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PDF W2636A Data sheet ( Hoja de datos )
| Número de pieza | W2636A | |
| Descripción | DDR3 BGA Probe Adapter | |
| Fabricantes | Agilent(Hewlett-Packard) | |
| Logotipo | .gif "Agilent(Hewlett-Packard)"){kind=logo} |
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W2635A and W2636A DDR3 BGA Probe
Adapter for Infiniium Oscilloscopes
Data Sheet
Superior probing for DDR3 compliance test and debug
The Agilent Technologies' W2635A
and W2636A DDR3 BGA probe
adapters provide signal access to
the clock, strobe, data, address
and command signals of the DDR3
BGA package for making electrical
and timing measurements with an
Infiniium oscilloscope. The DDR3
JEDEC1 specification (JESD79-3C) is
defined at the DRAM ballout, and the
ballout is difficult to access. The BGA
probe adapter provides direct signal
access to the BGA package for true
compliance testing.
The W2635A and W2636A DDR3
BGA probe adapters are soldered in
between the DRAM and PC board
or DIMM raw card where the DRAM
would normally be soldered. They
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the DRAM footprint on the top side.
The BGA adapter passes the signals
from the memory controller chip and
DRAM directly to the top side of the
BGA probe adapter where they can be
accessed with oscilloscope probes.
Buried resistors placed at the signals
inside the BGA probe adapter
connect the probed signals to solder
pads designed to work with Agilent
InfiniiMax E2677A, N5381A, N5425A,
and N5426A differential solder-in
probe heads. These resistors isolate
the DDR3 signal and the probe
loading effect. This design minimizes
capacitive loading of the probe heads
and allows high-speed operation
without impact on signal integrity.
Probing at the right location is also
an important consideration for DDR3
measurement. Many designs have
vias or designed-in probe points, but
they do not always produce good
signal integrity. Probing at the wrong
location could cause signal reflection,
resulting in non-monotonic edges.
This will cause error in your tests
such as slew rate, setup and hold time
measurements.
When used with Agilent's U7231A
DDR3 compliance test application, the
BGA adapter provides a fast and easy
way to test, debug and characterize
your DDR3 designs. The tests covered
by the U7231A software are based on
the JEDEC (JESD79-3C) DDR3 SDRAM
Specification. The test application
offers a user-friendly setup wizard and
a comprehensive report that includes
margin analysis.
1 The JEDEC (Joint Electronic Device Engineering
Council) Solid State Technology Association is
a semiconductor engineering standardization
body of the Electronic Industries Alliance (EIA), a
trade association that represents all areas of the
electronic industry.
1 page  
DDR3 BGA probe adapters dimensions, pad numbering and location
W2635A-011 dimensions, pad numbering and location
Size Height = 13.97 mm (0.550 in)
Width = 12.192 mm (0.480 in)
Thickness = 1.575 mm (0.062 in)
Brings 20 signals to SMT pads for probing
Provides 12 GND pads (6 on either side of DDR3 BGA probe adapter)
75-ohm buried tip resistor
Pin #
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
Signal
GND
LDQS
LDQS#
GND
RAS
CAS
GND
ODT
CS0
GND
CS1
WE
GND
BA0
BA2
GND
www.DataSheet4U.com
Table 2. W2635A-011 pad numbering
Signal
GND
DQ1
DQ3
GND
DQ7
DQ5
GND
CK
CK#
GND
CKE
A10
GND
BA1
A12
GND
Pin #
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
5
5 Page 
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Revised: October 1, 2008
Product specifications and descriptions
in this document subject to change
without notice.
© Agilent Technologies, Inc. 2009
Printed in USA, June 1, 2009
5989-7643EN
11 Page | ||
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| PDF Descargar | [ Datasheet W2636A.PDF ] | |
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