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PDF 3068N Data sheet ( Hoja de datos )
| Número de pieza | 3068N | |
| Descripción | CXA3068N | |
| Fabricantes | Sony Corporation | |
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CXA3068N
L-band Down Converter for Satellite Tuner
Description
The CXA3068N is a monolithic IC to down-convert
the L-band (930 to 2150 MHz) signal for the satellite
broadcasting receiver. It has a double-balanced
mixer, local oscillator circuit and IF amplifier on chip.
16 pin SSOP (Plastic)
Features
• Balance-type Colpitts oscillator circuit provides a
stable and wide range oscillation.
Oscillation frequency : 2.63 GHz
• Small leak of the local oscillation signal due to the
double-balanced mixer.
• Oscillation frequency drift is small, caused by the
change of impedance at the pre-stage of RF input.
• Local oscillator output circuit for PLL.
• Single 5 V power supply operation.
• Low current consumption. ICC=53 mA (typ.)
• 16-pin SSOP package contributes to reduction in
set size.
Applications
• Satellite broadcasting tuners for BS, CS, DSS and
DVB. (Frequency conversion to the second IF)
Absolute Maximum Ratings (Ta=25 °C)
• Supply voltage
VCC –0.3 to +5.5 V
• Storage temperature
Tstg –55 to +150 °C
• Allowable power dissipation
PD 625 mW
(When mounted on board)
Operating Conditions
• Supply voltage
• Ambient temperature
VCC 4.75 to 5.3 V
Topr –20 to 75 °C
Structure
Bipolar silicon monolithic IC
Block Diagram and Pin Configuration
16 15
14 13 12 11 10
9
OSC
BUFF
IF AMP
MIX
12345678
Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by
any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the
operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits.
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CXA3068N
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Package Outline Unit : mm
16PIN SSOP (PLASTIC)
∗5.0 ± 0.1
16 9
A
+ 0.2
1.25 – 0.1
0.1
CXA3068N
1
+ 0.1
0.22 – 0.05
8
0.65 ± 0.12
+ 0.05
0.15 – 0.02
0.1 ± 0.1
0° to 10°
DETAIL A
NOTE: Dimension “∗” does not include mold protrusion.
SONY CODE
EIAJ CODE
JEDEC CODE
SSOP-16P-L01
SSOP016-P-0044
PACKAGE STRUCTURE
PACKAGE MATERIAL
LEAD TREATMENT
LEAD MATERIAL
PACKAGE WEIGHT
EPOXY RESIN
SOLDER / PALLADIUM
PLATING
COPPER / 42 ALLOY
0.1g
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11 Page | ||
| Páginas | Total 11 Páginas | |
| PDF Descargar | [ Datasheet 3068N.PDF ] | |
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