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W987D2HB Schematic ( PDF Datasheet ) - Winbond

Teilenummer W987D2HB
Beschreibung (W987D2HB / W987D6HB) 128Mb Mobile LPSDR
Hersteller Winbond
Logo Winbond Logo 




Gesamt 30 Seiten
W987D2HB Datasheet, Funktion
www.DataSheet.co.kr
W987D6HB / W987D2HB
128Mb Mobile LPSDR
TABLE OF CONTENTS
1. GENERAL DESCRIPTION ............................................................................................................. 4
2. FEATURES..................................................................................................................................... 4
3. PIN CONFIGURATION................................................................................................................... 5
3.1 Ball Assignment: LPSDR X 16 ............................................................................................................ 5
3.2 Ball Assignment: LPSDR X 32 ............................................................................................................ 5
4. PIN DESCRIPTION......................................................................................................................... 6
4.1 Signal Description ............................................................................................................................... 6
4.2 Addressing Table ................................................................................................................................ 6
5. BLOCK DIAGRAM ......................................................................................................................... 7
6. ELECTRICAL CHARACTERISTICS .............................................................................................. 8
6.1 Absolute Maximum Ratings................................................................................................................. 8
6.2 Operating Conditions .......................................................................................................................... 8
6.3 Capacitance ........................................................................................................................................ 8
6.4 DC Characteristics .............................................................................................................................. 9
6.5 Automatic Temperature Compensated Self Refresh Current Feature................................................ 11
6.6 AC Characteristics And AC Operating Conditions ............................................................................. 12
6.6.1 AC Characteristics....................................................................................................................................... 12
6.6.2 AC Test Condition ....................................................................................................................................... 13
6.6.3 AC Latency Characteristics ......................................................................................................................... 14
7. FUNCTION DESCRIPTION .......................................................................................................... 15
7.1 Command Function........................................................................................................................... 15
7.1.1Table 1. Truth Table ..................................................................................................................................... 15
7.1.2 Functional Truth Table ................................................................................................................................ 16
7.1.3 Function Truth Table for CKE ..................................................................................................................... 19
7.1.4 Bank Activate Command............................................................................................................................. 20
7.1.5 Bank Precharge Command......................................................................................................................... 20
7.1.6 Precharge All Command ............................................................................................................................. 20
7.1.7 Write Command .......................................................................................................................................... 20
7.1.8 Write with Auto Precharge Command......................................................................................................... 20
7.1.9 Read Command .......................................................................................................................................... 20
7.1.10 Read with Auto Precharge Command ...................................................................................................... 20
7.1.11 Extended Mode Register Set Command .................................................................................................. 20
7.1.12 Mode Register Set Command................................................................................................................... 21
7.1.13 No-Operation Command ........................................................................................................................... 21
7.1.14 Burst Stop Command ................................................................................................................................ 21
7.1.15 Device Deselect Command....................................................................................................................... 21
7.1.16 Auto Refresh Command............................................................................................................................ 21
7.1.17 Self Refresh Entry Command ................................................................................................................... 21
7.1.18 Self Refresh Exit Command...................................................................................................................... 21
7.1.19 Clock Suspend Mode Entry/Power Down Mode Entry Command ............................................................ 21
7.1.20 Clock Suspend Mode Exit/Power Down Mode Exit Command................................................................. 21
-1-
Publication Release Date: Jun. 09, 2011
Revision A01-002
Datasheet pdf - http://www.DataSheet4U.net/






