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ABS2 Schematic ( PDF Datasheet ) - Diotech Company

Teilenummer ABS2
Beschreibung (ABS1 - ABS10) MINI SILICON SURFACE MOUNT BRIDGE RECTIFIER
Hersteller Diotech Company
Logo Diotech Company Logo 




Gesamt 2 Seiten
ABS2 Datasheet, Funktion
ABS1 THRU ABS10
MINI SILICON SURFACE MOUNT BRIDGE RECTIFIER
Reverse Voltage - 100 to 1000 Volts Forward Current - 1.0 Ampere
FEATURES
Ideal for printed circuit board
Reliable low cost construction technique
results in inexpensive product
High temperature soldering guaranteed :
260°C / 10 seconds / 0.375” ( 9.5mm )
lead length at 5 lbs., ( 2.3 kg ) tension
MECHANICAL DATA
Case : Molded Plastic
Epoxy : Device has UL flammability classification 94V-0
Mounting Position : Any
Marking : Type Number
ABS
0.136(3.45)
0.128(3.25)
0.161(4.1)
0.154(3.9)
0.028(0.7)
0.024(0.6)
0.20(5.1)
0.193(4.9)
0.028(0.7)
0.012(0.3)
DETAIL "A", SCALE=20/1
A
0.033(0.85)
0.026(0.65)
Dimensions in inches and (millimeters)
1
2
3
4
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25 C ambient temperature unless otherwise specified.
Single phase half-wave 60Hz,resistive or inductive load,for capacitive load current derate by 20%.
Characteristic
Symbol ABS1 ABS2 ABS4 ABS6 ABS8 ABS10 Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
VRRM
VRWM
VR
100 200 400 600 800 1000 V
RMS Reverse Voltage
VR(RMS) 70 140 280 420 560 700 V
Average
Rectified
Output
Current
-On
-On
glass-epoxy P.C.B.
aluminum substrate
IO
0.8
1.0
A
Non-Repetitive Peak Forward Surge Current 8.3ms
Single half sine-wave superimposed on rated load
(JEDEC Method)
I2t Rating for Fusing (t < 8.3ms)
IFSM
I2t
30 A
10 A2s
Forward Voltage per element
wwwPAet.DaRkaattReaedSvhDeerCesteB4UlCouc.ckrorienmngtVoltage
@IF = 0.4A
@TA = 25°C
@TA = 125°C
VFM
IRM
0.95 V
10
150
µA
Typical Junction Capacitance per leg (Note 2)
Cj
25 pF
Typical Thermal Resistance per leg (Note 1)
R JA
R JL
62.5
25
°C/W
Operating and Storage Temperature Range
Tj, TSTG
-55 to +150
°C
Note: 1. On aluminum suvstrate P.C.B. with an area of 0.8×0.8”(20×20mm) mounted on 0.05×0.05”(1.3×1.3mm) solder pad.
2. On glass epoxy P.C.B. mouted on 0.05×0.05”(1.3×1.3mm) pads.





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