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EFL700A39 Schematic ( PDF Datasheet ) - ST Microelectronics

Teilenummer EFL700A39
Beschreibung EnFilm - rechargeable solid state lithium thin film battery
Hersteller ST Microelectronics
Logo ST Microelectronics Logo 




Gesamt 8 Seiten
EFL700A39 Datasheet, Funktion
www.DataSheet4U.com
EFL700A39
EnFilm™ - rechargeable solid state lithium thin film battery
Features
All solid-state
Ultra thin
Fast recharge
Long cycle life
RoHS compliant
UL file number: MH47669
Applications
Device is intended to be used in following
applications:
Sensors and sensor networks
Smart card
RF ID tags
Energy storage for energy harvesting devices
Non implantable medical applications
Backup power
Description
The EFL700A39 is a thin film rechargeable lithium
battery. The battery has a LiCoO2 cathode,
LiPON ceramic electrolyte and a lithium anode.
This device has a footprint of 25.4 x 25.4 mm.
EnFilm
®
EFL700A39
700µAh/3V9
Table 1. Device summary
Capacity
0.7 mAh
Vnominale
Vop
Rint
Ip
Dimension
3.9 V
3.6 to 4.2 V
100 ohm
10 mA
25.4 x 25.4 mm
Thickness
200 µm
April 2010
TM: EnFilm is a trademark of STMicroelectronics
Doc ID 17370 Rev 1
1/8
www.st.com
8






EFL700A39 Datasheet, Funktion
Recommendations for the soldering process
www.DataSheet4U.com
EFL700A39
6 Recommendations for the soldering process
Note:
The contact pads are solderable.
Solder on the light gray area. Do not solder on platinum area.
Most commercially available solder materials (lead or lead-free) can be used.
Soldering wires to the contact pads:
1. Use Cu or Au wire with a diameter no more than 80 µm, including the insulator.
2. Wet the wire with solder material first.
3. Bring the wire in contact with the pad and apply heat and a small pressure through a
thin foil of Teflon or mica until the solder melts (note: if the soldering iron is directly in
contact with the solder, the solder will attach to the soldering iron instead of the contact
pad).
4. Remove heat.
Soldering metal foil to the contact pads:
1. Use Cu, Au or Ni foil, the foil should be about 1 to 2 mm wide and no more than 50 µm
thick.
2. Wet one side of the foil with soldering material.
3. Put the foil on the contact pad and the solder is in contact with the pad.
4. Apply heat and a small pressure on the top side of the foil until the solder melts.
5. Remove heat.
Do not apply excess force on the contact.
Minimize the time of soldering process.
Do not overheat the contact, maximum temperature of the adjacent sealing area: 120 °C
To increase mechanical performance after soldering wires, deposit a drop of resin that
polymerizes on the soldered joint at room temperature (see Figure 6).
Figure 6. Using resin to improve mechnical performance with soldered wires.
Platinium area
Drop of resin
on pad
wires
Contact pad
Solder material
Sealing area
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