fig 6. V-I characteristics for a bidirectional ESD
protection diode
PESD1CAN_4
Product data sheet
Rev. 04 — 15 February 2008
© NXP B.V. 2008. All rights reserved.
5 of 12
datasheet pdf - http://www.DataSheet4U.net/
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NXP Semiconductors
PESD1CAN
CAN bus ESD protection diode
12. Legal information
12.1 Data sheet status
Document status[1][2]
Product status[3]
Objective [short] data sheet Development
Preliminary [short] data sheet Qualification
Product [short] data sheet
Production
Definition
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
12.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
12.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
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Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
12.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
13. Contact information
For additional information, please visit: http://www.nxp.com
For sales office addresses, send an email to: [email protected]
PESD1CAN_4
Product data sheet
Rev. 04 — 15 February 2008
© NXP B.V. 2008. All rights reserved.
11 of 12
datasheet pdf - http://www.DataSheet4U.net/
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