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RE46C152 Schematic ( PDF Datasheet ) - Microchip Technology

Teilenummer RE46C152
Beschreibung CMOS Ionization Smoke Detector ASIC
Hersteller Microchip Technology
Logo Microchip Technology Logo 




Gesamt 12 Seiten
RE46C152 Datasheet, Funktion
www.DataSheet.in
R&E International
A Subsidiary of Microchip Technology Inc.
RE46C152
CMOS Ionization Smoke Detector ASIC with Interconnect, Timer Mode and Tone Select
Product Specification
General Description
Features
The RE46C152 is a low power CMOS ionization type
smoke detector IC. With few external components this
circuit will provide all the required features for an
ionization type smoke detector.
An internal oscillator strobes power to the smoke
detection circuitry for 10.5mS every 1.66 seconds to
keep standby current to a minimum. A check for a low
battery condition is performed every 40 seconds when
in standby. The Tone input allows for selection of a
temporal pattern or a 2/3 duty cycle continuous tone.
The temporal horn pattern supports the NFPA 72
emergency evacuation signal.
An interconnect pin allows multiple detectors to be
connected such that when one units alarms all units will
sound.
An internal 8 minute timer allows for a separate button
to be used for reduced sensitivity mode. Single button
operation for test and timer mode is also possible.
Although this device was designed for smoke detection
utilizing an ionization chamber it could be used in a
variety of security applications.
Utilizing low power CMOS technology the RE46C152
was designed for use in smoke detectors that comply
with Underwriters Laboratory Specification UL217 and
UL268.
>1500V ESD Protection (HBM) on all Pins
Guard Outputs for Ion Detector Input
+/-0.75pA Detect Input Current
Internal Reverse Battery Protection
Low Quiescent Current Consumption (<6.5uA)
16L PDIP
Internal Low Battery Detection
Power Up Low Battery Test
Interconnect up to 40 Detectors
Pin selectable horn patterns
8 Minute Timer for Sensitivity Control
Available in RoHS Compliant Pb Free Packaging.
Pin Configuration
TSTART
IO
TONE
TSTROBE
LED
VDD
RBIAS
FEED
1
2
3
4
5
6
7
8
16 GUARD2
15 DETECT
14 GUARD1
13 VSEN
12 OSCAP
11 HS
10 HB
9 VSS
ABSOLUTE MAXIMUM RATINGS
PARAMETER
Supply Voltage
Input Voltage Range Except FEED, IO
FEED Input Voltage Range
IO Input Voltage Range
Reverse Battery Time
Input Current except FEED
Operating Temperature
Storage Temperature
Maximum Junction Temperature
SYMBOL
VDD
Vin
Vinfd
Vio1
TRB
Iin
TA
TSTG
TJ
VALUE
15
-.3 to Vdd +.3
-10 to +22
-.3 to 17
5
10
-10 to 60
-55 to 125
150
UNITS
V
V
V
V
S
MA
°C
°C
°C
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are
stress ratings only and operation at these conditions for extended periods may affect device reliability.
This product utilizes CMOS technology with static protection; however proper ESD prevention procedures should be used
when handling this product. Damage can occur when exposed to extremely high static electrical charge.
© 2009 Microchip Technology Inc.
DS22175A-page 1