W987D2HB Datasheet, Funktion
www.DataSheet.co.kr
W987D6HB / W987D2HB
128Mb Mobile LPSDR
4. PIN DESCRIPTION
4.1 Signal Description
BALL NAME
A [n : 0]
BA0, BA1
DQ0~DQ15 (×16)
DQ0~DQ31 (×32)
CS
RAS
FUNCTION
DESCRIPTION
Address
Multiplexed pins for row and column address.
A10 is Auto Precharge Select
Bank Select
Select bank to activate during row address latch time, or bank to
read/write during address latch time.
Data Input/ Output Multiplexed pins for data output and input.
Chip Select
Row
Address Strobe
Disable or enable the command decoder. When command
decoder is disabled, new command is ignored and previous
operation continues.
Command input. When sampled at the rising edge of the clock,
RAS , CAS and WE define the operation to be executed.
CAS
Column
Referred to RAS
Address Strobe
WE
UDQM / LDQM(x16)
DQM0 ~ DQM3 (x32)
Write Enable
I/O Mask
Referred to WE
The output buffer is placed at Hi-Z (with latency of 2 in CL=2, 3;)
when DQM is sampled high in read cycle. In write cycle, sampling
DQM high will block the write operation with zero latency
CLK
CKE
VDD
VSS
VDDQ
VSSQ
NC
Clock Inputs
Clock Enable
Power
Ground
Power for I/O
Buffer
Ground for
I/O Buffer
No Connection
System clock used to sample inputs on the rising edge of clock.
CKE controls the clock activation and deactivation. When CKE is
low, Power Down mode, Suspend mode or Self Refresh mode is
entered.
Power supply for input buffers and logic circuit inside DRAM.
Ground for input buffers and logic circuit inside DRAM.
Power supply separated from VDD, used for output buffers to
improve noise.
Separated ground from VSS, used for output buffers to improve
noise.
No connection
4.2 Addressing Table
ITEM
Number of banks
Bank address pins
Auto precharge pin
Row addresses
X16 Column addresses
Refresh count
Row addresses
x32 Column addresses
Refresh count
128 Mb
4
BA0,BA1
A10/AP
A0-A11
A0-A8
4K
A0-A11
A0-A7
4K
-6-
Publication Release Date: Jun. 09, 2011
Revision A01-002
Datasheet pdf - http://www.DataSheet4U.net/

6 Page









W987D2HB pdf, datenblatt
www.DataSheet.co.kr
W987D6HB / W987D2HB
6.6 AC Characteristics And AC Operating Conditions
6.6.1 AC Characteristics
*CL= CAS Latency; (Notes: 5,6,7)
128Mb Mobile LPSDR
PARAMETER
SYM
Ref/Active to Ref/Active
Command Period
Active to precharge
Command Period
Active to Read/Write
Command Delay Time
Read/Write(a) to
Read/Write(b)Command
Period
Precharge to Active
Command Period
Active(a) to Active(b)
Command Period
Write Recovery Time
Write-Recovery Time
(Last data to Read)
CLK Cycle Time
CLK High Level width
CLK Low Level width
Access Time from CLK
Output Data Hold Time
Output Data High
Impedance Time
Output Data Low
Impedance Time
CL * = 3
CL * = 2
CL * = 3
CL * = 2
CL * = 3
CL * = 2
Power Down Mode
Entry Time
Transition Time of CLK
(Rise and Fall)
Data-in Set-up Time
Data-in Hold Time
Address Set-up Time
Address Hold Time
CKE Set-up Time
CKE Hold Time
Command Set-up Time
tRC
tRAS
tRCD
tCCD
tRP
tRRD
tWR
tLDR
tCK
tCH
tCL
tAC
tOH
tHZ
tLZ
tSB
tT
tDS
tDH
tAS
tAH
tCKS
tCKH
tCMS
-6
MIN. MAX.
60
42 100000
18
1
18
12
15
1
6 1000
12 1000
2
2
5.4
6
2.5
5.4
6
1
06
0.3 1
1.5
1
1.5
1
1.5
1
1.5
-75
MIN. MAX.
72.5 -
50 100000
18 -
1-
18 -
15 -
15 -
1
7.5 1000
12 1000
2.5 -
2.5 -
- 5.4
-8
2.5 -
- 5.4
-6
1-
0 7.5
0.3 1.2
1.5 -
1-
1.5 -
1-
1.5 -
1-
1.5 -
UNIT
ns
ns
ns
CLK
ns
ns
ns
CLK
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
NOTE
8
8
8
8
8
8
7
7
- 12 -
Publication Release Date: Jun. 09, 2011
Revision A01-002
Datasheet pdf - http://www.DataSheet4U.net/

12 Page





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