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PDF ADMP441 Data sheet ( Hoja de datos )
| Número de pieza | ADMP441 | |
| Descripción | Omnidirectional Microphone | |
| Fabricantes | Analog Devices | |
| Logotipo |  |
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Data Sheet
Omnidirectional Microphone with
Bottom Port and I2S Digital Output
ADMP441
FEATURES
Digital I²S interface with high precision 24-bit data
High SNR of 61 dBA
High sensitivity of −26 dBFS
Flat frequency response from 60 Hz to 15 kHz
Low current consumption of 1.4 mA
High PSR of −75 dBFS
Small 4.72 mm × 3.76 mm × 1 mm surface-mount package
Compatible with Sn/Pb and Pb-free solder processes
RoHS/WEEE compliant
APPLICATIONS
Teleconferencing systems
Gaming consoles
Mobile devices
Laptops
Tablets
Security systems
GENERAL DESCRIPTION
The ADMP4411 is a high performance, low power, digital output,
omnidirectional MEMS microphone with a bottom port. The
complete ADMP441 solution consists of a MEMS sensor, signal
conditioning, an analog-to-digital converter, antialiasing filters,
power management, and an industry standard 24-bit I2S inter-
face. The I2S interface allows the ADMP441 to connect directly
to digital processors, such as DSPs and microcontrollers, with-
out the need for an audio codec in the system.
FUNCTIONAL BLOCK DIAGRAM
ADMP441
ADC
FILTER
POWER
HARDWARE
MANAGEMENT CONTROL
I2S
SERIAL
PORT
SCK
SD
WS
Figure 1.
BOTTOM
TOP
Figure 2. Isometric Views of ADMP441 Microphone Package
http://www.DataSheet4U.net/ The ADMP441 has a high SNR and high sensitivity, making it
an excellent choice for far field applications. The ADMP441 has
a flat wideband frequency response, resulting in natural sound
with high intelligibility. A built-in particle filter provides high
reliability.
The ADMP441 is available in a thin 4.72 mm × 3.76 mm ×
1 mm surface-mount package. It is reflow solder compatible
with no sensitivity degradation. The ADMP441 is halide free.
1 Protected by U.S. Patents 7,449,356; 7,825,484; 7,885,423; and 7,961,897. Other patents are pending.
Rev. A
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarksandregisteredtrademarksarethepropertyoftheirrespectiveowners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700
www.analog.com
Fax: 781.461.3113 ©2011–2012 Analog Devices, Inc. All rights reserved.
datasheet pdf - http://www.DataSheet4U.net/
1 page  
Data Sheet
ABSOLUTE MAXIMUM RATINGS
Table 4.
Parameter
Supply Voltage (VDD)
Sound Pressure Level
Mechanical Shock
Vibration
Operating Temperature Range
Digital Pin Input Voltage
Rating
−0.3 V to +3.6 V
160 dB
10,000 g
Per MIL-STD-883 Method
2007, Test Condition B
−40°C to +85°C
−0.3 V to VDD + 0.3 V or 3.6 V,
whichever is less
ADMP441
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION
TP
TL TSMAX
TSMIN
RAMP-UP
tP
CRITICAL ZONE
TL TO TP
tL
tS
PREHEAT
http://www.DataSheet4U.net/
RAMP-DOWN
t25°C TO PEAK
TIME
Figure 4. Recommended Soldering Profile Limits
Table 5. Recommended Soldering Profile Limits
Profile Feature
Average Ramp Rate (TL to TP)
Preheat
Minimum Temperature (TSMIN)
Maximum Temperature (TSMAX)
Time (TSMIN to TSMAX), tS
Ramp-Up Rate (TSMAX to TL)
Time Maintained Above Liquidous (tL)
Liquidous Temperature (TL)
Peak Temperature (TP)
Time Within 5°C of Actual Peak Temperature (tP)
Ramp-Down Rate
Time 25°C (t25°C) to Peak Temperature
Sn63/Pb37
1.25°C/sec max
100°C
150°C
60 sec to 75 sec
1.25°C/sec
45 sec to 75 sec
183°C
215°C +3°C/−3°C
20 sec to 30 sec
3°C/sec max
5 minute max
Pb-Free
1.25°C/sec max
100°C
200°C
60 sec to 75 sec
1.25°C/sec
~50 sec
217°C
260°C +0°C/−5°C
20 sec to 30 sec
3°C/sec max
5 minute max
Rev. A | Page 5 of 16
datasheet pdf - http://www.DataSheet4U.net/
5 Page 
Data Sheet
ADMP441
APPLICATIONS INFORMATION
POWER SUPPLY DECOUPLING
For best performance and to avoid potential parasitic artifacts,
placing a 0.1 μF ceramic type X7R or better capacitor between
Pin 7 (VDD) and ground is strongly recommended. The
capacitor should be placed as close to Pin 7 as possible.
The connections to each side of the capacitor should be as short
as possible, and the trace should stay on a single layer with no
vias. For maximum effectiveness, locate the capacitor equidistant
from the power and ground pins or, when equidistant placement
is not possible, slightly closer to the power pin. Thermal connec-
tions to the ground planes should be made on the far side of the
capacitor, as shown in Figure 14.
VDD GND
CAPACITOR
TO VDD
TO GND
Figure 14. Recommended Power Supply Bypass Capacitor Layout
HANDLING INSTRUCTIONS
Pick-and-Place Equipment
The MEMS microphone can be handled using standard pick-
and-place and chip shooting equipment. Care should be taken
to avoid damage to the MEMS microphone structure as follows:
• Use a standard pickup tool to handle the microphone.
Because the microphone hole is on the bottom of the
package, the pickup tool can make contact with any part
of the lid surface.
• Use care during pick-and-place to ensure that no high
shock events above 10,000 g are experienced because such
events may cause damage to the microphone.
• Do not pick up the microphone with a vacuum tool that
makes contact with the bottom side of the microphone.
Do not pull air out of or blow air into the microphone port.
• Do not use excessive force to place the microphone on
the PCB.
Reflow Solder
For best results, the soldering profile should be in accordance
with the recommendations of the manufacturer of the solder
paste used to attach the MEMS microphone to the PCB. It is
recommended that the solder reflow profile does not exceed the
limit conditions specified in Figure 4 and Table 5.
Board Wash
When washing the PCB, ensure that water does not make
contact with the microphone port. Blow-off procedures and
ultrasonic cleaning must not be used.
SUPPORTING DOCUMENTATION
Evaluation Board User Guide
UG-303, EVAL-ADMP441Z-FLEX: Bottom-Port I2S Output
MEMS Microphone Evaluation Board
Circuit Note
CN-0208, High Performance Digital MEMS Microphone's Simple
Interface to SigmaDSP Audio Processor with I2S Output
Application Noteshttp://www.DataSheet4U.net/
AN-1112 Application Note, Microphone Specifications and
Terms Explained
AN-1003 Application Note, Recommendations for Mounting and
Connecting Analog Devices, Inc., Bottom-Ported MEMS
Microphones
AN-1068 Application Note, Reflow Soldering of the MEMS
Microphone
AN-1124 Application Note, Recommendations for Sealing
Analog Devices, Inc., Bottom-Port MEMS Microphones from
Dust and Liquid Ingress
For additional information, visit www.analog.com/mic.
Rev. A | Page 11 of 16
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| PDF Descargar | [ Datasheet ADMP441.PDF ] | |
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