RE46C152 Datasheet, Funktion
www.DataSheet.in
RE46C152
CMOS Ionization Smoke Detector ASIC with Interconnect,
Timer Mode and Tone Select
Product Specification
R&E International
A Subsidiary of Microchip Technology Inc.
DEVICE DESCRIPTION and APPLICATION NOTES
Internal Timing – With external components as indicated on the application drawing the period of the oscillator is
nominally 1.67 seconds in standby. Every 1.66 seconds the detection circuitry is powered up for 10.5mS and the status
of the smoke comparator is latched. In addition every 40 seconds the LED driver is turned on for 10.5mS and the status
of the low battery comparator is latched. The smoke comparator status is not checked during the low battery test, during
the low battery horn warning chirp, or when the horn is on due to an alarm condition.
If an alarm condition is detected the oscillator period increases to 41.5mS.
Due to the low currents used in the oscillator the capacitor on pin 12 should be a low leakage type. Oscillator accuracy
will depend mainly on the tolerance of the RBIAS resistor and OSCAP capacitor.
Smoke Detection Circuit – The smoke comparator compares the ionization chamber voltage to a voltage derived from a
resistor divider across VDD. This divider voltage is available externally on pin 13 (VSEN). When smoke is detected this
voltage is internally increased by 130mV nominal to provide hysteresis and make the detector less sensitive to false
triggering.
Pin 13 (VSEN) can be used to modify the internal set point for the smoke comparator by use of external resistors to
VDD or VSS. Nominal values for the internal resistor divider are indicated on the block diagram. These internal resistor
values can vary by up to ±20% but the resistor matching should be <2% on any one device.
The guard amplifier and outputs are always active and will be within 50mV of the DETECT input to reduce surface
leakage. The guard outputs also allow for measurement of the DETECT input without loading the ionization chamber.
Low Battery Detection - An internal reference is compared to the voltage divided VDD supply. The battery can be
checked under load via the LED low side driver output since low battery status is latched at the end of the 10.5mS LED
pulse. A Transmission switch on VSEN prevents any interaction from external adjustment resistance during the low
battery test
LED Pulse – The LED is pulsed on for 10.5mS every 40S in standby. In alarm the LED is pulsed on for 10.5mS every
1S.
Interconnect – Pin 2 (IO) provides the capability to common many detectors in a single system. If a single unit goes into
alarm the IO pin is driven high. This high signal causes the interconnected units to alarm. The LED flashes every 1S for
10.5mS on the signaling unit and is inhibited on the units that are in alarm due to the IO signal. An internal sink device
on the IO pin helps to discharge the interconnect line. This charge dump device is active for 1 clock cycle after the unit
exits the alarm condition (1.67S).
The interconnect input has a 500mS nominal digital filter. This allows for interconnection to other types of alarms
(carbon monoxide for example) that may have a pulsed interconnect signal.
Testing – At power up all internal registers are reset. The low battery set point can be tested at power up by holding
FEED and OSCAP low at power up. HB will change state as VDD passes through the low battery set point. By holding
pin 12 (OSCAP) low the internal power strobe is active. Functional testing can be accelerated by driving pin 12 with a
4kHZ square wave however the 10.5mS strobe period must be maintained for proper operation of the analog circuitry.
Please refer to the timing diagrams.
Timer Mode – The transition of pin 1 (TSTART) from a high to low level initiates an eight minute timer. During this 8
minute period the open drain NMOS on pin 4 (TSTROBE) is strobed on with the internal clock. A resistor connected to
this pin could be used to modify the detector sensitivity for the timer period.
Horn Tone – Pin 3 selects the NFPA72 horn tone (high or floating) or the 2/3 duty cycle continuous tone (low). If this pin
is externally connected high, use a current limiting resistor from pin 3 to VDD.
Reverse Battery Protection – The RE46c152 internally limits the current from VSS to VDD in the event of accidental
polarity reversal. If an input is connected to VDD it should be done through a resistance of at least 1.5K to limit the
reverse current through this path.
© 2009 Microchip Technology Inc.
DS22175A-page 6

6 Page









RE46C152 pdf, datenblatt
www.DataSheet.in
RE46C152
CMOS Ionization Smoke Detector ASIC with Interconnect,
Timer Mode and Tone Select
Product Specification
R&E International
A Subsidiary of Microchip Technology Inc.
Information contained in this publication regarding device
applications and the like is provided only for your convenience and
may be superseded by updates. It is your responsibility to ensure
that your application meets with your specifications. MICROCHIP
MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY
KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL,
STATUTORY OR OTHERWISE, RELATED TO THE
INFORMATION, INCLUDING BUT NOT LIMITED TO ITS
CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY
OR FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip devices in
life support and/or safety applications is entirely at the buyer’s risk,
and the buyer agrees to defend, indemnify and hold harmless
Microchip from any and all damages, claims, suits, or expenses
resulting from such use. No licenses are conveyed, implicitly or
otherwise, under any Microchip intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, Accuron,
dsPIC, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro,
PICSTART, rfPIC, SmartShunt and UNI/O are registered
trademarks of Microchip Technology Incorporated in the U.S.A.
and other countries.
FilterLab, Hampshire, Linear Active Thermistor, MXDEV, MXLAB,
SEEVAL, SmartSensor and The Embedded Control Solutions
Company are registered trademarks of Microchip Technology
Incorporated in the U.S.A.
Analog-for-the-Digital Age, Application Maestro, CodeGuard,
dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,
ECONOMONITOR, FanSense, In-Circuit Serial Programming,
ICSP, ICEPIC, Mindi, MiWi, MPASM, MPLAB Certified logo,
MPLIB, MPLINK, mTouch, nanoWatt XLP, PICkit, PICDEM,
PICDEM.net, PICtail, PIC32 logo, PowerCal, PowerInfo,
PowerMate, PowerTool, REAL ICE, rfLAB, Select Mode, Total
Endurance, TSHARC, WiperLock and ZENA are trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
SQTP is a service mark of Microchip Technology Incorporated in
the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2009, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
© 2009 Microchip Technology Inc.
Microchip received ISO/TS-16949:2002 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California and
India. The Company’s quality system processes and procedures are for its
PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial
EEPROMs, microperipherals, nonvolatile memory and analog products. In
addition, Microchip’s quality system for the design and manufacture of
development systems is ISO 9001:2000 certified.
DS22175A-page 12

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